Product details

Frequency (MHz) 20 Nonvolatile memory (kByte) 256 RAM (kByte) 18 ADC type 12-bit SAR Number of ADC channels 12 Number of GPIOs 74 Features Real-time clock UART 2 USB No Number of I2Cs 2 SPI 4 Number of comparator channels 12 Timers - 16-bit 4 Bootloader (BSL) UART Operating temperature range (°C) -40 to 85 Rating Catalog
Frequency (MHz) 20 Nonvolatile memory (kByte) 256 RAM (kByte) 18 ADC type 12-bit SAR Number of ADC channels 12 Number of GPIOs 74 Features Real-time clock UART 2 USB No Number of I2Cs 2 SPI 4 Number of comparator channels 12 Timers - 16-bit 4 Bootloader (BSL) UART Operating temperature range (°C) -40 to 85 Rating Catalog
LQFP (PZ) 100 256 mm² 16 x 16 NFBGA (ZCA) 113 49 mm² 7 x 7
  • Low supply voltage range: 1.8 V to 3.6 V
  • Ultra-low power consumption
    • Active mode (AM): All system clocks active: 270 µA/MHz at 8 MHz, 3.0 V, flash program execution (typical)
    • Standby mode (LPM3): Watchdog with crystal and supply supervisor operational, full RAM retention, fast wakeup: 1.8 µA at 2.2 V, 2.1 µA at 3.0 V (typical)
    • Shutdown real-time clock (RTC) mode (LPM3.5): Shutdown mode, active RTC with crystal: 1.1 µA at 3.0 V (typical)
    • Shutdown mode (LPM4.5): 0.3 µA at 3.0 V (typical)
  • Wake up from standby mode in 3 µs (typical)
  • 16-bit RISC architecture, extended memory, up to 20-MHz system clock
  • Flexible power-management system
    • Fully integrated LDO with programmable regulated core supply voltage
    • Supply voltage supervision, monitoring, and brownout
  • Unified clock system
    • FLL control loop for frequency stabilization
    • Low-power low-frequency internal clock source (VLO)
    • Low-frequency trimmed internal reference source (REFO)
    • 32-kHz crystals (XT1)
    • High-frequency crystals up to 32 MHz (XT2)
  • Four 16-bit timers with 3, 5, or 7 capture/compare registers
  • Two universal serial communication interfaces (USCIs)
    • USCI_A0 and USCI_A1 each support:
      • Enhanced UART supports automatic baud-rate detection
      • IrDA encoder and decoder
      • Synchronous SPI
    • USCI_B0 and USCI_B1 each support:
      • I2C
      • Synchronous SPI
  • Integrated 3.3-V power system
  • 12-bit analog-to-digital converter (ADC) with internal shared reference, sample-and-hold, and autoscan feature
  • Dual 12-bit digital-to-analog converters (DACs) with synchronization
  • Voltage comparator
  • Hardware multiplier supports 32-bit operations
  • Serial onboard programming, no external programming voltage needed
  • 6-channel internal DMA
  • RTC module with supply voltage backup switch
  • Device Comparison summarizes the available family members
  • Low supply voltage range: 1.8 V to 3.6 V
  • Ultra-low power consumption
    • Active mode (AM): All system clocks active: 270 µA/MHz at 8 MHz, 3.0 V, flash program execution (typical)
    • Standby mode (LPM3): Watchdog with crystal and supply supervisor operational, full RAM retention, fast wakeup: 1.8 µA at 2.2 V, 2.1 µA at 3.0 V (typical)
    • Shutdown real-time clock (RTC) mode (LPM3.5): Shutdown mode, active RTC with crystal: 1.1 µA at 3.0 V (typical)
    • Shutdown mode (LPM4.5): 0.3 µA at 3.0 V (typical)
  • Wake up from standby mode in 3 µs (typical)
  • 16-bit RISC architecture, extended memory, up to 20-MHz system clock
  • Flexible power-management system
    • Fully integrated LDO with programmable regulated core supply voltage
    • Supply voltage supervision, monitoring, and brownout
  • Unified clock system
    • FLL control loop for frequency stabilization
    • Low-power low-frequency internal clock source (VLO)
    • Low-frequency trimmed internal reference source (REFO)
    • 32-kHz crystals (XT1)
    • High-frequency crystals up to 32 MHz (XT2)
  • Four 16-bit timers with 3, 5, or 7 capture/compare registers
  • Two universal serial communication interfaces (USCIs)
    • USCI_A0 and USCI_A1 each support:
      • Enhanced UART supports automatic baud-rate detection
      • IrDA encoder and decoder
      • Synchronous SPI
    • USCI_B0 and USCI_B1 each support:
      • I2C
      • Synchronous SPI
  • Integrated 3.3-V power system
  • 12-bit analog-to-digital converter (ADC) with internal shared reference, sample-and-hold, and autoscan feature
  • Dual 12-bit digital-to-analog converters (DACs) with synchronization
  • Voltage comparator
  • Hardware multiplier supports 32-bit operations
  • Serial onboard programming, no external programming voltage needed
  • 6-channel internal DMA
  • RTC module with supply voltage backup switch
  • Device Comparison summarizes the available family members

