SPRS866G November   2012  – October 2017 66AK2H06 , 66AK2H12 , 66AK2H14

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
      1. 1.3.1 Enhancements in KeyStone II
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Package Terminals
    2. 4.2 Pin Map
    3. 4.3 Terminal Functions
    4. 4.4 Pullup/Pulldown Resistors
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Power Consumption Summary
    5. 5.5 Electrical Characteristics
    6. 5.6 Thermal Resistance Characteristics for PBGA Package [AAW]
    7. 5.7 Power Supply to Peripheral I/O Mapping
  6. 6 C66x CorePac
    1. 6.1 C66x DSP CorePac
    2. 6.2 Memory Architecture
      1. 6.2.1 L1P Memory
      2. 6.2.2 L1D Memory
      3. 6.2.3 L2 Memory
      4. 6.2.4 Multicore Shared Memory SRAM
      5. 6.2.5 L3 Memory
    3. 6.3 Memory Protection
    4. 6.4 Bandwidth Management
    5. 6.5 Power-Down Control
    6. 6.6 C66x CorePac Revision
    7. 6.7 C66x CorePac Register Descriptions
  7. 7 ARM CorePac
    1. 7.1 Features
    2. 7.2 System Integration
    3. 7.3 ARM Cortex-A15 Processor
      1. 7.3.1 Overview
      2. 7.3.2 Features
      3. 7.3.3 ARM Interrupt Controller
      4. 7.3.4 Endianess
    4. 7.4 CFG Connection
    5. 7.5 Main TeraNet Connection
    6. 7.6 Clocking and Reset
      1. 7.6.1 Clocking
      2. 7.6.2 Reset
  8. 8 Memory, Interrupts, and EDMA for 66AK2Hxx
    1. 8.1 Memory Map Summary for 66AK2Hxx
    2. 8.2 Memory Protection Unit (MPU) for 66AK2Hxx
      1. 8.2.1 MPU Registers
        1. 8.2.1.1 MPU Register Map
        2. 8.2.1.2 Device-Specific MPU Registers
          1. 8.2.1.2.1 Configuration Register (CONFIG)
      2. 8.2.2 MPU Programmable Range Registers
        1. 8.2.2.1 Programmable Range n Start Address Register (PROGn_MPSAR)
        2. 8.2.2.2 Programmable Range n - End Address Register (PROGn_MPEAR)
        3. 8.2.2.3 Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPAR)
    3. 8.3 Interrupts for 66AK2Hxx
      1. 8.3.1 Interrupt Sources and Interrupt Controller
      2. 8.3.2 CIC Registers
        1. 8.3.2.1 CIC0 Register Map
        2. 8.3.2.2 CIC1 Register Map
        3. 8.3.2.3 CIC2 Register Map
      3. 8.3.3 Inter-Processor Register Map
      4. 8.3.4 NMI and LRESET
    4. 8.4 Enhanced Direct Memory Access (EDMA3) Controller for 66AK2Hxx
      1. 8.4.1 EDMA3 Device-Specific Information
      2. 8.4.2 EDMA3 Channel Controller Configuration
      3. 8.4.3 EDMA3 Transfer Controller Configuration
      4. 8.4.4 EDMA3 Channel Synchronization Events
  9. 9 System Interconnect
    1. 9.1 Internal Buses and Switch Fabrics
    2. 9.2 Switch Fabric Connections Matrix - Data Space
    3. 9.3 TeraNet Switch Fabric Connections Matrix - Configuration Space
    4. 9.4 Bus Priorities
  10. 10Device Boot and Configuration
    1. 10.1 Device Boot
      1. 10.1.1 Boot Sequence
      2. 10.1.2 Boot Modes Supported
        1. 10.1.2.1 Boot Device Field
        2. 10.1.2.2 Device Configuration Field
          1. 10.1.2.2.1 Sleep Boot Mode Configuration
          2. 10.1.2.2.2 I2C Boot Device Configuration
            1. 10.1.2.2.2.1 I2C Passive Mode
            2. 10.1.2.2.2.2 I2C Master Mode
          3. 10.1.2.2.3 SPI Boot Device Configuration
          4. 10.1.2.2.4 EMIF Boot Device Configuration
          5. 10.1.2.2.5 NAND Boot Device Configuration
        3. 10.1.2.3 Serial Rapid I/O Boot Device Configuration
        4. 10.1.2.4 Ethernet (SGMII) Boot Device Configuration
          1. 10.1.2.4.1 PCIe Boot Device Configuration
          2. 10.1.2.4.2 HyperLink Boot Device Configuration
          3. 10.1.2.4.3 UART Boot Device Configuration
        5. 10.1.2.5 Boot Parameter Table
          1. 10.1.2.5.1  EMIF16 Boot Parameter Table
          2. 10.1.2.5.2  SRIO Boot Parameter Table
          3. 10.1.2.5.3  Ethernet Boot Parameter Table
          4. 10.1.2.5.4  PCIe Boot Parameter Table
          5. 10.1.2.5.5  I2C Boot Parameter Table
          6. 10.1.2.5.6  SPI Boot Parameter Table
          7. 10.1.2.5.7  HyperLink Boot Parameter Table
          8. 10.1.2.5.8  UART Boot Parameter Table
          9. 10.1.2.5.9  NAND Boot Parameter Table
          10. 10.1.2.5.10 DDR3 Configuration Table
        6. 10.1.2.6 Second-Level Bootloaders
      3. 10.1.3 SoC Security
      4. 10.1.4 System PLL Settings
        1. 10.1.4.1 ARM CorePac System PLL Settings
    2. 10.2 Device Configuration
      1. 10.2.1 Device Configuration at Device Reset
      2. 10.2.2 Peripheral Selection After Device Reset
      3. 10.2.3 Device State Control Registers
        1. 10.2.3.1  Device Status (DEVSTAT) Register
        2. 10.2.3.2  Device Configuration Register
        3. 10.2.3.3  JTAG ID (JTAGID) Register Description
        4. 10.2.3.4  Kicker Mechanism (KICK0 and KICK1) Register
        5. 10.2.3.5  DSP Boot Address Register (DSP_BOOT_ADDRn)
        6. 10.2.3.6  LRESETNMI PIN Status (LRSTNMIPINSTAT) Register
        7. 10.2.3.7  LRESETNMI PIN Status Clear (LRSTNMIPINSTAT_CLR) Register
        8. 10.2.3.8  Reset Status (RESET_STAT) Register
        9. 10.2.3.9  Reset Status Clear (RESET_STAT_CLR) Register
        10. 10.2.3.10 Boot Complete (BOOTCOMPLETE) Register
        11. 10.2.3.11 Power State Control (PWRSTATECTL) Register
        12. 10.2.3.12 NMI Event Generation to C66x CorePac (NMIGRx) Register
        13. 10.2.3.13 IPC Generation (IPCGRx) Registers
        14. 10.2.3.14 IPC Acknowledgment (IPCARx) Registers
        15. 10.2.3.15 IPC Generation Host (IPCGRH) Register
        16. 10.2.3.16 IPC Acknowledgment Host (IPCARH) Register
        17. 10.2.3.17 Timer Input Selection Register (TINPSEL)
        18. 10.2.3.18 Timer Output Selection Register (TOUTPSEL)
        19. 10.2.3.19 Reset Mux (RSTMUXx) Register
        20. 10.2.3.20 Device Speed (DEVSPEED) Register
        21. 10.2.3.21 ARM Endian Configuration Register 0 (ARMENDIAN_CFGr_0), r=0..7
