Lehi, Utah press kit

Access media resources related to TI's Lehi, Utah fabs

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News releases

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02 Nov 2023

Texas Instruments breaks ground on new 300mm semiconductor wafer fabrication plant in Utah

TI announces plans with the Alpine School District to create the first district-wide K-12 STEM learning community in the state

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15 Feb 2023

Texas Instruments selects Lehi, Utah, for its next 300-millimeter semiconductor wafer fab

The historic $11 billion investment in manufacturing capacity further extends the company's cost advantage and provides greater control of supply

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30 Jun 2021

TI to acquire Micron 300mm semiconductor factory, extending TI's cost advantage and greater control of supply chain

Facility in Lehi, Utah, will become TI's fourth 300mm wafer fab

Video b-roll

TI Lehi, Utah 300mm wafer fabs (LFAB1 & LFAB2)

Images

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TI Lehi, Utah, early rendering (LFAB2)

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TI Lehi, Utah, early rendering (LFAB2)

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TI Lehi, Utah, wafer fab (LFAB1)

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TI Lehi, Utah, wafer fab

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TI Lehi, Utah at work

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TI Lehi, Utah at work

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TI Lehi, Utah, wafer fab (LFAB2)

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TI Lehi, Utah, wafer fab (LFAB2)

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TI Lehi, Utah, groundbreaking

Texas Instruments President and CEO Haviv Ilan and Utah Governor Spencer Cox (center) join company and community leaders to break ground on TI’s second 300mm semiconductor wafer fab in Lehi, Utah.

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TI Lehi, Utah, groundbreaking

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TI Lehi, Utah, groundbreaking

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TI Lehi, Utah, wafer fab (LFAB2)

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TI Lehi, Utah site announcement (LFAB2)

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