Product details

Number of input channels 4 Operating temperature range (°C) -40 to 125 Vs (min) (V) 2.7 Interface type I2C Resolution (Bits) 28 Rating Catalog
Number of input channels 4 Operating temperature range (°C) -40 to 125 Vs (min) (V) 2.7 Interface type I2C Resolution (Bits) 28 Rating Catalog
Download View video with transcript Video

Similar products you might be interested in

open-in-new Compare alternates
Similar functionality to the compared device
FDC1004 ACTIVE 4-channel 16-bit capacitance-to-digital converter with active shield driver for EMC protection This device is a 4-channel, high resolution FDC with integrated active shield drivers

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 20
Type Title Date
* Data sheet FDC2x1x Multi-Channel, High Resolution Capacitance-to-Digital Converter for Capacitive Sensing Applications datasheet (Rev. B) 10 Oct 2024
Application note Common Inductive and Capacitive Sensing Applications (Rev. B) PDF | HTML 22 Jun 2021
Application note Simulate Inductive Sensors Using FEMM (Finite Element Method Magnetics) (Rev. A) PDF | HTML 16 Jun 2021
Technical article Accurate frost or ice detection based on capacitive sensing PDF | HTML 01 Mar 2018
Application brief Quantifying Ice and Frost Buildup Using Capacitive Sensors 30 Nov 2017
Technical article How to ensure precision in automated processes PDF | HTML 07 Nov 2017
Application note Capacitive Proximity Sensing Using FDC2x1y (Rev. A) 20 Oct 2017
Technical article Comparing capacitive and ultrasonic kick-to-open sensing PDF | HTML 06 Sep 2017
EVM User's guide FDC2114 and FDC2214 EVM User’s Guide (Rev. A) 14 Sep 2016
Application note Ground Shifting in Capacitive Sensing Applications PDF | HTML 27 May 2016
Technical article How to remove the ground-shift phenomenon from your capacitive-sensing application PDF | HTML 09 May 2016
Technical article Engineers do better than magicians: HMI touch through a thick glass PDF | HTML 26 Apr 2016
Technical article Design an energy-efficient, lower-acoustic cooker hood with an elegant user interf PDF | HTML 29 Mar 2016
Technical article Reduce power consumption in your capacitive-sensing applications PDF | HTML 19 Jan 2016
Application note Power Consumption Analysis for Low Power Capacitive Sensing Applications PDF | HTML 18 Jan 2016
Technical article Capacitive sensing: simple algorithm for proximity sensing PDF | HTML 23 Nov 2015
Technical article Capacitive sensing: which architecture should you choose? PDF | HTML 20 Oct 2015
EVM User's guide FDC2214 Proximity and Capacitive Touch EVM User’s Guide 14 Oct 2015
Application note Derivative Integration Algorithm for Proximity Sensing 29 Sep 2015
Application note Capacitive Sensing: Direct vs Remote Liquid Level Sensing Performance Analysis (Rev. A) 24 Jul 2015

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

FDC2214EVM — FDC2214 with Two Capacitive Sensors Evaluation Module

The FDC2214 evaluation module demonstrates capacitive sensing technology to detect the presence of a conductive or non-conductive target. The evaluation module includes two PCB capacitive sensors that connect to two of the four channels of the FDC2214. An MSP430 microcontroller is used to interface (...)

User guide: PDF
Buy from a distributor
Evaluation board

FDC2214PROXSEN-EVM — FDC2214PROXSEN-EVM - Proximity and Capacitive Touch Sensing Evaluation Module

The FDC2214PROXSEN-EVM demonstrates capacitive proximity and touch button sensing with the use of TI's FDC221x capacitive sensing technology. The evaluation module is a complete hardware and firmware solution that integrates the 4-channel FDC2214, MSP430FR5969 and TPS61029 into one design. The (...)

User guide: PDF
Buy from a distributor

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos