SPRS866G November   2012  – October 2017 66AK2H06 , 66AK2H12 , 66AK2H14

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
      1. 1.3.1 Enhancements in KeyStone II
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Package Terminals
    2. 4.2 Pin Map
    3. 4.3 Terminal Functions
    4. 4.4 Pullup/Pulldown Resistors
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Power Consumption Summary
    5. 5.5 Electrical Characteristics
    6. 5.6 Thermal Resistance Characteristics for PBGA Package [AAW]
    7. 5.7 Power Supply to Peripheral I/O Mapping
  6. 6 C66x CorePac
    1. 6.1 C66x DSP CorePac
    2. 6.2 Memory Architecture
      1. 6.2.1 L1P Memory
      2. 6.2.2 L1D Memory
      3. 6.2.3 L2 Memory
      4. 6.2.4 Multicore Shared Memory SRAM
      5. 6.2.5 L3 Memory
    3. 6.3 Memory Protection
    4. 6.4 Bandwidth Management
    5. 6.5 Power-Down Control
    6. 6.6 C66x CorePac Revision
    7. 6.7 C66x CorePac Register Descriptions
  7. 7 ARM CorePac
    1. 7.1 Features
    2. 7.2 System Integration
    3. 7.3 ARM Cortex-A15 Processor
      1. 7.3.1 Overview
      2. 7.3.2 Features
      3. 7.3.3 ARM Interrupt Controller
      4. 7.3.4 Endianess
    4. 7.4 CFG Connection
    5. 7.5 Main TeraNet Connection
    6. 7.6 Clocking and Reset
      1. 7.6.1 Clocking
      2. 7.6.2 Reset
  8. 8 Memory, Interrupts, and EDMA for 66AK2Hxx
    1. 8.1 Memory Map Summary for 66AK2Hxx
    2. 8.2 Memory Protection Unit (MPU) for 66AK2Hxx
      1. 8.2.1 MPU Registers
        1. 8.2.1.1 MPU Register Map
        2. 8.2.1.2 Device-Specific MPU Registers
          1. 8.2.1.2.1 Configuration Register (CONFIG)
      2. 8.2.2 MPU Programmable Range Registers
        1. 8.2.2.1 Programmable Range n Start Address Register (PROGn_MPSAR)
        2. 8.2.2.2 Programmable Range n - End Address Register (PROGn_MPEAR)
        3. 8.2.2.3 Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPAR)
    3. 8.3 Interrupts for 66AK2Hxx
      1. 8.3.1 Interrupt Sources and Interrupt Controller
      2. 8.3.2 CIC Registers
        1. 8.3.2.1 CIC0 Register Map
        2. 8.3.2.2 CIC1 Register Map
        3. 8.3.2.3 CIC2 Register Map
      3. 8.3.3 Inter-Processor Register Map
      4. 8.3.4 NMI and LRESET
    4. 8.4 Enhanced Direct Memory Access (EDMA3) Controller for 66AK2Hxx
      1. 8.4.1 EDMA3 Device-Specific Information
      2. 8.4.2 EDMA3 Channel Controller Configuration
      3. 8.4.3 EDMA3 Transfer Controller Configuration
      4. 8.4.4 EDMA3 Channel Synchronization Events
  9. 9 System Interconnect
    1. 9.1 Internal Buses and Switch Fabrics
    2. 9.2 Switch Fabric Connections Matrix - Data Space
    3. 9.3 TeraNet Switch Fabric Connections Matrix - Configuration Space
    4. 9.4 Bus Priorities
  10. 10Device Boot and Configuration
    1. 10.1 Device Boot
      1. 10.1.1 Boot Sequence
      2. 10.1.2 Boot Modes Supported
        1. 10.1.2.1 Boot Device Field
        2. 10.1.2.2 Device Configuration Field
          1. 10.1.2.2.1 Sleep Boot Mode Configuration
          2. 10.1.2.2.2 I2C Boot Device Configuration
            1. 10.1.2.2.2.1 I2C Passive Mode
            2. 10.1.2.2.2.2 I2C Master Mode
          3. 10.1.2.2.3 SPI Boot Device Configuration
          4. 10.1.2.2.4 EMIF Boot Device Configuration
          5. 10.1.2.2.5 NAND Boot Device Configuration
        3. 10.1.2.3 Serial Rapid I/O Boot Device Configuration
        4. 10.1.2.4 Ethernet (SGMII) Boot Device Configuration
          1. 10.1.2.4.1 PCIe Boot Device Configuration
          2. 10.1.2.4.2 HyperLink Boot Device Configuration
          3. 10.1.2.4.3 UART Boot Device Configuration
        5. 10.1.2.5 Boot Parameter Table
          1. 10.1.2.5.1  EMIF16 Boot Parameter Table
          2. 10.1.2.5.2  SRIO Boot Parameter Table
          3. 10.1.2.5.3  Ethernet Boot Parameter Table
          4. 10.1.2.5.4  PCIe Boot Parameter Table
          5. 10.1.2.5.5  I2C Boot Parameter Table
          6. 10.1.2.5.6  SPI Boot Parameter Table
          7. 10.1.2.5.7  HyperLink Boot Parameter Table
          8. 10.1.2.5.8  UART Boot Parameter Table
          9. 10.1.2.5.9  NAND Boot Parameter Table
          10. 10.1.2.5.10 DDR3 Configuration Table
        6. 10.1.2.6 Second-Level Bootloaders
      3. 10.1.3 SoC Security
      4. 10.1.4 System PLL Settings
        1. 10.1.4.1 ARM CorePac System PLL Settings
    2. 10.2 Device Configuration
      1. 10.2.1 Device Configuration at Device Reset
      2. 10.2.2 Peripheral Selection After Device Reset
      3. 10.2.3 Device State Control Registers
        1. 10.2.3.1  Device Status (DEVSTAT) Register
        2. 10.2.3.2  Device Configuration Register
        3. 10.2.3.3  JTAG ID (JTAGID) Register Description
        4. 10.2.3.4  Kicker Mechanism (KICK0 and KICK1) Register
        5. 10.2.3.5  DSP Boot Address Register (DSP_BOOT_ADDRn)
        6. 10.2.3.6  LRESETNMI PIN Status (LRSTNMIPINSTAT) Register
        7. 10.2.3.7  LRESETNMI PIN Status Clear (LRSTNMIPINSTAT_CLR) Register
        8. 10.2.3.8  Reset Status (RESET_STAT) Register
        9. 10.2.3.9  Reset Status Clear (RESET_STAT_CLR) Register
        10. 10.2.3.10 Boot Complete (BOOTCOMPLETE) Register
        11. 10.2.3.11 Power State Control (PWRSTATECTL) Register
        12. 10.2.3.12 NMI Event Generation to C66x CorePac (NMIGRx) Register
        13. 10.2.3.13 IPC Generation (IPCGRx) Registers
        14. 10.2.3.14 IPC Acknowledgment (IPCARx) Registers
        15. 10.2.3.15 IPC Generation Host (IPCGRH) Register
        16. 10.2.3.16 IPC Acknowledgment Host (IPCARH) Register
        17. 10.2.3.17 Timer Input Selection Register (TINPSEL)
        18. 10.2.3.18 Timer Output Selection Register (TOUTPSEL)
        19. 10.2.3.19 Reset Mux (RSTMUXx) Register
        20. 10.2.3.20 Device Speed (DEVSPEED) Register
