Worldwide manufacturing
Building the next era of semiconductor manufacturing
Delivering geopolitically dependable supply
Designing and manufacturing innovative products has been at the core of our business for decades. We operate 15 sites around the globe, including wafer fabs, assembly and test factories, and bump and probe facilities, in addition to strategically located product distribution centers. We are expanding our internal operations – building on decades of proven and reliable manufacturing expertise – to provide the assurance of supply our customers need, to get products where and when they need them.
What sets us apart
Support for growth
We’re expanding our global manufacturing footprint with strategic investments in 300mm wafer fabs to support the capacity our customers will need for decades to come. Assembly and test factories and product distribution centers are undergoing continuous expansion and automation.
Control of our supply
Our internal wafer manufacturing and assembly and test operations are growing to support more than 95% of our production by 2030. This expanded footprint will give us control over our own supply to meet current and future demands.
Owning our process technologies
We’re investing and increasing capacity in 45 to 130nm nodes to meet the critical and long-term need for essential chips. We develop and own our process technologies to optimize products for price and performance.
Sustainable manufacturing
We have a long-standing commitment to responsible, sustainable manufacturing, including reusing or recycling water and 90% of our waste materials. Our new 300mm factories are designed to meet LEED Gold standards and will be powered by 100% renewable electricity.
300mm wafer fabs
300mm wafer fabs are the most efficient high-volume wafer factories in the world. The 300-millimeter (or 12-inch) wafer is the largest and most advanced diameter size for silicon wafers – able to hold millions of individual semiconductor chips. Our 300mm wafer fabs will produce more chips per wafer with advanced equipment and fully automated manufacturing flows for maximum efficiency.
Sherman, Texas (SM1, SM2, SM3, SM4)
Announced in November 2021, the site has the potential for four fabs operating as one site to meet demand over time. Construction is underway, and production from the first fab is expected in 2025.
Lehi, Utah (LFAB1, LFAB2)
LFAB was purchased in 2021 and began 300mm wafer production in 2022. Announced in February 2023, a second 300mm semiconductor wafer fab is under construction on the site and will connect to the existing fab.
Richardson, Texas (RFAB1, RFAB2)
RFAB opened in 2009 as the world’s first 300mm analog wafer fab. A second 300mm wafer fab connected to the first fab started production in 2022.
A flexible supply chain
We have owned and operated wafer fabs around the world for decades – producing high-quality and reliable chips. With increased investments to automate and modernize our existing fabs, we are able to efficiently manufacture billions of foundational semiconductors now and in the future. Coupled with our new 300mm capacity expansion projects, we can provide better assurance of the supply our customers need.
We own and operate assembly and test facilities (A/Ts) around the world, where the individual semiconductor chip is separated from the wafer and assembled, packaged and tested. The back-end manufacturing process is a key part of our internal manufacturing operations and undergoing continuous expansion, modernization and automation to support customer demand.
Once TI products are packaged and tested, they are shipped to one of our product distribution centers (PDCs), which are strategically located around the globe to provide fast, reliable delivery. We are continuously growing our PDC network with additional locations and automating systems to increase productivity.
Recent news
TI to receive proposed U.S. CHIPS Act funding
August 16, 2024 – Proposed funding, coupled with an estimated $6 billion to $8 billion in investment tax credit, will help TI provide geopolitically dependable, 300mm capacity for analog and embedded processing semiconductors.
Texas Instruments breaks ground on new 300mm semiconductor wafer fabrication plant in Utah
November 2, 2023 – TI announces plans with the Alpine School District to create the first district-wide K-12 STEM learning community in the state.
Texas Instruments’ new manufacturing plant in North Texas becomes the first semiconductor factory in the United States to achieve LEED Gold version 4
August 29, 2023 – This stringent certification underscores the company’s long-standing commitment to responsible, sustainable manufacturing.
Media contact
For media questions, please reach out to mediarelations@ti.com.
Press kits
Click below to access TI manufacturing images, video b-roll and fact sheets.