        22. 10.2.3.22 ARM Endian Configuration Register 1 (ARMENDIAN_CFGr_1), r=0..7
        23. 10.2.3.23 ARM Endian Configuration Register 2 (ARMENDIAN_CFGr_2), r=0..7
        24. 10.2.3.24 Chip Miscellaneous Control (CHIP_MISC_CTL0) Register
        25. 10.2.3.25 Chip Miscellaneous Control (CHIP_MISC_CTL1) Register
        26. 10.2.3.26 System Endian Status Register (SYSENDSTAT)
        27. 10.2.3.27 SYNECLK_PINCTL Register
        28. 10.2.3.28 USB PHY Control (USB_PHY_CTLx) Registers
  11. 1166AK2Hxx Peripheral Information
    1. 11.1  Recommended Clock and Control Signal Transition Behavior
    2. 11.2  Power Supplies
      1. 11.2.1 Power-Up Sequencing
        1. 11.2.1.1 Core-Before-IO Power Sequencing
        2. 11.2.1.2 IO-Before-Core Power Sequencing
        3. 11.2.1.3 Prolonged Resets
        4. 11.2.1.4 Clocking During Power Sequencing
      2. 11.2.2 Power-Down Sequence
      3. 11.2.3 Power Supply Decoupling and Bulk Capacitor
      4. 11.2.4 SmartReflex
    3. 11.3  Power Sleep Controller (PSC)
      1. 11.3.1 Power Domains
      2. 11.3.2 Clock Domains
      3. 11.3.3 PSC Register Memory Map
    4. 11.4  Reset Controller
      1. 11.4.1 Power-on Reset
      2. 11.4.2 Hard Reset
      3. 11.4.3 Soft Reset
      4. 11.4.4 Local Reset
      5. 11.4.5 ARM CorePac Reset
      6. 11.4.6 Reset Priority
      7. 11.4.7 Reset Controller Register
      8. 11.4.8 Reset Electrical Data and Timing
    5. 11.5  Main PLL, ARM PLL, DDR3A PLL, DDR3B PLL, PASS PLL and the PLL Controllers
      1. 11.5.1 Main PLL Controller Device-Specific Information
        1. 11.5.1.1 Internal Clocks and Maximum Operating Frequencies
        2. 11.5.1.2 Local Clock Dividers
        3. 11.5.1.3 Module Clock Input
        4. 11.5.1.4 Main PLL Controller Operating Modes
        5. 11.5.1.5 Main PLL Stabilization, Lock, and Reset Times
      2. 11.5.2 PLL Controller Memory Map
        1. 11.5.2.1 PLL Secondary Control Register (SECCTL)
        2. 11.5.2.2 PLL Controller Divider Register (PLLDIV3 and PLLDIV4)
        3. 11.5.2.3 PLL Controller Clock Align Control Register (ALNCTL)
        4. 11.5.2.4 PLLDIV Divider Ratio Change Status Register (DCHANGE)
        5. 11.5.2.5 SYSCLK Status Register (SYSTAT)
        6. 11.5.2.6 Reset Type Status Register (RSTYPE)
        7. 11.5.2.7 Reset Control Register (RSTCTRL)
        8. 11.5.2.8 Reset Configuration Register (RSTCFG)
        9. 11.5.2.9 Reset Isolation Register (RSISO)
      3. 11.5.3 Main PLL Control Registers
      4. 11.5.4 ARM PLL Control Registers
      5. 11.5.5 Main PLL Controller, ARM, SRIO, HyperLink, PCIe, USB Clock Input Electrical Data and Timing
    6. 11.6  DDR3A PLL and DDR3B PLL
      1. 11.6.1 DDR3A PLL and DDR3B PLL Control Registers
      2. 11.6.2 DDR3A PLL and DDR3B PLL Device-Specific Information
      3. 11.6.3 DDR3 PLL Input Clock Electrical Data and Timing
    7. 11.7  PASS PLL
      1. 11.7.1 PASS PLL Local Clock Dividers