        21. 10.2.3.21 ARM Endian Configuration Register 0 (ARMENDIAN_CFGr_0), r=0..7
        22. 10.2.3.22 ARM Endian Configuration Register 1 (ARMENDIAN_CFGr_1), r=0..7
        23. 10.2.3.23 ARM Endian Configuration Register 2 (ARMENDIAN_CFGr_2), r=0..7
        24. 10.2.3.24 Chip Miscellaneous Control (CHIP_MISC_CTL0) Register
        25. 10.2.3.25 Chip Miscellaneous Control (CHIP_MISC_CTL1) Register
        26. 10.2.3.26 System Endian Status Register (SYSENDSTAT)
        27. 10.2.3.27 SYNECLK_PINCTL Register
        28. 10.2.3.28 USB PHY Control (USB_PHY_CTLx) Registers
  11. 1166AK2Hxx Peripheral Information
    1. 11.1  Recommended Clock and Control Signal Transition Behavior
    2. 11.2  Power Supplies
      1. 11.2.1 Power-Up Sequencing
        1. 11.2.1.1 Core-Before-IO Power Sequencing
        2. 11.2.1.2 IO-Before-Core Power Sequencing
        3. 11.2.1.3 Prolonged Resets
        4. 11.2.1.4 Clocking During Power Sequencing
      2. 11.2.2 Power-Down Sequence
      3. 11.2.3 Power Supply Decoupling and Bulk Capacitor
      4. 11.2.4 SmartReflex
    3. 11.3  Power Sleep Controller (PSC)
      1. 11.3.1 Power Domains
      2. 11.3.2 Clock Domains
      3. 11.3.3 PSC Register Memory Map
    4. 11.4  Reset Controller
      1. 11.4.1 Power-on Reset
      2. 11.4.2 Hard Reset
      3. 11.4.3 Soft Reset
      4. 11.4.4 Local Reset
      5. 11.4.5 ARM CorePac Reset
      6. 11.4.6 Reset Priority
      7. 11.4.7 Reset Controller Register
      8. 11.4.8 Reset Electrical Data and Timing
    5. 11.5  Main PLL, ARM PLL, DDR3A PLL, DDR3B PLL, PASS PLL and the PLL Controllers
      1. 11.5.1 Main PLL Controller Device-Specific Information
        1. 11.5.1.1 Internal Clocks and Maximum Operating Frequencies
        2. 11.5.1.2 Local Clock Dividers
        3. 11.5.1.3 Module Clock Input
        4. 11.5.1.4 Main PLL Controller Operating Modes
        5. 11.5.1.5 Main PLL Stabilization, Lock, and Reset Times
      2. 11.5.2 PLL Controller Memory Map
        1. 11.5.2.1 PLL Secondary Control Register (SECCTL)
        2. 11.5.2.2 PLL Controller Divider Register (PLLDIV3 and PLLDIV4)
        3. 11.5.2.3 PLL Controller Clock Align Control Register (ALNCTL)
        4. 11.5.2.4 PLLDIV Divider Ratio Change Status Register (DCHANGE)
        5. 11.5.2.5 SYSCLK Status Register (SYSTAT)
        6. 11.5.2.6 Reset Type Status Register (RSTYPE)
        7. 11.5.2.7 Reset Control Register (RSTCTRL)
        8. 11.5.2.8 Reset Configuration Register (RSTCFG)
        9. 11.5.2.9 Reset Isolation Register (RSISO)
      3. 11.5.3 Main PLL Control Registers
      4. 11.5.4 ARM PLL Control Registers
      5. 11.5.5 Main PLL Controller, ARM, SRIO, HyperLink, PCIe, USB Clock Input Electrical Data and Timing
    6. 11.6  DDR3A PLL and DDR3B PLL
      1. 11.6.1 DDR3A PLL and DDR3B PLL Control Registers
      2. 11.6.2 DDR3A PLL and DDR3B PLL Device-Specific Information
