SPRS866G November   2012  – October 2017 66AK2H06 , 66AK2H12 , 66AK2H14

PRODUCTION DATA.  

  1. 1 Device Overview
    1. 1.1 Features
    2. 1.2 Applications
    3. 1.3 Description
      1. 1.3.1 Enhancements in KeyStone II
    4. 1.4 Functional Block Diagram
  2. 2 Revision History
  3. 3 Device Comparison
    1. 3.1 Related Products
  4. 4 Terminal Configuration and Functions
    1. 4.1 Package Terminals
    2. 4.2 Pin Map
    3. 4.3 Terminal Functions
    4. 4.4 Pullup/Pulldown Resistors
  5. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Power Consumption Summary
    5. 5.5 Electrical Characteristics
    6. 5.6 Thermal Resistance Characteristics for PBGA Package [AAW]
    7. 5.7 Power Supply to Peripheral I/O Mapping
  6. 6 C66x CorePac
    1. 6.1 C66x DSP CorePac
    2. 6.2 Memory Architecture
      1. 6.2.1 L1P Memory
      2. 6.2.2 L1D Memory
      3. 6.2.3 L2 Memory
      4. 6.2.4 Multicore Shared Memory SRAM
      5. 6.2.5 L3 Memory
    3. 6.3 Memory Protection
    4. 6.4 Bandwidth Management
    5. 6.5 Power-Down Control
    6. 6.6 C66x CorePac Revision
    7. 6.7 C66x CorePac Register Descriptions
  7. 7 ARM CorePac
    1. 7.1 Features
    2. 7.2 System Integration
    3. 7.3 ARM Cortex-A15 Processor
      1. 7.3.1 Overview
      2. 7.3.2 Features
      3. 7.3.3 ARM Interrupt Controller
      4. 7.3.4 Endianess
    4. 7.4 CFG Connection
    5. 7.5 Main TeraNet Connection
    6. 7.6 Clocking and Reset
      1. 7.6.1 Clocking
      2. 7.6.2 Reset
  8. 8 Memory, Interrupts, and EDMA for 66AK2Hxx
    1. 8.1 Memory Map Summary for 66AK2Hxx
    2. 8.2 Memory Protection Unit (MPU) for 66AK2Hxx
      1. 8.2.1 MPU Registers
        1. 8.2.1.1 MPU Register Map
        2. 8.2.1.2 Device-Specific MPU Registers
          1. 8.2.1.2.1 Configuration Register (CONFIG)
      2. 8.2.2 MPU Programmable Range Registers
        1. 8.2.2.1 Programmable Range n Start Address Register (PROGn_MPSAR)
        2. 8.2.2.2 Programmable Range n - End Address Register (PROGn_MPEAR)
        3. 8.2.2.3 Programmable Range n Memory Protection Page Attribute Register (PROGn_MPPAR)
    3. 8.3 Interrupts for 66AK2Hxx
      1. 8.3.1 Interrupt Sources and Interrupt Controller
      2. 8.3.2 CIC Registers
        1. 8.3.2.1 CIC0 Register Map
        2. 8.3.2.2 CIC1 Register Map
        3. 8.3.2.3 CIC2 Register Map
      3. 8.3.3 Inter-Processor Register Map
      4. 8.3.4 NMI and LRESET
    4. 8.4 Enhanced Direct Memory Access (EDMA3) Controller for 66AK2Hxx
      1. 8.4.1 EDMA3 Device-Specific Information
      2. 8.4.2 EDMA3 Channel Controller Configuration
      3. 8.4.3 EDMA3 Transfer Controller Configuration
      4. 8.4.4 EDMA3 Channel Synchronization Events
  9. 9 System Interconnect
    1. 9.1 Internal Buses and Switch Fabrics
    2. 9.2 Switch Fabric Connections Matrix - Data Space
    3. 9.3 TeraNet Switch Fabric Connections Matrix - Configuration Space
    4. 9.4 Bus Priorities
  10. 10Device Boot and Configuration
    1. 10.1 Device Boot
      1. 10.1.1 Boot Sequence
      2. 10.1.2 Boot Modes Supported
        1. 10.1.2.1 Boot Device Field
        2. 10.1.2.2 Device Configuration Field
          1. 10.1.2.2.1 Sleep Boot Mode Configuration
          2. 10.1.2.2.2 I2C Boot Device Configuration
            1. 10.1.2.2.2.1 I2C Passive Mode
