Anwendungshinweise für SMT und Gehäuse
Hier finden Sie eine Zusammenstellung von Dokumenten zur Oberflächenmontagetechnologie (Surface Mount Technology, SMT) von TI und Anwendungshinweise zu einer Vielzahl von Gehäusethemen.
DSBGA
- NanoStar & NanoFree (PDF, 750 KB)
- Micro SMD Wafer Level Chip Scale Package (klein) (PDF, 13,4 MB)
- Laminate CSP – Anwendungshinweise (PDF, 28,9 MB)
- Mounting of Surface Components (PDF, 5,6 MB)
- Thermal Derating Curves for Logic-Products Packages (PDF, 70,5 KB)
- WCSP Handling Guide (PDF, 944 KB)
QFN
- Leadless Leadframe Package (LLP) Application Note (PDF, 20,8 MB)
- Quad Flatpack No-Lead Logic Packages (PDF, 1,0 MB)
- 56Pin Quad Flatpack No-Lead Logic Package (PDF, 276 KB)
- Design Guide 92NLA Array QFN (PDF, 1,1 KB)
- Design Summary Multi-row Quad Flat No-lead (MRQFN) (PDF, 696 KB)
- Micro SMDxt Wafer Level Chip Scale Package (large) (PDF, 6,1 KB)
- QFN/SON PCB Attachment Application (PDF, 877 KB)
- Reworking LLP Chip Scale Package (PDF, 146 KB)
- Soldering requirements for BQFN (PDF, 753 KB)
- Surface Mount Package Removal (PDF, 597 KB)
Gehäuse mit Anschlusspins
- Land Pattern Recommendations (PDF, 161 KB)
- PowerPAD Thermally enhanced package (PDF, 906 KB)
BGA
- 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (PDF, 20,8 MB)
- 32 Bit Logic Familes in LFBGA Packages (PDF, 1,0 MB)
- BGA Application Report for SMT (PDF, 276 KB)
- Flip Chip BGA Package Reference (PDF, 1,1 KB)
- nFBGA Packaging (PDF, 696 KB)
- Plastic Ball Grid Array SMT Guideline (PDF, 877 KB)
- Bumped Die Package (PDF, 146 KB)
- PCB design guidelines for 0.4mm POP (Part 1) (PDF, 753 KB)
- PCB design guidelines for 0.4mm POP (Part 2) (PDF, 906 KB)
- TI OMAP POP SMT design guideline (PDF, 161 KB)
- MicroStar BGA Packaging Reference Guide (PDF, 76 KB)
Sonstige Gehäuse
- TO-92 (PDF, 48 KB)
- FemtoFET SMT Guide (PDF, 13,4 KB)
- Mounting Consideration for TO-3 Packages (PDF, 13,4 MB)
- PowerFLEX Surface Mount Power Packaging (PDF, 90 KB)
- PowerPaD Made Easy (PDF, 20,8 MB)
- Thin Very Small-Outline Package TVSOP Application Report (PDF, 1,0 MB)
- TO-247 (PDF, 1,1 KB)
- TO-263 THIN Package (PDF, 276 KB)
- HotRod Design Guide (PDF, 676 KB)
Allgemeine Gehäuseinformationen
- Semiconductor Packaging Assembly Technology (PDF, 270 KB)
- Absolute Maximum Ratings for Soldering (PDF, 5,4 MB)
- Wave Solder Exposure of SMT Package (PDF, 878 KB)
- External Lead Finish for Plastic Packages (PDF, 787 KB)
- Handling & Process Recommendations (PDF, 324 KB)
- Plastic Package Moisture-Induced Cracking (PDF, 565 KB)
- Pb-free and Pb Compatibility (PDF, 3,2 MB)
- Electrical Performance of Packages (PDF, 21,4 MB)
Gehäuse-Referenzhandbücher
- Logic Packaging Migration (PDF, 654 KB)
- Design Summary for MicroSiP - enabled TPS8267xSiP (PDF, 321 KB)
- Analog and Logic Packaging (PDF, 213 KB)
- PCB/Substrate Passive SMT Design Guidelines (PDF, 271 KB)
Bild, thermische & elektrische Gehäuse
- Recent Advancements in Bus-Interface Packing and Processing (PDF, 546 KB)
- K-Factor Test-Board Design Impact on Thermal Impedance Measurements (PDF, 787 KB)
- Package Thermal Characterization Methodologies (PDF, 445 KB)
- Thermal Calculation Tools for Analog Components (PDF, 544 KB)
- Thermal Characteristics of Linear and Logic Packages Using JEDEC PCB Designs (PDF, 456 KB)
- Thermal Characteristics of Standard Linear and Logic (SLL) Packages and Devices (PDF, 27,4 MB)
- TMS320C6x Thermal Design Considerations (PDF, 2,1 MB)
- Thermal Calculator Application Note (PDF, 112 KB)
- IC Package Thermal Metrics (PDF, 211 KB)
- A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (PDF, 672 KB)
- Understanding IC Package Power Capabilities (PDF, 546 KB)
- Thermal Reference Sheet Analog (PDF, 201 KB)
- How to Use a PowerPad Device (PDF, 13,4 MB)
- How to use Psi-JT to calculate Junction Temperature (PDF, 279 KB)
- Using Thermal Metrics for Power Devices (PDF, 546 KB)