      3. 11.6.3 DDR3 PLL Input Clock Electrical Data and Timing
    7. 11.7  PASS PLL
      1. 11.7.1 PASS PLL Local Clock Dividers
      2. 11.7.2 PASS PLL Control Registers
      3. 11.7.3 PASS PLL Device-Specific Information
      4. 11.7.4 PASS PLL Input Clock Electrical Data and Timing
    8. 11.8  External Interrupts
      1. 11.8.1 External Interrupts Electrical Data and Timing
    9. 11.9  DDR3A and DDR3B Memory Controllers
      1. 11.9.1 DDR3 Memory Controller Device-Specific Information
      2. 11.9.2 DDR3 Slew Rate Control
      3. 11.9.3 DDR3 Memory Controller Electrical Data and Timing
    10. 11.10 I2C Peripheral
      1. 11.10.1 I2C Device-Specific Information
      2. 11.10.2 I2C Peripheral Register Description
      3. 11.10.3 I2C Electrical Data and Timing
    11. 11.11 SPI Peripheral
      1. 11.11.1 SPI Electrical Data and Timing
    12. 11.12 HyperLink Peripheral
    13. 11.13 UART Peripheral
    14. 11.14 PCIe Peripheral
    15. 11.15 Packet Accelerator
    16. 11.16 Security Accelerator
    17. 11.17 Network Coprocessor Gigabit Ethernet (GbE) Switch Subsystem
    18. 11.18 SGMII and XFI Management Data Input/Output (MDIO)
    19. 11.19 Ten-Gigabit Ethernet (10GbE) Switch Subsystem
      1. 11.19.1 10GbE Supported Features
    20. 11.20 Timers
      1. 11.20.1 Timers Device-Specific Information
      2. 11.20.2 Timers Electrical Data and Timing
    21. 11.21 Serial RapidIO (SRIO) Port
      1. 11.21.1 Serial RapidIO Device-Specific Information
    22. 11.22 General-Purpose Input/Output (GPIO)
      1. 11.22.1 GPIO Device-Specific Information
      2. 11.22.2 GPIO Peripheral Register Description
      3. 11.22.3 GPIO Electrical Data and Timing
    23. 11.23 Semaphore2
    24. 11.24 Universal Serial Bus 3.0 (USB 3.0)
    25. 11.25 EMIF16 Peripheral
      1. 11.25.1 EMIF16 Electrical Data and Timing
    26. 11.26 Emulation Features and Capability
      1. 11.26.1 Chip-Level Features
        1. 11.26.1.1 ARM Subsystem Features
        2. 11.26.1.2 DSP Features
      2. 11.26.2 ICEPick Module
        1. 11.26.2.1 ICEPick Dynamic Tap Insertion
    27. 11.27 Debug Port (EMUx)
      1. 11.27.1 Concurrent Use of Debug Port
      2. 11.27.2 Master ID for Hardware and Software Messages
      3. 11.27.3 SoC Cross-Triggering Connection
      4. 11.27.4 Peripherals-Related Debug Requirement
      5. 11.27.5 Advanced Event Triggering (AET)
      6. 11.27.6 Trace
        1. 11.27.6.1 Trace Electrical Data and Timing
      7. 11.27.7 IEEE 1149.1 JTAG
        1. 11.27.7.1 IEEE 1149.1 JTAG Compatibility Statement
        2. 11.27.7.2 JTAG Electrical Data and Timing
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
    3. 12.3 Documentation Support
    4. 12.4 Related Links
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AAW|1517
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 ARM CorePac

