SBOS876B
September 2017 – February 2020
TMP461-SP
PRODUCTION DATA.
1
Features
2
Applications
Simplified Block Diagram
3
Description
4
Revision History
5
Pin Configuration and Functions
Pin Functions
6
Specifications
6.1
Absolute Maximum Ratings
6.2
ESD Ratings
6.3
Recommended Operating Conditions
6.4
Thermal Information
6.5
Electrical Characteristics
6.6
Two-Wire Timing Requirements
6.7
Typical Characteristics
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Temperature Measurement Data
7.3.1.1
Standard Binary to Decimal Temperature Data Calculation Example
7.3.1.2
Standard Decimal to Binary Temperature Data Calculation Example
7.3.2
Series Resistance Cancellation
7.3.3
Differential Input Capacitance
7.3.4
Filtering
7.3.5
Sensor Fault
7.3.6
ALERT and THERM Functions
7.4
Device Functional Modes
7.4.1
Shutdown Mode (SD)
7.5
Programming
7.5.1
Serial Interface
7.5.1.1
Bus Overview
7.5.1.2
Bus Definitions
7.5.1.3
Serial Bus Address
7.5.1.4
Read and Write Operations
7.5.1.5
Timeout Function
7.5.1.6
High-Speed Mode
7.5.2
General-Call Reset
7.6
Register Map
7.6.1
Register Information
7.6.1.1
Pointer Register
7.6.1.2
Local and Remote Temperature Registers
7.6.1.3
Status Register
7.6.1.4
Configuration Register
7.6.1.5
Conversion Rate Register
7.6.1.6
One-Shot Start Register
7.6.1.7
Channel Enable Register
7.6.1.8
Consecutive ALERT Register
7.6.1.9
η-Factor Correction Register
7.6.1.10
Remote Temperature Offset Register
7.6.1.11
Manufacturer Identification Register
8
Application and Implementation
8.1
Application Information
8.2
Typical Application
8.2.1
Design Requirements
8.2.2
Detailed Design Procedure
8.2.3
Application Curve
8.3
Radiation Environments
8.3.1
Single Event Latch-Up
8.3.2
Single Event Functional Interrupt
8.3.3
Single Event Upset
9
Power Supply Recommendations
10
Layout
10.1
Layout Guidelines
10.2
Layout Example
11
Device and Documentation Support
11.1
Receiving Notification of Documentation Updates
11.2
Community Resources
11.3
Trademarks
11.4
Electrostatic Discharge Caution
11.5
Glossary
12
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
HKU|10
MCDF015C
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbos876b_oa
sbos876b_pm
1
Features
QMLV Qualified: 5962R-1721801VXC
Thermally Enhanced HKU Package
Radiation-Hardness-Assured (RHA) up to Total Ionizing Dose (TID) 100 krad(Si) at low dose rate (LDR) of 10 mrad/s
Single Event Latchup (SEL) Immune to 76 MeV·cm
2
/mg at 125°C
10-Lead HKU Ceramic Package
Remote Diode Temperature Sensor Accuracy: ±1.5°C (Across Extended Temperature Range of [–55°C to 125°C])
Local Temperature Sensor Accuracy: ±2°C (Across Extended Temperature Range of [–55°C to 125°C])
Enables Measurement Of Remote Diode Temperatures in the Range of –64°C to 191°C
Resolution for Local and Remote Channels: 0.0625°C
Supply and Logic Voltage Range: 1.7 V to 3.6 V
35-µA Operating Current (1 SPS),
3-µA Shutdown Current
Series Resistance Cancellation
η-Factor and Offset Correction
Programmable Digital Filter
Diode Fault Detection
Two-Wire and SMBus™ Serial Interface Compatible with Pin-Programmable Address