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OCTVO-3P-OSD62X

Octavo Systems OSD62x system-in-package for AM623 and AM625 Arm® Cortex®-A53 1.4-GHz processors

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OCTVO-3P-OSD62X

From: Octavo Systems
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Overview

The OSD62x SiP technology allows designers to build a smaller generation of a variety of products in the same applications where the AM62x device is commonly used, including: building automation, factory automation and control, IoT gateway, edgeAI, and HMI. The SiP integrates the low-power, high-performance MPU with other bare die to provide features that will differentiate these products and help bring them to market faster, instead of spending time getting the processor to function.

Features
  • 2 mm x 22 mm (-MI), 9 mm x 14 mm (-SO)
  • BGA package with 1-mm pitch (-MI), 0.5-mm pitch (-SO)
  • Up to 2GB DDR4 integrated, external eMMC and QSPI Flash
  • Passive components integrated in SiP (-MI and -SO versions)
  • PMIC, 4kB EEPROM, oscillators, and MCU co-processor integrated (-MI version only)
Arm-based processors
AM623 — Internet of Things (IoT) and gateway SoC with Arm® Cortex®-A53-based object and gesture recognition AM625 — Human-machine-interaction SoC with Arm® Cortex®-A53-based edge AI and full-HD dual display

 

Multi-channel ICs (PMICs)
TPS65219 — Integrated power management (PMIC) for Arm® Cortex®- A53 processors and FPGAs
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Evaluation board

OSD62X-MI — OSD62x maximum integration SiP for AM62x processors in 22 mm x 22 mm BGA package

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Evaluation board

OSD62X-SO — OSD62x size optimized SiP for AM62x processors in 9 mm x 14 mm BGA package

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TI's Standard Terms and Conditions for Evaluation Items apply.

Support & training

Third-party support
TI does not offer ongoing direct design support for this hardware. For support while working through your design, contact Octavo Systems.

Videos
Disclaimer

Certain information and resources (including links to non-TI sites) above may be provided by a third-party partner, and is included here merely for your convenience. TI is not the provider of, and is not responsible for, the content of such information and resources, and you should evaluate them carefully for your intended uses and on your own behalf. The inclusion of such information and resources here does not imply endorsement of any third-party company by TI, and shall not be construed as a warranty or representation regarding the suitability of any third-party products or services, either alone or in combination with any TI product or service.