            2. 10.1.2.2.2.2 I2C Master Mode
          3. 10.1.2.2.3 SPI Boot Device Configuration
          4. 10.1.2.2.4 EMIF Boot Device Configuration
          5. 10.1.2.2.5 NAND Boot Device Configuration
        3. 10.1.2.3 Serial Rapid I/O Boot Device Configuration
        4. 10.1.2.4 Ethernet (SGMII) Boot Device Configuration
          1. 10.1.2.4.1 PCIe Boot Device Configuration
          2. 10.1.2.4.2 HyperLink Boot Device Configuration
          3. 10.1.2.4.3 UART Boot Device Configuration
        5. 10.1.2.5 Boot Parameter Table
          1. 10.1.2.5.1  EMIF16 Boot Parameter Table
          2. 10.1.2.5.2  SRIO Boot Parameter Table
          3. 10.1.2.5.3  Ethernet Boot Parameter Table
          4. 10.1.2.5.4  PCIe Boot Parameter Table
          5. 10.1.2.5.5  I2C Boot Parameter Table
          6. 10.1.2.5.6  SPI Boot Parameter Table
          7. 10.1.2.5.7  HyperLink Boot Parameter Table
          8. 10.1.2.5.8  UART Boot Parameter Table
          9. 10.1.2.5.9  NAND Boot Parameter Table
          10. 10.1.2.5.10 DDR3 Configuration Table
        6. 10.1.2.6 Second-Level Bootloaders
      3. 10.1.3 SoC Security
      4. 10.1.4 System PLL Settings
        1. 10.1.4.1 ARM CorePac System PLL Settings
    2. 10.2 Device Configuration
      1. 10.2.1 Device Configuration at Device Reset
      2. 10.2.2 Peripheral Selection After Device Reset
      3. 10.2.3 Device State Control Registers
        1. 10.2.3.1  Device Status (DEVSTAT) Register
        2. 10.2.3.2  Device Configuration Register
        3. 10.2.3.3  JTAG ID (JTAGID) Register Description
        4. 10.2.3.4  Kicker Mechanism (KICK0 and KICK1) Register
        5. 10.2.3.5  DSP Boot Address Register (DSP_BOOT_ADDRn)
        6. 10.2.3.6  LRESETNMI PIN Status (LRSTNMIPINSTAT) Register
        7. 10.2.3.7  LRESETNMI PIN Status Clear (LRSTNMIPINSTAT_CLR) Register
        8. 10.2.3.8  Reset Status (RESET_STAT) Register
        9. 10.2.3.9  Reset Status Clear (RESET_STAT_CLR) Register
        10. 10.2.3.10 Boot Complete (BOOTCOMPLETE) Register
        11. 10.2.3.11 Power State Control (PWRSTATECTL) Register
        12. 10.2.3.12 NMI Event Generation to C66x CorePac (NMIGRx) Register
        13. 10.2.3.13 IPC Generation (IPCGRx) Registers
        14. 10.2.3.14 IPC Acknowledgment (IPCARx) Registers
        15. 10.2.3.15 IPC Generation Host (IPCGRH) Register
        16. 10.2.3.16 IPC Acknowledgment Host (IPCARH) Register
        17. 10.2.3.17 Timer Input Selection Register (TINPSEL)
        18. 10.2.3.18 Timer Output Selection Register (TOUTPSEL)
        19. 10.2.3.19 Reset Mux (RSTMUXx) Register
        20. 10.2.3.20 Device Speed (DEVSPEED) Register
        21. 10.2.3.21 ARM Endian Configuration Register 0 (ARMENDIAN_CFGr_0), r=0..7
        22. 10.2.3.22 ARM Endian Configuration Register 1 (ARMENDIAN_CFGr_1), r=0..7
        23. 10.2.3.23 ARM Endian Configuration Register 2 (ARMENDIAN_CFGr_2), r=0..7
        24. 10.2.3.24 Chip Miscellaneous Control (CHIP_MISC_CTL0) Register
        25. 10.2.3.25 Chip Miscellaneous Control (CHIP_MISC_CTL1) Register
        26. 10.2.3.26 System Endian Status Register (SYSENDSTAT)
        27. 10.2.3.27 SYNECLK_PINCTL Register
        28. 10.2.3.28 USB PHY Control (USB_PHY_CTLx) Registers
  11. 1166AK2Hxx Peripheral Information
    1. 11.1  Recommended Clock and Control Signal Transition Behavior