      2. 11.7.2 PASS PLL Control Registers
      3. 11.7.3 PASS PLL Device-Specific Information
      4. 11.7.4 PASS PLL Input Clock Electrical Data and Timing
    8. 11.8  External Interrupts
      1. 11.8.1 External Interrupts Electrical Data and Timing
    9. 11.9  DDR3A and DDR3B Memory Controllers
      1. 11.9.1 DDR3 Memory Controller Device-Specific Information
      2. 11.9.2 DDR3 Slew Rate Control
      3. 11.9.3 DDR3 Memory Controller Electrical Data and Timing
    10. 11.10 I2C Peripheral
      1. 11.10.1 I2C Device-Specific Information
      2. 11.10.2 I2C Peripheral Register Description
      3. 11.10.3 I2C Electrical Data and Timing
    11. 11.11 SPI Peripheral
      1. 11.11.1 SPI Electrical Data and Timing
    12. 11.12 HyperLink Peripheral
    13. 11.13 UART Peripheral
    14. 11.14 PCIe Peripheral
    15. 11.15 Packet Accelerator
    16. 11.16 Security Accelerator
    17. 11.17 Network Coprocessor Gigabit Ethernet (GbE) Switch Subsystem
    18. 11.18 SGMII and XFI Management Data Input/Output (MDIO)
    19. 11.19 Ten-Gigabit Ethernet (10GbE) Switch Subsystem
      1. 11.19.1 10GbE Supported Features
    20. 11.20 Timers
      1. 11.20.1 Timers Device-Specific Information
      2. 11.20.2 Timers Electrical Data and Timing
    21. 11.21 Serial RapidIO (SRIO) Port
      1. 11.21.1 Serial RapidIO Device-Specific Information
    22. 11.22 General-Purpose Input/Output (GPIO)
      1. 11.22.1 GPIO Device-Specific Information
      2. 11.22.2 GPIO Peripheral Register Description
      3. 11.22.3 GPIO Electrical Data and Timing
    23. 11.23 Semaphore2
    24. 11.24 Universal Serial Bus 3.0 (USB 3.0)
    25. 11.25 EMIF16 Peripheral
      1. 11.25.1 EMIF16 Electrical Data and Timing
    26. 11.26 Emulation Features and Capability
      1. 11.26.1 Chip-Level Features
        1. 11.26.1.1 ARM Subsystem Features
        2. 11.26.1.2 DSP Features
      2. 11.26.2 ICEPick Module
        1. 11.26.2.1 ICEPick Dynamic Tap Insertion
    27. 11.27 Debug Port (EMUx)
      1. 11.27.1 Concurrent Use of Debug Port
      2. 11.27.2 Master ID for Hardware and Software Messages
      3. 11.27.3 SoC Cross-Triggering Connection
      4. 11.27.4 Peripherals-Related Debug Requirement
      5. 11.27.5 Advanced Event Triggering (AET)
      6. 11.27.6 Trace
        1. 11.27.6.1 Trace Electrical Data and Timing
      7. 11.27.7 IEEE 1149.1 JTAG
        1. 11.27.7.1 IEEE 1149.1 JTAG Compatibility Statement
        2. 11.27.7.2 JTAG Electrical Data and Timing
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
    3. 12.3 Documentation Support
    4. 12.4 Related Links
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AAW|1517
Thermal pad, mechanical data (Package|Pins)
Orderable Information

3 Device Comparison

Table 3-1 provides a comparison of the 66AK2Hxx devices. The table lists the significant features of the devices, including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin count.