The ARM CorePac is added in the 66AK2Hxx to enable the ability for layer 2 and layer 3 processing on-chip. Operations such as traffic control, local O&M, NBAP/FP termination, and SCTP processing can all be performed with the Cortex-A15 processor core.

The ARM CorePac of the 66AK2Hxx integrates one or more Cortex-A15 processor clusters with additional logic for bus protocol conversion, emulation, interrupt handling, and debug related enhancements. The Cortex-A15 processor is an ARMv7A-compatible, multi-issue out-of-order superscalar execution engine with integrated L1 caches. The implementation also supports advanced SIMDv2 (NEON technology) and VFPv4 (vector floating point) architecture extensions, security, virtualization, LPAE (large physical address extension), and multiprocessing extensions. The ARM CorePac includes a 4MB L2 cache and support for AMBA4 AXI and AXI coherence extension (ACE) protocols. An interrupt controller is included in the ARM CorePac to handle host interrupt requests in the system. For more information, see the KeyStone II Architecture ARM CorePac User's Guide.

The ARM CorePac has three functional clock domains, including a high-frequency clock domain used by the Cortex-A15. The high-frequency domain is isolated from the rest of the device by asynchronous bridges.

Figure 7-1 and Figure 7-2 show the ARM CorePac.

66AK2H14 66AK2H12 66AK2H06 ARM_CorePac_BD_36_38_H12.gif Figure 7-1 66AK2H12 ARM CorePac Block Diagram
66AK2H14 66AK2H12 66AK2H06 ARM_CorePac_BD_66AK2H06.gif Figure 7-2 66AK2H06 ARM CorePac Block Diagram

7.1 Features

The key features of the Quad Core ARM CorePac are as follows:

  • One or more Cortex-A15 processors, each containing:
    • Cortex-A15 processor revision R2P4.
    • ARM architecture version 7 ISA.
    • Multi-issue, out-of-order, superscalar pipeline.
    • L1 and L2 instruction and data cache of 32KB, 2-way, 16 word line with 128-bit interface.
    • Integrated L2 cache of 4MB, 16-way, 16-word line, 128-bit interface to L1 along with ECC/parity.
    • Includes the NEON™ media coprocessor (NEON), which implements the advanced SIMDv2 media processing architecture and the VFPv4 Vector Floating Point architecture.
    • The external interface uses the AXI protocol configured to 128-bit data width.
    • Includes the System Trace Macrocell (STM) support for noninvasive debugging.
    • Implements the ARMv7 debug with watchpoint and breakpoint registers and 32-bit advanced peripheral bus (APB) slave interface to CoreSight™ debug systems.
  • Interrupt controller
    • Supports up to 480 interrupt requests
  • Emulation/debug
    • Compatible with CoreSight architecture

7.2 System Integration

The ARM CorePac integrates the following group of submodules.

  • Cortex-A15 Processors: Provides a high processing capability, including the NEON technology for mobile multimedia acceleration. The Cortex-A15 communicates with the rest of the ARM CorePac through an AXI bus with an AXI2VBUSM bridge and receives interrupts from the ARM CorePac interrupt controller (ARM INTC).
  • Interrupt Controller: Handles interrupts from modules outside of the ARM CorePac (for details, see Section 7.3.3).
  • Clock Divider: Provides the required divided clocks to the internal modules of the ARM CorePac and has a clock input from the ARM PLL and the Main PLL
  • In-Circuit Emulator: Fully compatible with CoreSight architecture and enables debugging capabilities.

7.3 ARM Cortex-A15 Processor

7.3.1 Overview

The ARM Cortex-A15 processor incorporates the technologies available in the ARM7™ architecture. These technologies include NEON for media and signal processing and Jazelle® RCT for acceleration of real-time compilers, Thumb®-2 technology for code density, and the VFPv4 floating point architecture. For details, see the ARM Cortex-A15 Processor Technical Reference Manual.

7.3.2 Features

Table 7-1 shows the features supported by the Cortex-A15 processor core.

Table 7-1 Cortex-A15 Processor Core Supported Features

FEATURES DESCRIPTION
ARM version 7-A ISA Standard Cortex-A15 processor instruction set + Thumb2, ThumbEE, JazelleX Java accelerator, and media extensions
Backward compatible with previous ARM ISA versions
Cortex-A15 processor version R2P4
Integer core Main core for processing integer instructions
NEON core Gives greatly enhanced throughput for media workloads and VFP-Lite support
Architecture Extensions Security, virtualization and LPAE (40-bit physical address) extensions
L1 Lcache and Dcache 32KB, 2-way, 16 word line, 128 bit interface
L2 cache 4096KB, 16-way, 16 word line, 128 bit interface to L1, ECC/Parity is supported shared between cores
L2 valid bits cleared by software loop or by hardware
Cache Coherency Support for coherent memory accesses between A15 cores and other noncore master peripherals (Ex: EDMA) in the DDR3A and MSMC SRAM space.
Branch target address cache Dynamic branch prediction with Branch Target Buffer (BTB) and Global History Buffer (GHB), a return stack, and an indirect predictor
Enhanced memory management unit Mapping sizes are 4KB, 64KB, 1MB, and 16MB
Buses 128b AXI4 internal bus from Cortex-A15 converted to a 256b VBUSM to interface (through the MSMC) with MSMC SRAM, DDR EMIF, ROM, Interrupt controller and other system peripherals
Noninvasive Debug Support Processor instruction trace using 4x Program Trace Macrocell (CoreSight PTM), Data trace (print-f style debug) using System Trace Macrocell (CoreSight STM) and Performance Monitoring Units (PMU)
Misc Debug Support JTAG based debug and Cross triggering
Clocking Dedicated ARM PLL for flexible clocking scenarios
Voltage SmartReflex voltage domain for automatic voltage scaling
Power Support for standby modes and separate core power domains for additional leakage power reduction

7.3.3 ARM Interrupt Controller

The ARM CorePac interrupt controller (AINTC) is responsible for prioritizing all service requests from the system peripherals and the secondary interrupt controller CIC2 and then generating either nIRQ or nFIQ to the Cortex-A15 processor. The type of the interrupt (nIRQ or nFIQ) and the priority of the interrupt inputs are programmable. The AINTC interfaces to the Cortex-A15 processor via the AXI port through an VBUS2AXI bridge and runs at half the processor speed. It has the capability to handle up to 480 requests, which can be steered/prioritized as A15 nFIQ or nIRQ interrupt requests.

The general features of the AINTC are:

  • Up to 480 level sensitive shared peripheral interrupts (SPI) inputs
  • Individual priority for each interrupt input
  • Each interrupt can be steered to nFIQ or nIRQ
  • Independent priority sorting for nFIQ and nIRQ
  • Secure mask flag

On the chip level, there is a dedicated chip level interrupt controller to serve the ARM interrupt controller. See Section 8.3 for more details.

Figure 7-3 and Figure 7-4 show an overall view of the ARM CorePac Interrupt Controller.

66AK2H14 66AK2H12 66AK2H06 ARM_Inerrupt_Controller_2_Cores.gif Figure 7-3 ARM Interrupt Controller for Two Cortex-A15 Processor Cores
66AK2H14 66AK2H12 66AK2H06 ARM_Inerrupt_Controller_4_Cores.gif Figure 7-4 ARM Interrupt Controller for Four Cortex-A15 Processor Cores

7.3.4 Endianess

The ARM CorePac can operate in either little-endian or big-endian mode. When the ARM CorePac is in little-endian mode and the rest of the system is in big-endian mode, the bridges in the ARM CorePac are responsible for performing the endian conversion.

7.4 CFG Connection

The ARM CorePac has two slave ports. The 66AK2Hxx masters cannot access the ARM CorePac internal memory space.

  1. Slave port 0 (TeraNet 3P_A) is a 32-bit-wide port used for the ARM Trace module.
  2. Slave port 1 (TeraNet 3P_B) is a 32-bit-wide port used to access the rest of the system configuration.

7.5 Main TeraNet Connection

One master port comes out of the ARM CorePac. The master port is a 256-bit-wide port for the transactions going to the MSMC and DDR_EMIF data spaces.

7.6 Clocking and Reset

7.6.1 Clocking

The ARM CorePac includes a dedicated embedded DPLL (ARM PLL). The Cortex-A15 processor core clocks are sourced from this ARM PLL Controller. The Cortex-A15 processor core clock has a maximum frequency of 1.4 GHz. The ARM CorePac subsytem also uses the SYSCLK1 clock source from the main PLL which is locally divided (/1, /3 and /6) and provided to certain submodules inside the ARM CorePac. AINTC sub module runs at a frequency of SYSCLK1/6.

7.6.2 Reset

The ARM CorePac does not support local reset. It is reset whenever the device is under reset. In addition, the interrupt controller (AINTC) can only be reset during POR and RESETFULL. AINTC also resets whenever device is under reset.

For the complete programming model, refer to the KeyStone II Architecture ARM CorePac User's Guide.