The TI MSP430™ family of ultra-low-power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the device to wake up from low-power modes to active mode in 3 µs (typical).

The MSP430F533x devices are microcontrollers with an integrated 3.3-V LDO, a high-performance 12-bit ADC, a comparator, two USCIs, a hardware multiplier, DMA, four 16-bit timers, an RTC module with alarm capabilities, and up to 74 I/O pins.

For complete module descriptions, see the MSP430F5xx and MSP430F6xx Family User’s Guide.

The TI MSP430™ family of ultra-low-power microcontrollers consists of several devices featuring different sets of peripherals targeted for various applications. The architecture, combined with five low-power modes, is optimized to achieve extended battery life in portable measurement applications. The device features a powerful 16-bit RISC CPU, 16-bit registers, and constant generators that contribute to maximum code efficiency. The digitally controlled oscillator (DCO) allows the device to wake up from low-power modes to active mode in 3 µs (typical).

The MSP430F533x devices are microcontrollers with an integrated 3.3-V LDO, a high-performance 12-bit ADC, a comparator, two USCIs, a hardware multiplier, DMA, four 16-bit timers, an RTC module with alarm capabilities, and up to 74 I/O pins.

For complete module descriptions, see the MSP430F5xx and MSP430F6xx Family User’s Guide.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 16
Type Title Date
* Data sheet MSP430F533x Mixed-Signal Microcontrollers datasheet (Rev. F) 11 Sep 2020
* Errata MSP430F5335 Microcontroller Errata (Rev. AB) PDF | HTML 08 Oct 2012
* User guide MSP430x5xx and MSP430x6xx Family User's Guide (Rev. Q) 17 Aug 2018
Application note Design Considerations When Using the MSP430 Graphics Library (Rev. A) PDF | HTML 09 Aug 2023
Application note ESD Diode Current Specification (Rev. B) PDF | HTML 23 Aug 2021
Application note MSP430 System-Level ESD Considerations (Rev. B) PDF | HTML 14 Jul 2021
User guide MSP430 MCUs Development Guide Book (Rev. A) PDF | HTML 13 May 2021
Application note MSP430 System ESD Troubleshooting Guide PDF | HTML 13 Dec 2019
White paper Capacitive Touch and MSP Microcontrollers (Rev. A) 27 Apr 2017
Application note Migrating from the MSP430F5xx,F6xx Family to the MSP430FR58xx/FR59xx/68xx Family (Rev. D) 03 Nov 2016
Application note General Oversampling of MSP ADCs for Higher Resolution (Rev. A) PDF | HTML 01 Apr 2016
Functional safety information Safety Manual for MSP430G2xx, F5xx, and FR57xx in IEC 60730 Safety Applications (Rev. A) 12 Jan 2016
Application note MSP Code Protection Features PDF | HTML 07 Dec 2015
Application note Using the MSP430 Timer_D Module in Hi-Resolution Mode 02 Oct 2013
Application note Design Considerations When Using the MSP430 Graphics Library 05 Oct 2012
White paper Power Management Solutions for Ultra-Low-Power 16-Bit MSP430 MCUs (Rev. D) 28 Mar 2012

Design & development

Please view the Design & development section on a desktop.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos