MSPM0L1106

ACTIVE

32-MHz Arm® Cortex®-M0+ MCU with 64-KB flash, 4-KB SRAM, 12-bit ADC

Product details

Frequency (MHz) 32 Flash memory (kByte) 64 RAM (kByte) 4 ADC type 12-bit SAR Number of ADC channels 10 Number of GPIOs 28 UART 2 Number of I2Cs 1 SPI 1 Features 5-V-tolerant I/Os, DMA, General purpose, OpAmp Operating temperature range (°C) -40 to 105 Rating Catalog
Frequency (MHz) 32 Flash memory (kByte) 64 RAM (kByte) 4 ADC type 12-bit SAR Number of ADC channels 10 Number of GPIOs 28 UART 2 Number of I2Cs 1 SPI 1 Features 5-V-tolerant I/Os, DMA, General purpose, OpAmp Operating temperature range (°C) -40 to 105 Rating Catalog
SOT-23-THN (DYY) 16 8.4 mm² 4.2 x 2 VQFN (RGE) 24 16 mm² 4 x 4 VQFN (RHB) 32 25 mm² 5 x 5 VSSOP (DGS) 20 24.99 mm² 5.1 x 4.9 VSSOP (DGS) 28 34.79 mm² 7.1 x 4.9 WQFN (RTR) 16 6 mm² 2 x 3
  • Core
    • Arm 32-bit Cortex-M0+ CPU, frequency up to 32 MHz
  • Operating characteristics
    • Extended temperature: –40°C to 105°C
    • Wide supply voltage range: 1.62 V to 3.6 V
  • Memories
    • Up to 64KB of flash
    • 4KB of SRAM
  • High-performance analog peripherals
    • One 12-bit 1.68-Msps analog-to-digital converter (ADC) with up to 10 total external channels
    • Configurable 1.4-V or 2.5-V internal ADC voltage reference (VREF)
    • One general-purpose amplifier (GPAMP)
    • Integrated temperature sensor
  • Optimized low-power modes
    • RUN: 71 µA/MHz (CoreMark)
    • STOP: 151 µA at 4 MHz and 44 µA at 32 kHz
    • STANDBY: 1.0 µA with 32-kHz 16-bit timer running, SRAM/registers fully retained, and 32MHz clock wakeup in 3.2µs
    • SHUTDOWN: 61 nA with IO wakeup capability
  • Intelligent digital peripherals
    • 3-channel DMA controller
    • 3-channel event fabric signaling system
    • Four 16-bit general-purpose timers, each with two capture/compare registers supporting low-power operation in STANDBY mode, supporting a total of 8 PWM channels
    • Windowed watchdog timer
  • Enhanced communication interfaces
    • Two UART interfaces; one supporting LIN, IrDA, DALI, Smart Card, Manchester and both supporting low-power operation in STANDBY
    • One I2C interface supporting FM+ (1Mbit/s), SMBus, PMBus, and wakeup from STOP
    • One SPI supporting up to 16 Mbit/s
  • Clock system
  • Internal 4- to 32-MHz oscillator with ±1.2% accuracy (SYSOSC)
  • Internal 32-kHz low-frequency oscillator with ±3% accuracy (LFOSC)
  • Data integrity
    • Cyclic redundancy checker (CRC-16 or CRC-32)
  • Flexible I/O features
    • Up to 28 GPIOs
    • Two 5-V tolerant open-drain IOs
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 32-pin VQFN (RHB)
    • 28-pin VSSOP (DGS)
    • 24-pin VQFN (RGE)
    • 20-pin VSSOP (DGS)
    • 16-pin SOT (DYY), WQFN (RTR)
  • Family members (also see Device Comparison)
    • MSPM0L1105: 32KB of flash, 4KB of RAM
    • MSPM0L1106: 64KB of flash, 4KB of RAM
  • Development kits and software (also see Tools and Software)
    • LP-MSPM0L1306 LaunchPad™ development kit
    • MSP Software Development Kit (SDK)
  • Core
    • Arm 32-bit Cortex-M0+ CPU, frequency up to 32 MHz
  • Operating characteristics
    • Extended temperature: –40°C to 105°C
    • Wide supply voltage range: 1.62 V to 3.6 V
  • Memories
    • Up to 64KB of flash
    • 4KB of SRAM
  • High-performance analog peripherals
    • One 12-bit 1.68-Msps analog-to-digital converter (ADC) with up to 10 total external channels
    • Configurable 1.4-V or 2.5-V internal ADC voltage reference (VREF)
    • One general-purpose amplifier (GPAMP)
    • Integrated temperature sensor
  • Optimized low-power modes
    • RUN: 71 µA/MHz (CoreMark)
    • STOP: 151 µA at 4 MHz and 44 µA at 32 kHz
    • STANDBY: 1.0 µA with 32-kHz 16-bit timer running, SRAM/registers fully retained, and 32MHz clock wakeup in 3.2µs
    • SHUTDOWN: 61 nA with IO wakeup capability
  • Intelligent digital peripherals
    • 3-channel DMA controller
    • 3-channel event fabric signaling system
    • Four 16-bit general-purpose timers, each with two capture/compare registers supporting low-power operation in STANDBY mode, supporting a total of 8 PWM channels
    • Windowed watchdog timer
  • Enhanced communication interfaces
    • Two UART interfaces; one supporting LIN, IrDA, DALI, Smart Card, Manchester and both supporting low-power operation in STANDBY
    • One I2C interface supporting FM+ (1Mbit/s), SMBus, PMBus, and wakeup from STOP
    • One SPI supporting up to 16 Mbit/s
  • Clock system
  • Internal 4- to 32-MHz oscillator with ±1.2% accuracy (SYSOSC)
  • Internal 32-kHz low-frequency oscillator with ±3% accuracy (LFOSC)
  • Data integrity
    • Cyclic redundancy checker (CRC-16 or CRC-32)
  • Flexible I/O features
    • Up to 28 GPIOs
    • Two 5-V tolerant open-drain IOs
  • Development support
    • 2-pin serial wire debug (SWD)
  • Package options
    • 32-pin VQFN (RHB)
    • 28-pin VSSOP (DGS)
    • 24-pin VQFN (RGE)
    • 20-pin VSSOP (DGS)
    • 16-pin SOT (DYY), WQFN (RTR)
  • Family members (also see Device Comparison)
    • MSPM0L1105: 32KB of flash, 4KB of RAM
    • MSPM0L1106: 64KB of flash, 4KB of RAM
  • Development kits and software (also see Tools and Software)
    • LP-MSPM0L1306 LaunchPad™ development kit
    • MSP Software Development Kit (SDK)

MSPM0L110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MSPM0 MCU family based on the enhanced Arm Cortex-M0+ core platform operating at up to 32-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 105°C, and operate with supply voltages from 1.62 V to 3.6 V.

The MSPM0L110x devices provide up to 64KB embedded flash program memory with 4KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy up to ±1.2%, eliminating the need for an external crystal. Additional features include a 3-channel DMA, 16 and 32-bit CRC accelerator, and a variety of high-performance analog peripherals such as one 12-bit 1.68-Msps ADC with configurable internal voltage reference, one general-purpose amplifier, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as four 16-bit general purpose timers, one windowed watchdog timer, and a variety of communication peripherals including two UARTs, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and PMBus.

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration let customers find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications.

MSPM0L110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 L-Series 32-MHz Microcontrollers Technical Reference Manual.

MSPM0L110x microcontrollers (MCUs) are part of the MSP highly-integrated ultra-low-power 32-bit MSPM0 MCU family based on the enhanced Arm Cortex-M0+ core platform operating at up to 32-MHz frequency. These cost-optimized MCUs offer high-performance analog peripheral integration, support extended temperature ranges from -40°C to 105°C, and operate with supply voltages from 1.62 V to 3.6 V.

The MSPM0L110x devices provide up to 64KB embedded flash program memory with 4KB SRAM. These MCUs incorporate a high-speed on-chip oscillator with an accuracy up to ±1.2%, eliminating the need for an external crystal. Additional features include a 3-channel DMA, 16 and 32-bit CRC accelerator, and a variety of high-performance analog peripherals such as one 12-bit 1.68-Msps ADC with configurable internal voltage reference, one general-purpose amplifier, and an on-chip temperature sensor. These devices also offer intelligent digital peripherals such as four 16-bit general purpose timers, one windowed watchdog timer, and a variety of communication peripherals including two UARTs, one SPI, and one I2C. These communication peripherals offer protocol support for LIN, IrDA, DALI, Manchester, Smart Card, SMBus, and PMBus.

The TI MSPM0 family of low-power MCUs consists of devices with varying degrees of analog and digital integration let customers find the MCU that meets their project needs. The architecture combined with extensive low-power modes is optimized to achieve extended battery life in portable measurement applications.

MSPM0L110x MCUs are supported by an extensive hardware and software ecosystem with reference designs and code examples to get the design started quickly. Development kits include a LaunchPad™ kit available for purchase and design files for a target-socket board. TI also provides a free MSP Software Development Kit (SDK), which is available as a component of Code Composer Studio™ IDE desktop and cloud version within the TI Resource Explorer. MSPM0 MCUs are also supported by extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

For complete module descriptions, see the MSPM0 L-Series 32-MHz Microcontrollers Technical Reference Manual.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 48
Type Title Date
* Data sheet MSPM0L110x Mixed-Signal Microcontrollers datasheet (Rev. C) PDF | HTML 04 Jan 2024
* Errata MSPM0L110x, MSPM0L13xx Microcontrollers Errata (Rev. A) PDF | HTML 28 Apr 2023
* User guide MSPM0 L-Series 32-MHz Microcontrollers Technical Reference Manual (Rev. D) PDF | HTML 15 May 2024
White paper Understanding Functional Safety FIT Base Failure Rate Estimates per IEC 62380 and SN 29500 (Rev. A) PDF | HTML 30 Apr 2024
Subsystem design Data Sensor Aggregator Subsystem Design PDF | HTML 05 Jan 2024
Subsystem design ADC to I2C PDF | HTML 22 Dec 2023
Subsystem design ADC to SPI PDF | HTML 22 Dec 2023
Subsystem design ADC to UART PDF | HTML 22 Dec 2023
Application note Migration Guide From STM8 to MSPM0 PDF | HTML 06 Dec 2023
Design guide IO-Link Device Implementation for Sensors and Actuator Reference Design PDF | HTML 09 Oct 2023
Application note Operating Time of MSPM0 Powered by a Capacitor PDF | HTML 03 Oct 2023
Application brief Build Scalability in Cordless Power and Garden Tools Using Low-Cost MSPM0 MCUs (Rev. A) PDF | HTML 27 Sep 2023
Application note PIR Motion Detection With MSPM0 PDF | HTML 19 Sep 2023
Application brief Using MSPM0 MCUs to Design Trapezoidal-Based BLDC Motor Controllers (Rev. A) PDF | HTML 14 Sep 2023
Application brief Optimized H-Bridge Driver Control for Stepper and BDC Motors Using MSPM0 MCUs (Rev. A) PDF | HTML 06 Sep 2023
Application note BQ769x2 Control Based on MSPM0 Through I2C PDF | HTML 09 May 2023
Application note EEPROM Emulation Type A Solution PDF | HTML 18 Apr 2023
Application note STM32에서 Arm 기반 MSPM0으로의 마이그레이션 가이드 (Rev. A) PDF | HTML 12 Apr 2023
Application note 從 STM32 到 Arm 架構的 MSPM0 移轉指南 (Rev. A) PDF | HTML 12 Apr 2023
Application note EEPROM Emulation Type B Design PDF | HTML 11 Apr 2023
Application note MSPM0 MCU 快速參考指南 (Rev. A) PDF | HTML 11 Apr 2023
Application note MSPM0 MCU 빠른 참조 가이드 (Rev. A) PDF | HTML 11 Apr 2023
Application brief Increasing Flexibility in Your Battery Management Designs With a Low-Cost MSPM0 PDF | HTML 02 Mar 2023
Application brief Increasing Flexibility in Your Electrical Thermometer Designs With Low-Cost MSPM PDF | HTML 02 Mar 2023
Application note Migration Guide From MSP430 MCUs to MSPM0 MCUs (Rev. A) PDF | HTML 02 Mar 2023
Application brief Optimizing Field Sensor and Transmitter Applications With MSPM0 MCUs PDF | HTML 02 Mar 2023
Application brief Simplifying Design in True Wireless Stereo Control With a Low-Cost MSPM0 MCU PDF | HTML 02 Mar 2023
Application brief Simplifying Pulse Oximeter Designs With Low-Cost Highly Integrated MSPM0 MCUs PDF | HTML 02 Mar 2023
Application brief Streamlining Smoke Detector Designs With Highly Integrated MSPM0 MCUs PDF | HTML 02 Mar 2023
Subsystem design 5-V Interface PDF | HTML 01 Mar 2023
Subsystem design Common Amplifier Topologies: PGA PDF | HTML 01 Mar 2023
Subsystem design DMA Ping Pong With ADC 01 Mar 2023
Subsystem design LED Driver With PWM PDF | HTML 01 Mar 2023
Application note MSPM0 L-Series MCUs Hardware Development Guide (Rev. A) PDF | HTML 01 Mar 2023
Application note Migration Guide From STM32 to Arm-Based MSPM0 (Rev. A) PDF | HTML 01 Mar 2023
User guide MSPM0 Bootloader User's Guide PDF | HTML 28 Feb 2023
Application note MSPM0 MCUs Quick Reference Guide (Rev. A) PDF | HTML 28 Feb 2023
Subsystem design Thermistor Temperature Sensing PDF | HTML 28 Feb 2023
Subsystem design Transimpedance Amplifier PDF | HTML 28 Feb 2023
Application note Cybersecurity Enablers in MSPM0 MCUs PDF | HTML 22 Feb 2023
Application note MSPM0 L-Series MCUs Power Optimization Guide PDF | HTML 22 Feb 2023
Product overview MSPM0 MCUs: More Options, Unlimited Possibilities PDF | HTML 22 Feb 2023
White paper MSPM0: Idea to Product With Easy-to-Use Tools, Software, and Academy PDF | HTML 22 Feb 2023
Application note Make System Design Easy With MSPM0 Precision Analog PDF | HTML 22 Feb 2023
Product overview MSPM0 MCU: 더 많은 옵션, 무한한 가능성 PDF | HTML 24 Jan 2023
Product overview MSPM0 MCU:更多選項,無限可能 PDF | HTML 24 Jan 2023
Application note MSPM0L or MSPM0G: How to Pick the Right MSP Microcontroller for Your Application PDF | HTML 13 Dec 2022
Application note MSPM0 Bootloader (BSL) Implementation (Rev. B) PDF | HTML 05 Dec 2022

Design & development

Please view the Design & development section on a desktop.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos