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TS3A225E

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100-mΩ audio jack switch with autonomous microphone & ground detection

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Data sheet

TS3A225E

ACTIVE
Data sheet Order now

Product details

Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Integrated Codec Sense Line, Manual I2C control Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 4.5 Supply current (typ) (µA) 8 Operating temperature range (°C) -40 to 85 Rating Catalog
Configuration Audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Integrated Codec Sense Line, Manual I2C control Supply voltage (min) (V) 2.7 Supply voltage (max) (V) 4.5 Supply current (typ) (µA) 8 Operating temperature range (°C) -40 to 85 Rating Catalog
DSBGA (YFF) 16 3.24 mm² 1.8 x 1.8 WQFN (RTE) 16 9 mm² 3 x 3
  • VDD Range = 2.7 V to 4.5 V
  • Break Before Make Stereo Jack Switches
  • Ron for Ground FET Switches
    • WCSP Package: 70 mΩ
    • QFN Package: 100 mΩ
  • Autonomous Detection of GND and MIC Connections
  • Detection Triggered by I2C or External Trigger Pin
  • HDA Compatible MIC Present Indicator
  • 1.8V Compatible I2C Switch Control
  • ESD Performance Tested Per JESD 22:
    • 2000-V Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • ESD Performance (SLEEVE, RING2, TIP)
    • ±8-kV Contact Discharge (IEC 61000-4-2)
  • VDD Range = 2.7 V to 4.5 V
  • Break Before Make Stereo Jack Switches
  • Ron for Ground FET Switches
    • WCSP Package: 70 mΩ
    • QFN Package: 100 mΩ
  • Autonomous Detection of GND and MIC Connections
  • Detection Triggered by I2C or External Trigger Pin
  • HDA Compatible MIC Present Indicator
  • 1.8V Compatible I2C Switch Control
  • ESD Performance Tested Per JESD 22:
    • 2000-V Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • ESD Performance (SLEEVE, RING2, TIP)
    • ±8-kV Contact Discharge (IEC 61000-4-2)

The TS3A225E is an audio headset switch device. The device detects the presence of an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A225E detects a certain configuration, the device automatically connects the microphone line to the appropriate pin. The device also reports the presence of an analog microphone on an audio stereo jack.

In some systems, it is desirable to connect the stereo jack pin to ground. The TS3A225E provides two internal low resistance (<100mΩ) FET switches for ground shorting.

The TS3A225E is an audio headset switch device. The device detects the presence of an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A225E detects a certain configuration, the device automatically connects the microphone line to the appropriate pin. The device also reports the presence of an analog microphone on an audio stereo jack.

In some systems, it is desirable to connect the stereo jack pin to ground. The TS3A225E provides two internal low resistance (<100mΩ) FET switches for ground shorting.

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Technical documentation

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Type Title Date
* Data sheet Autonomous Audio Headset Switch datasheet (Rev. A) 29 May 2013
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML 02 Jun 2022
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. C) PDF | HTML 19 Nov 2021
Application note Support Selfie Sticks Using a TS3A227E Audio Jack Switch 04 Mar 2016
Application note Preventing Excess Power Consumption on Analog Switches 03 Jul 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

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LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
User guide: PDF
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Simulation model

TS3A225E HSpice (LIN) Model

SCDM145.ZIP (483 KB) - HSpice Model
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Simulation model

TS3A225E HSpice (WIN) Model

SCDM146.ZIP (482 KB) - HSpice Model
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Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
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Package Pins CAD symbols, footprints & 3D models
DSBGA (YFF) 16 Ultra Librarian
WQFN (RTE) 16 Ultra Librarian
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