Table 3-1 Device Features Comparison

HARDWARE FEATURES 66AK2H14 66AK2H12 66AK2H06
Cores C66x DSP 8 8 4
ARM Cortex-A15 MPCore 4 4 2
Peripherals 10-GbE 2 – –
DDR3 memory controller (72-bit bus width) 2 2 2
16-bit ASYNC EMIF 1 1 1
EDMA3 (64 independent channels) 5 5 5
High-speed 1×/2×/4× Serial RapidIO port (4 lanes) 1 1 1
HyperLink (4 lanes) 2 2 2
I2C 3 3 3
SPI 3 3 3
PCIe (2 lanes) 1 1 1
USB 3.0 1 1 1
UART 2 2 2
10/100/1000 Ethernet 4 4 4
Management Data Input/Output (MDIO) 1 1 1
64-bit timers (configurable) Twenty 64-bit or Forty 32-bit Twenty 64-bit or Forty 32-bit Fourteen 64-bit or Twenty Eight 32-bit
General-Purpose Input/Output port (GPIO) 32 32 32
Accelerators Packet Accelerator 1 1 1
Security Accelerator(1) 1 1 1
On-Chip Memory Organization L1 program memory controller (C66x) 32KB per CorePac 32KB per CorePac 32KB per CorePac
L1 data memory controller (C66x) 32KB per CorePac 32KB per CorePac 32KB per CorePac
Shared L2 cache (C66x) 8192KB 8192KB 4096KB
L3 ROM (C66x) 128KB 128KB 128KB
L1 program memory controller (ARM Cortex-A15) 32KB per CorePac 32KB per CorePac 32KB per CorePac
L1 data memory controller (ARM Cortex-A15) 32KB per CorePac 32KB per CorePac 32KB per CorePac
Shared L2 cache (ARM Cortex-A15) 4096KB 4096KB 4096KB
L3 ROM (ARM Cortex-A15) 256KB 256KB 256KB
MSMC 6MB 6MB 6MB
C66x CorePac Revision ID CorePac Revision ID Register
(address location: 0181 2000h) 		0x0009_0000 (PG 1.0)
0x0009_0002 (PG 1.1)
0x0009_0003 (PG 2.0)
0x0009_0003 (PG 3.0)
0x0009_0003 (PG 3.1)		 0x0009_0000 (PG 1.0)
0x0009_0002 (PG 1.1)
0x0009_0003 (PG 2.0)
0x0009_0003 (PG 3.0)
0x0009_0003 (PG 3.1)		 0x0009_0000 (PG 1.0)
0x0009_0002 (PG 1.1)
0x0009_0003 (PG 2.0)
0x0009_0003 (PG 3.0)
0x0009_0003 (PG 3.1)
JTAG BSDL_ID JTAGID Register
(address location: 0x02620018) 		0x0b98102f (PG 1.0)
0x1b98102f (PG 1.1)
0x2b98102f (PG 2.0)
0x3b98102f (PG 3.0)
0xbb98102f (PG 3.1)		 0x0b98102f (PG 1.0)
0x1b98102f (PG 1.1)
0x2b98102f (PG 2.0)
0x3b98102f (PG 3.0)
0xbb98102f (PG 3.1)		 0x0b98102f (PG 1.0)
0x1b98102f (PG 1.1)
0x2b98102f (PG 2.0)
0x3b98102f (PG 3.0)
0xbb98102f (PG 3.1)
Frequency C66x Up to 1.2 GHz Up to 1.2 GHz Up to 1.2 GHz
ARM Cortex-A15 Up to 1.4 GHz Up to 1.4 GHz Up to 1.4 GHz
Voltage Core (V) SmartReflex™ variable supply SmartReflex™ variable supply SmartReflex™ variable supply
I/O (V) 0.85 V, 1.0 V, 1.35 V, 1.5 V, 1.8 V and 3.3 V 0.85 V, 1.0 V, 1.35 V, 1.5 V, 1.8 V and 3.3 V 0.85 V, 1.0 V, 1.35 V, 1.5 V, 1.8 V and 3.3 V
BGA Package 40 mm × 40 mm 1517-pin flip-chip plastic BGA (AAW) 1517-pin flip-chip plastic BGA (AAW) 1517-pin flip-chip plastic BGA (AAW)
Process Technology µm 0.028 µm 0.028 µm 0.028 µm
(1) The Security Accelerator function is subject to export control and will be enabled only for approved device shipments.

3.1 Related Products

For information about other devices in this family of products or related products, see the following links.