The certified WiLink™ 8 module from TI offers high throughput and extended range along with Wi-Fi® and Bluetooth® coexistence (WL1835MOD only) in a power-optimized design. The WL18x5MOD device is a 2.4-GHz module, two antenna solution. The device is FCC, IC, ETSI/CE, and TELEC certified for AP and client. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS, are supported through third parties.
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The AM437x Evaluation Module (EVM), TMDXEVM437X, enables developers to immediately start evaluating the AM437x processor family (AM4372, AM4376,AM4377, AM4378) and begin building applications and accelerate development for HMI, industrial and networking applications. The TMDSEVM437X development (...)
The AM572x evaluation module provides an affordable platform to quickly start evaluation of Sitara™ Arm® Cortex®-A15 AM57x processors (AM5728, AM5726, AM5718, AM5716) and accelerate development for HMI, machine vision, networking, medical imaging and many other industrial applications. It is a (...)
The AM335x Evaluation Module (EVM) enables developers to immediately start evaluating the AM335x processor family (AM3351, AM3352, AM3354, AM3356, AM3358) and begin building applications for factory automation, building automation, grid infrastructure, and more.
The WiLink SDIO board is a SDMMC adapter board and is an easy to use connector between a WiLink COM8 Evaluation module [WL1837MODCOM8i and WL1835MODCOM8B] and a generic SD/MMC card slot on a host processor EVM. The adapter card enables the WiLink Wi-Fi module to operate over SDIO. It also provides (...)
The WL1835MODCOM8 is one of the two evaluation boards for the TI WiLink 8 combo module family. For designs requiring performance in the 5 GHz band and extended temperature range, see the WL1837MODCOM8I.
The WL1835MODCOM8 Kit for Sitara EVMs easily enables customers to add (...)
The WL1837MODCOM8I, which is compatible with many processors including TI’s (...)
The applications provide all of the capabilities required to debug and monitor WiLink™ WLAN/Bluetooth/Bluetooth low (...)
The MCP package contains the install package, pre-compiled object and source of the proprietary Wi-Fi Driver - QNX, Nucleus, WinCE as well as ThreadX, FreeRTOS, µC, MQX ,RTX and uITRON RTOS baseline image to easily integrate the TI WiLink Wi-Fi drivers. The integration is supported through (...)
WiLink™ 8 NLCP package consists of build scripts to update WiLink™ 8 Linux driver, firmware binary, wpa supplicant, hostapd etc. For more details please refer to the release notes and user’s guide
WL18xx Linux driver uses the open source components along with the interface (...)
The Bluetooth Service Pack is composed of the following four files:
Note the version in the file name is unique for combination of hardware and firmware, but is not (...)
For (...)
The hardware design consists of DDR3L SDRAM (2x512MB), 64MB Serial NOR Flash, 8GB eMMC 5.0 iNAND, SD Card interface v3.0, 50 pin LCD Connector for external TFT display (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| QFM (MOC) | 100 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
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Link to WiLink™ 8 Solutions Overview
Link to the Getting Started User's Guide
Link to the Wilink8 Calibrator Tool User's Guide
Link to R8.8 Release Notes
Software Manifest of components inside the release
WL18MODGB Module Certification Reports; See Release Notes for supported regions and expiration dates
WL18MODGI Module Certification Reports; See Release Notes for supported regions and expiration dates
Link to WL18x7MOD AP DFS Reference Only Cerification Reports
Link to WL18MODCOM8B Reference Only Certification Reports
Link to WL18MODCOM8I Reference Only Certification Reports