SCES888C
May 2018 – May 2024
2N7001T
PRODUCTION DATA
1
1
Features
2
Applications
3
Description
4
Pin Configuration and Functions
5
Specifications
5.1
Absolute Maximum Ratings
5.2
ESD Ratings
5.3
Recommended Operating Conditions
5.4
Thermal Information
5.5
Electrical Characteristics
5.6
Switching Characteristics
5.7
Operating Characteristics
5.8
Typical Characteristics
6
Parameter Measurement Information
6.1
Load Circuit and Voltage Waveforms
7
Detailed Description
7.1
Overview
7.2
Functional Block Diagram
7.3
Feature Description
7.3.1
Up-Translation or Down-Translation from 1.65 V to 3.60 V
7.3.2
Balanced CMOS Push-Pull Outputs
7.3.3
Standard CMOS Inputs
7.3.4
Negative Clamping Diodes
7.3.5
Partial Power Down (Ioff)
7.3.6
Over-voltage Tolerant Inputs
7.4
Device Functional Modes
8
Application and Implementation
8.1
Application Information
8.2
Typical Applications
8.2.1
Processor Error Up Translation
8.2.1.1
Design Requirements
8.2.1.2
Detailed Design Procedure
8.2.1.3
Application Curve
8.2.2
Discrete FET Translation Replacement
8.3
Power Supply Recommendations
8.4
Layout
8.4.1
Layout Guidelines
8.4.2
Layout Example
9
Device and Documentation Support
9.1
Documentation Support
9.1.1
Related Documentation
9.2
Receiving Notification of Documentation Updates
9.3
Support Resources
9.4
Trademarks
9.5
Electrostatic Discharge Caution
9.6
Glossary
10
Revision History
11
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DPW|5
MPSS088
DCK|5
MPDS025I
Thermal pad, mechanical data (Package|Pins)
DPW|5
QFND567C
Orderable Information
sces888c_oa
sces888c_pm
6
Parameter Measurement Information