THS4503
- Fully Differential Architecture
- Bandwidth: 370 MHz
- Slew Rate: 2800 V/µs
- IMD3: -95 dBc at 30 MHz
- OIP3: 51 dBm at 30 MHz
- Output Common-Mode Control
- Wide Power Supply Voltage Range: 5 V, ±5 V, 12 V, 15 V
- Centered Input Common-Mode Range
- Power-Down Capability (THS4502)
- Evaluation Module Available
The THS4502 and THS4503 are high-performance fully differential amplifiers from Texas Instruments. The THS4502, featuring power-down capability, and the THS4503, without power-down capability, set new performance standards for fully differential amplifiers with unsurpassed linearity, supporting 14-bit operation through 40 MHz. Package options include the 8-pin SOIC and the 8-pin MSOP with PowerPAD for a smaller footprint, enhanced ac performance, and improved thermal dissipation capability.
Technical documentation
Type | Title | Date | ||
---|---|---|---|---|
* | Data sheet | Wideband, Low-Distortion Fully Differential Amplifiers. datasheet (Rev. E) | 07 Oct 2011 | |
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 28 Mar 2017 | ||
Application note | Noise Analysis for High Speed Op Amps (Rev. A) | 17 Jan 2005 | ||
EVM User's guide | THS4503EVM User's Guide | 03 Jun 2002 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.
THS4503EVM — THS4503 Evaluation Module
The THS4503 evaluation board is capable of evaluating different gain configurations by changing feedback and gain setting resistors. This board comes fully populated with all components except transformer. The default configuration assumes a 50 ohm signal source and contains a (...)
THS4503 TINA-TI Reference Design (Rev. C)
PSPICE-FOR-TI — PSpice® for TI design and simulation tool
TINA-TI — SPICE-based analog simulation program
Package | Pins | CAD symbols, footprints & 3D models |
---|---|---|
HVSSOP (DGN) | 8 | Ultra Librarian |
SOIC (D) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
- Fab location
- Assembly location
Support & training
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