    2. 11.2  Power Supplies
      1. 11.2.1 Power-Up Sequencing
        1. 11.2.1.1 Core-Before-IO Power Sequencing
        2. 11.2.1.2 IO-Before-Core Power Sequencing
        3. 11.2.1.3 Prolonged Resets
        4. 11.2.1.4 Clocking During Power Sequencing
      2. 11.2.2 Power-Down Sequence
      3. 11.2.3 Power Supply Decoupling and Bulk Capacitor
      4. 11.2.4 SmartReflex
    3. 11.3  Power Sleep Controller (PSC)
      1. 11.3.1 Power Domains
      2. 11.3.2 Clock Domains
      3. 11.3.3 PSC Register Memory Map
    4. 11.4  Reset Controller
      1. 11.4.1 Power-on Reset
      2. 11.4.2 Hard Reset
      3. 11.4.3 Soft Reset
      4. 11.4.4 Local Reset
      5. 11.4.5 ARM CorePac Reset
      6. 11.4.6 Reset Priority
      7. 11.4.7 Reset Controller Register
      8. 11.4.8 Reset Electrical Data and Timing
    5. 11.5  Main PLL, ARM PLL, DDR3A PLL, DDR3B PLL, PASS PLL and the PLL Controllers
      1. 11.5.1 Main PLL Controller Device-Specific Information
        1. 11.5.1.1 Internal Clocks and Maximum Operating Frequencies
        2. 11.5.1.2 Local Clock Dividers
        3. 11.5.1.3 Module Clock Input
        4. 11.5.1.4 Main PLL Controller Operating Modes
        5. 11.5.1.5 Main PLL Stabilization, Lock, and Reset Times
      2. 11.5.2 PLL Controller Memory Map
        1. 11.5.2.1 PLL Secondary Control Register (SECCTL)
        2. 11.5.2.2 PLL Controller Divider Register (PLLDIV3 and PLLDIV4)
        3. 11.5.2.3 PLL Controller Clock Align Control Register (ALNCTL)
        4. 11.5.2.4 PLLDIV Divider Ratio Change Status Register (DCHANGE)
        5. 11.5.2.5 SYSCLK Status Register (SYSTAT)
        6. 11.5.2.6 Reset Type Status Register (RSTYPE)
        7. 11.5.2.7 Reset Control Register (RSTCTRL)
        8. 11.5.2.8 Reset Configuration Register (RSTCFG)
        9. 11.5.2.9 Reset Isolation Register (RSISO)
      3. 11.5.3 Main PLL Control Registers
      4. 11.5.4 ARM PLL Control Registers
      5. 11.5.5 Main PLL Controller, ARM, SRIO, HyperLink, PCIe, USB Clock Input Electrical Data and Timing
    6. 11.6  DDR3A PLL and DDR3B PLL
      1. 11.6.1 DDR3A PLL and DDR3B PLL Control Registers
      2. 11.6.2 DDR3A PLL and DDR3B PLL Device-Specific Information
      3. 11.6.3 DDR3 PLL Input Clock Electrical Data and Timing
    7. 11.7  PASS PLL
      1. 11.7.1 PASS PLL Local Clock Dividers
      2. 11.7.2 PASS PLL Control Registers
      3. 11.7.3 PASS PLL Device-Specific Information
      4. 11.7.4 PASS PLL Input Clock Electrical Data and Timing
    8. 11.8  External Interrupts
      1. 11.8.1 External Interrupts Electrical Data and Timing
    9. 11.9  DDR3A and DDR3B Memory Controllers
      1. 11.9.1 DDR3 Memory Controller Device-Specific Information
      2. 11.9.2 DDR3 Slew Rate Control
      3. 11.9.3 DDR3 Memory Controller Electrical Data and Timing
    10. 11.10 I2C Peripheral
      1. 11.10.1 I2C Device-Specific Information
      2. 11.10.2 I2C Peripheral Register Description
      3. 11.10.3 I2C Electrical Data and Timing
    11. 11.11 SPI Peripheral
      1. 11.11.1 SPI Electrical Data and Timing
    12. 11.12 HyperLink Peripheral
    13. 11.13 UART Peripheral
    14. 11.14 PCIe Peripheral
    15. 11.15 Packet Accelerator
    16. 11.16 Security Accelerator
    17. 11.17 Network Coprocessor Gigabit Ethernet (GbE) Switch Subsystem
