The semiconductor chip manufacturing process starts with wafer fabrication (fab). Fab locations transform a circular piece of ultra-pure silicon, called silicon wafers, into individual chips through thousands of process machines, lasers, ultra-precision optics and advanced robotics. 

After the fab process, wafers go to assembly and test factories where chips are assembled into finished semiconductor components, tested to the appropriate specifications, and readied for shipment to our customers. Our internal manufacturing operations also include wafer bump and probe facilities, which are frequently co-located within our existing factories. 

Owning and controlling our manufacturing operations allow us to provide geopolitically dependable capacity to our customers around the world. With our internal manufacturing capabilities, we’re able to source more than 85% of our manufacturing flows and technologies at more than one site, quickly bring factories online and streamline product qualifications – all while adhering to strict quality specifications. Additionally, our robust business continuity processes helps us limit the interruption of production due to unexpected events.

When buying semiconductors from TI, you will receive information about the location where your product was manufactured and assembled. In most cases, you will find related information that includes the state/province along with the country/region on TI.com. Please see below for a list of commonly used abbreviations and terminology.