This device is a transient voltage
suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system
level ESD solutions for wide range of portable and industrial applications. The back-to-back diode
array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232,
and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level
4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when
placed near the connector.
The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar
package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving
application where the package height is a key concern. The PicoStar package can be used in either
embedded PCB board applications or in surface mount applications. The industry standard SOT package
offers straightforward board layout option in legacy designs.
This device is a transient voltage
suppressor (TVS) based electrostatic discharge (ESD) protection device designed to offer system
level ESD solutions for wide range of portable and industrial applications. The back-to-back diode
array allows AC-coupled or negative-going data transmission (audio interface, LVDS, RS-485, RS-232,
and so forth) without compromising signal integrity. This device exceeds the IEC 61000-4-2 (Level
4) ESD protection and is ideal for providing system level ESD protection for the internal ICs when
placed near the connector.
The TPD2E007 is offered in a 4-bump PicoStar and 3-pin SOT (DGK) packages. The PicoStar
package (YFM), with only 0.15 mm (Max) package height, is recommended for ultra space saving
application where the package height is a key concern. The PicoStar package can be used in either
embedded PCB board applications or in surface mount applications. The industry standard SOT package
offers straightforward board layout option in legacy designs.