ENGCM-3P-ICORE-AM62X

Engicam i.Core-AM62x SO-DIMM system on module for AM623 and AM625 Arm Cortex-A53 1.4-GHz processors

ENGCM-3P-ICORE-AM62X

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Overview

The new i.Core AM62x system on module is based on the AM623 and AM625 processor device families, and the module is equipped to optimally take advantage of the 1-4 Arm® Cortex®-A53 CPU cores at up to 1.4-GHz and Cortex-M4F MCU co-processor at up to 400MHz. The cost-optimized module will offer up to Full HD (1080p, 60fps) display support and optional 3D graphics acceleration for use in a broad range of open-frame industrial HMI panels. Additionally, the extensive set of peripherals and optimized power architecture create a module well-suited for a broad range of industrial and automotive applications.

Features
  • 67.6 mm x 32.1 mm
  • SO-DIMM, 200 edge connector pins
  • 1-GB or 2-GB DDR4, min. 8-GB eMMC
  • 2x USB2.0, 2x on-board Gb Ethernet PHY, I2S audio
  • Pin-to-pin compatible with other modules with EDIMM 2.0 pinout definition
  • Linux Yocto, Android, CODESYS PROFINET device and controller software stacks
Arm-based processors
AM623 Internet of Things (IoT) and gateway SoC with Arm® Cortex®-A53-based object and gesture recognition AM625 Human-machine-interaction SoC with Arm® Cortex®-A53-based edge AI and full-HD dual display
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Photos courtesy of Engicam s.r.l.

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Evaluation board

ENGCM-3P-EDIMM-SK — Development kit for i.Core-AM62x SOM

Evaluation board

ENGCM-3P-ICORE-AM62X — i.Core-AM62x system on module based on AM623 and AM625 quad Arm Cortex-A53 1.4-GHz processors

TI's Standard Terms and Conditions for Evaluation Items apply.

Support & training

Third-party support
TI does not offer ongoing direct design support for this hardware. For support while working through your design, contact Engicam s.r.l..

Videos

Disclaimer

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