Product details

Arm CPU 1 Arm9 Arm (max) (MHz) 192 Coprocessors C55x DSP CPU 32-bit Hardware accelerators Motion Estimation for Video Compression, Pixel Interpolation, Video Hardware Accelerators for DCT/iDCT Operating system Linux, RTOS Security Device identity, Memory protection Rating Catalog Operating temperature range (°C) -40 to 85
Arm CPU 1 Arm9 Arm (max) (MHz) 192 Coprocessors C55x DSP CPU 32-bit Hardware accelerators Motion Estimation for Video Compression, Pixel Interpolation, Video Hardware Accelerators for DCT/iDCT Operating system Linux, RTOS Security Device identity, Memory protection Rating Catalog Operating temperature range (°C) -40 to 85
BGA (ZDY) 289 361 mm² 19 x 19 NFBGA (GVL) 289 144 mm² 12 x 12 NFBGA (ZVL) 289 144 mm² 12 x 12 PBGA (GDY) 289 361 mm² 19 x 19
  • Low-Power, High-Performance CMOS Technology
    • 0.13-µm Technology
    • 1.6-V Core Voltage
  • TI925T (MPU) ARM9TDMI™ Core
    • Support 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
    • 16K-Byte Instruction Cache
    • 8K-Byte Data Cache
    • Data and Program Memory Management Units (MMUs)
    • Two 64-Entry Translation Look-Aside Buffers (TLBs) for MMUs
    • 17-Word Write Buffer
  • TMS320C55x™ (C55x™) DSP Core
    • One/Two Instructions Executed per Cycle
    • Dual Multipliers (Two Multiply-Accumulates per Cycle)
    • Two Arithmetic/Logic Units
    • One Internal Program Bus
    • Five Internal Data/Operand Buses (3 Read Buses and 2 Write Buses)
    • 32K x 16-Bit On-Chip Dual-Access RAM (DARAM) (64K Bytes)
    • 48K x 16-Bit On-Chip Single-Access RAM (SARAM) (96K Bytes)
    • 16K x 16-Bit On-Chip ROM (32K Bytes)
    • Instruction Cache (24K Bytes)
    • Video Hardware Accelerators for DCT, IDCT, Pixel Interpolation, and Motion Estimation for Video Compression
  • 192K Bytes of Shared Internal SRAM
  • Memory Traffic Controller (TC)
    • 16-Bit EMIFS External Memory Interface to Access up to 128M Bytes of Flash, ROM, or ASRAM
    • 16-Bit EMIFF External Memory Interface to Access up to 64M Bytes of SDRAM
  • 9-Channel System DMA Controller
  • DSP Memory Management Unit
  • Endianism Conversion Logic
  • Digital Phase-Locked Loop (DPLL) for MPU/DSP/TC Clocking Control
  • DSP Peripherals
    • Three 32-Bit Timers and Watchdog Timer
    • Level1/Level2 Interrupt Handlers
    • Six-Channel DMA Controller
    • Two Multichannel Buffered Serial Ports
    • Two Multichannel Serial Interfaces
  • TI925T Peripherals
    • Three 32-Bit Timers and Watchdog Timer
    • 32-kHz Timer
    • Level1/Level2 Interrupt Handlers
    • USB (Full/Low Speed) Host Interface With up to 3 Ports
    • USB (Full Speed) Function Interface
    • One Integrated USB Transceiver for Either Host or Function
    • Multichannel Buffered Serial Port
    • Inter-Integrated Circuit (I2C) Master and Slave Interface
    • Microwire™ Serial Interface
    • Multimedia Card (MMC) and Secure Digital (SD) Interface
    • HDQ/1-Wire® Interface
    • Camera Interface for CMOS Sensors
    • ETM9 Trace Module for TI925T Debug
    • Keyboard Matrix Interface (6 x 5 or 8 x 8)
    • Up to Ten MPU General-Purpose I/Os
    • Pulse-Width Tone (PWT) Interface
    • Pulse-Width Light (PWL) Interface
    • Two LED Pulse Generators (LPGs)
    • Real-Time Clock (RTC)
    • LCD Controller With Dedicated System DMA Channel
  • Shared Peripherals
    • Three Universal Asynchronous Receiver/Transmitters (UARTs) (One Supporting SIR Mode for IrDA)
    • Four Interprocessor Mailboxes
    • Up to 14 Shared General-Purpose I/Os
  • Individual Power-Saving Modes for MPU/DSP/TC
  • On-Chip Scan-Based Emulation Logic
  • IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • Two 289-Ball MicroStar BGA™ (Ball Grid Array) Package Options (GZG and GDY Suffixes)

