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UCC27424-Q1

ACTIVE

Automotive 4-A/4-A dual-channel gate driver with enable

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UCC27524A-Q1 ACTIVE Automotive 5-A/5-A dual-channel gate driver with 5-V UVLO and negative input voltage handling This is the next generation dual channel low-side driver with higher drive strength, UVLO, and faster switching characteristics

Product details

Number of channels 2 Power switch IGBT, MOSFET Peak output current (A) 4 Input supply voltage (min) (V) 4 Input supply voltage (max) (V) 15 Features Enable pin Operating temperature range (°C) -40 to 125 Fall time (ns) 15 Input threshold CMOS, TTL Channel input logic Non-Inverting Input negative voltage (V) 0 Rating Automotive Driver configuration Non-Inverting
Number of channels 2 Power switch IGBT, MOSFET Peak output current (A) 4 Input supply voltage (min) (V) 4 Input supply voltage (max) (V) 15 Features Enable pin Operating temperature range (°C) -40 to 125 Fall time (ns) 15 Input threshold CMOS, TTL Channel input logic Non-Inverting Input negative voltage (V) 0 Rating Automotive Driver configuration Non-Inverting
HVSSOP (DGN) 8 14.7 mm² 3 x 4.9 SOIC (D) 8 29.4 mm² 4.9 x 6
  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C6
  • Industry-Standard Pinout
  • Enable Functions for Each Driver
  • High-Current Drive Capability of ±4 A
  • Unique Bipolar and CMOS True Drive Output Stage Provides High Current at MOSFET Miller Thresholds
  • Inputs Independent of Supply Voltage Compatible With TTL and CMOS
  • 20-ns Typical Rise and 15-ns Typical Fall Times With 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns With Input Rising
  • 4-V to 15-V Supply Voltage
  • Dual Outputs Can Be Paralleled for Higher Drive Current
  • Available in Thermally Enhanced MSOP PowerPAD™ Package
  • Rated From –40°C to +125°C
  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range
    • Device HBM ESD Classification Level 2
    • Device CDM ESD Classification Level C6
  • Industry-Standard Pinout
  • Enable Functions for Each Driver
  • High-Current Drive Capability of ±4 A
  • Unique Bipolar and CMOS True Drive Output Stage Provides High Current at MOSFET Miller Thresholds
  • Inputs Independent of Supply Voltage Compatible With TTL and CMOS
  • 20-ns Typical Rise and 15-ns Typical Fall Times With 1.8-nF Load
  • Typical Propagation Delay Times of 25 ns With Input Falling and 35 ns With Input Rising
  • 4-V to 15-V Supply Voltage
  • Dual Outputs Can Be Paralleled for Higher Drive Current
  • Available in Thermally Enhanced MSOP PowerPAD™ Package
  • Rated From –40°C to +125°C

The UCC2742x-Q1 family of devices are high-speed dual MOSFET drivers capable of delivering large peak currents into capacitive loads. Two standard logic options are offered: dual inverting and dual noninverting drivers. They are offered in the standard 8-pin SOIC (D) package. The thermally enhanced 8-pin PowerPAD Package MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability.

Using a design that inherently minimizes shoot-through current, these drivers deliver 4-A current where it is needed most, at the Miller plateau region, during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC2742x-Q1 provide enable (ENBL) functions to have better control of the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which were previously left unused in the industry standard pinout. They are internally pulled up to V DD for active-high logic and can be left open for standard operation.

The UCC2742x-Q1 family of devices are high-speed dual MOSFET drivers capable of delivering large peak currents into capacitive loads. Two standard logic options are offered: dual inverting and dual noninverting drivers. They are offered in the standard 8-pin SOIC (D) package. The thermally enhanced 8-pin PowerPAD Package MSOP package (DGN) drastically lowers the thermal resistance to improve long-term reliability.

Using a design that inherently minimizes shoot-through current, these drivers deliver 4-A current where it is needed most, at the Miller plateau region, during the MOSFET switching transition. A unique bipolar and MOSFET hybrid output stage in parallel also allows efficient current sourcing and sinking at low supply voltages.

The UCC2742x-Q1 provide enable (ENBL) functions to have better control of the operation of the driver applications. ENBA and ENBB are implemented on pins 1 and 8, which were previously left unused in the industry standard pinout. They are internally pulled up to V DD for active-high logic and can be left open for standard operation.

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Technical documentation

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Type Title Date
* Data sheet UCC2742x-Q1 Dual 4-A High-Speed Low-Side MOSFET Drivers With Enable datasheet (Rev. I) PDF | HTML 28 Nov 2023
Application note Why use a Gate Drive Transformer? PDF | HTML 04 Mar 2024
Application note Review of Different Power Factor Correction (PFC) Topologies' Gate Driver Needs PDF | HTML 22 Jan 2024
Application brief External Gate Resistor Selection Guide (Rev. A) 28 Feb 2020
Application brief Understanding Peak IOH and IOL Currents (Rev. A) 28 Feb 2020
Application note Improving Efficiency of DC-DC Conversion through Layout 07 May 2019
Application brief How to overcome negative voltage transients on low-side gate drivers' inputs 18 Jan 2019
More literature Fundamentals of MOSFET and IGBT Gate Driver Circuits (Replaces SLUP169) (Rev. A) 29 Oct 2018
EVM User's guide UCC27423-4-5-Q1 EVM User’s Guide (Rev. A) 16 Apr 2018
Application note TMS3705 Range Extender Power Solution Using UCC27424-Q1 09 Aug 2012

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

UCC27423-4-5-Q1EVM — UCC2742xQ1 Dual 4-A High-Speed Low-Side MOSFET Drivers With Enable Evaluation Module (EVM)

The UCC2742xQ1 EVM is a high-speed dual MOSFET evaluation module that provides a test platform for a quick and easy startup of the UCC2742xQ1 driver. Powered by a single 4V to 15V external supply, and featuring a comprehensive set of test points and jumpers. All of the devices have separate input (...)
User guide: PDF
Not available on TI.com
Simulation model

UCC27424 PSpice Transient Model

SLUM322.ZIP (40 KB) - PSpice Model
Simulation model

UCC27424 Unencrypted PSpice Transient Model

SLUM508.ZIP (2 KB) - PSpice Model
Calculation tool

SLURB24 UCC2742X Schematic Review Template

Supported products & hardware

Supported products & hardware

Products
Low-side drivers
UCC27423 4-A/4-A dual-channel gate driver with 5-V UVLO, enable, and inverting inputs UCC27423-EP Enhanced Product 4-A/4-A dual-channel gate driver with inverting inputs UCC27423-Q1 Automotive 4-A/4-A dual-channel gate driver with enable and inverting inputs UCC27424 4-A/4-A dual-channel gate driver with enable and 5-V IN handling UCC27424-EP Enhanced Product 4-A/4-A dual-channel gate driver with enable UCC27424-Q1 Automotive 4-A/4-A dual-channel gate driver with enable UCC27425 4-A/4-A dual-channel gate driver with enable and inverting/non-inverting inputs UCC27425-Q1 Automotive 4-A/4-A dual-channel gate driver with inverting/non-inverting inputs
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Package Pins CAD symbols, footprints & 3D models
HVSSOP (DGN) 8 Ultra Librarian
SOIC (D) 8 Ultra Librarian

Ordering & quality

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  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

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