TMS320C55x, C55x, and MicroStar BGA are trademarks of Texas Instruments.
ARM9TDMI is a trademark of ARM Limited.
Thumb is a registered trademark of ARM Limited.
Microwire is a trademark of National Semiconductor Corporation.
1-Wire is a registered trademark of Dallas Semiconductor Corporation.
IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary Scan Architecture.
OMAP and DSP/BIOS are trademarks of Texas Instruments.
Bluetooth is a trademark owned by Bluetooth SIG, Inc.
Windows is a registered trademark of Microsoft Corporation.
Other trademarks are the property of their respective owners.

  • Low-Power, High-Performance CMOS Technology
    • 0.13-µm Technology
    • 1.6-V Core Voltage
  • TI925T (MPU) ARM9TDMI™ Core
    • Support 32-Bit and 16-Bit (Thumb® Mode) Instruction Sets
    • 16K-Byte Instruction Cache
    • 8K-Byte Data Cache
    • Data and Program Memory Management Units (MMUs)
    • Two 64-Entry Translation Look-Aside Buffers (TLBs) for MMUs
    • 17-Word Write Buffer
  • TMS320C55x™ (C55x™) DSP Core
    • One/Two Instructions Executed per Cycle
    • Dual Multipliers (Two Multiply-Accumulates per Cycle)
    • Two Arithmetic/Logic Units
    • One Internal Program Bus
    • Five Internal Data/Operand Buses (3 Read Buses and 2 Write Buses)
    • 32K x 16-Bit On-Chip Dual-Access RAM (DARAM) (64K Bytes)
    • 48K x 16-Bit On-Chip Single-Access RAM (SARAM) (96K Bytes)
    • 16K x 16-Bit On-Chip ROM (32K Bytes)
    • Instruction Cache (24K Bytes)
    • Video Hardware Accelerators for DCT, IDCT, Pixel Interpolation, and Motion Estimation for Video Compression
  • 192K Bytes of Shared Internal SRAM
  • Memory Traffic Controller (TC)
    • 16-Bit EMIFS External Memory Interface to Access up to 128M Bytes of Flash, ROM, or ASRAM
    • 16-Bit EMIFF External Memory Interface to Access up to 64M Bytes of SDRAM
  • 9-Channel System DMA Controller
  • DSP Memory Management Unit
  • Endianism Conversion Logic
  • Digital Phase-Locked Loop (DPLL) for MPU/DSP/TC Clocking Control
  • DSP Peripherals
    • Three 32-Bit Timers and Watchdog Timer
    • Level1/Level2 Interrupt Handlers
    • Six-Channel DMA Controller
    • Two Multichannel Buffered Serial Ports
    • Two Multichannel Serial Interfaces
  • TI925T Peripherals
    • Three 32-Bit Timers and Watchdog Timer
    • 32-kHz Timer
    • Level1/Level2 Interrupt Handlers
    • USB (Full/Low Speed) Host Interface With up to 3 Ports
    • USB (Full Speed) Function Interface
    • One Integrated USB Transceiver for Either Host or Function
    • Multichannel Buffered Serial Port
    • Inter-Integrated Circuit (I2C) Master and Slave Interface
    • Microwire™ Serial Interface
    • Multimedia Card (MMC) and Secure Digital (SD) Interface
    • HDQ/1-Wire® Interface
    • Camera Interface for CMOS Sensors
    • ETM9 Trace Module for TI925T Debug
    • Keyboard Matrix Interface (6 x 5 or 8 x 8)
    • Up to Ten MPU General-Purpose I/Os
    • Pulse-Width Tone (PWT) Interface
    • Pulse-Width Light (PWL) Interface
    • Two LED Pulse Generators (LPGs)
    • Real-Time Clock (RTC)
    • LCD Controller With Dedicated System DMA Channel
  • Shared Peripherals
    • Three Universal Asynchronous Receiver/Transmitters (UARTs) (One Supporting SIR Mode for IrDA)
    • Four Interprocessor Mailboxes
    • Up to 14 Shared General-Purpose I/Os
  • Individual Power-Saving Modes for MPU/DSP/TC
  • On-Chip Scan-Based Emulation Logic
  • IEEE Std 1149.1 (JTAG) Boundary Scan Logic
  • Two 289-Ball MicroStar BGA™ (Ball Grid Array) Package Options (GZG and GDY Suffixes)

TMS320C55x, C55x, and MicroStar BGA are trademarks of Texas Instruments.
ARM9TDMI is a trademark of ARM Limited.
Thumb is a registered trademark of ARM Limited.
Microwire is a trademark of National Semiconductor Corporation.
1-Wire is a registered trademark of Dallas Semiconductor Corporation.
IEEE Standard 1149.1-1990 Standard Test-Access Port and Boundary Scan Architecture.
OMAP and DSP/BIOS are trademarks of Texas Instruments.
Bluetooth is a trademark owned by Bluetooth SIG, Inc.
Windows is a registered trademark of Microsoft Corporation.
Other trademarks are the property of their respective owners.

The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.

The OMAP™ platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.

The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS™ software kernel foundation, and is available in a 289-ball MicroStar BGA package.

The OMAP5910 is targeted at the following applications:

  • Applications processing devices
  • Mobile communications
    • 802.11
    • Bluetooth™ wireless technology
    • GSM (including GPRS and EDGE)
    • CDMA
    • Proprietary government and other
  • Video and image processing (MPEG4, JPEG, Windows® Media Video, etc.)
  • Advanced speech applications (text-to-speech, speech recognition)
  • Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs)
  • Graphics and video acceleration
  • Generalized web access
  • Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)

The OMAP5910 is a highly integrated hardware and software platform, designed to meet the application processing needs of next-generation embedded devices.

The OMAP™ platform enables OEMs and ODMs to quickly bring to market devices featuring rich user interfaces, high processing performance, and long battery life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture provides benefits of both DSP and RISC technologies, incorporating a TMS320C55x DSP core and a high-performance TI925T ARM core.

The OMAP5910 device is designed to run leading open and embedded RISC-based operating systems, as well as the Texas Instruments (TI) DSP/BIOS™ software kernel foundation, and is available in a 289-ball MicroStar BGA package.

The OMAP5910 is targeted at the following applications:

  • Applications processing devices
  • Mobile communications
    • 802.11
    • Bluetooth™ wireless technology
    • GSM (including GPRS and EDGE)
    • CDMA
    • Proprietary government and other
  • Video and image processing (MPEG4, JPEG, Windows® Media Video, etc.)
  • Advanced speech applications (text-to-speech, speech recognition)
  • Audio processing (MPEG-1 Audio Layer3 [MP3], AMR, WMA, AAC, and other GSM speech codecs)
  • Graphics and video acceleration
  • Generalized web access
  • Data processing (fax, encryption/decryption, authentication, signature verification and watermarking)

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Technical documentation

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Type Title Date
* Data sheet OMAP5910 Dual-Core Processor datasheet (Rev. D) 13 Aug 2004
* Errata OMAP5910 Dual-Core Processor Silicon Errata (Rev. F) 28 Feb 2006
* Errata OMAP59xx MicroStar BGA Discontinued and Redesigned 10 May 2022

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins CAD symbols, footprints & 3D models
BGA (ZDY) 289 Ultra Librarian
NFBGA (GVL) 289 Ultra Librarian
NFBGA (ZVL) 289 Ultra Librarian
PBGA (GDY) 289 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

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