    18. 11.18 SGMII and XFI Management Data Input/Output (MDIO)
    19. 11.19 Ten-Gigabit Ethernet (10GbE) Switch Subsystem
      1. 11.19.1 10GbE Supported Features
    20. 11.20 Timers
      1. 11.20.1 Timers Device-Specific Information
      2. 11.20.2 Timers Electrical Data and Timing
    21. 11.21 Serial RapidIO (SRIO) Port
      1. 11.21.1 Serial RapidIO Device-Specific Information
    22. 11.22 General-Purpose Input/Output (GPIO)
      1. 11.22.1 GPIO Device-Specific Information
      2. 11.22.2 GPIO Peripheral Register Description
      3. 11.22.3 GPIO Electrical Data and Timing
    23. 11.23 Semaphore2
    24. 11.24 Universal Serial Bus 3.0 (USB 3.0)
    25. 11.25 EMIF16 Peripheral
      1. 11.25.1 EMIF16 Electrical Data and Timing
    26. 11.26 Emulation Features and Capability
      1. 11.26.1 Chip-Level Features
        1. 11.26.1.1 ARM Subsystem Features
        2. 11.26.1.2 DSP Features
      2. 11.26.2 ICEPick Module
        1. 11.26.2.1 ICEPick Dynamic Tap Insertion
    27. 11.27 Debug Port (EMUx)
      1. 11.27.1 Concurrent Use of Debug Port
      2. 11.27.2 Master ID for Hardware and Software Messages
      3. 11.27.3 SoC Cross-Triggering Connection
      4. 11.27.4 Peripherals-Related Debug Requirement
      5. 11.27.5 Advanced Event Triggering (AET)
      6. 11.27.6 Trace
        1. 11.27.6.1 Trace Electrical Data and Timing
      7. 11.27.7 IEEE 1149.1 JTAG
        1. 11.27.7.1 IEEE 1149.1 JTAG Compatibility Statement
        2. 11.27.7.2 JTAG Electrical Data and Timing
  12. 12Device and Documentation Support
    1. 12.1 Device Nomenclature
    2. 12.2 Tools and Software
    3. 12.3 Documentation Support
    4. 12.4 Related Links
    5. 12.5 Community Resources
    6. 12.6 Trademarks
    7. 12.7 Electrostatic Discharge Caution
    8. 12.8 Glossary
  13. 13Mechanical, Packaging, and Orderable Information
    1. 13.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • AAW|1517
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Device Boot and Configuration

10.1 Device Boot

10.1.1 Boot Sequence

The boot sequence is a process by which the internal memory is loaded with program and data sections. The boot sequence is started automatically after each power-on reset or warm reset.

The 66AK2Hxx supports several boot processes that begin execution at the ROM base address, which contains the bootloader code necessary to support various device boot modes. The boot processes are software-driven and use the BOOTMODE[15:0] device configuration inputs to determine the software configuration that must be completed. For more details on boot sequence, see the KeyStone II Architecture ARM Bootloader User's Guide.

For 66AK2Hxx nonsecure devices, there are two types of booting: the C66x CorePac as the boot master and the ARM CorePac as the boot master. For secure devices, the C66x CorePac is always the secure master and the C66x CorePac0 or ARM CorePac Core0 can be the boot master. The ARM CorePac does not support no-boot mode. Both the C66x CorePacs and the ARM CorePac need to read the BOOTMODE register to determine how to proceed with the boot.

Table 10-1 shows memory space reserved for boot by the C66x CorePac.

Table 10-1 C66x DSP Boot RAM Memory Map

START ADDRESS SIZE DESCRIPTION
0x80_0000 0x1_0000 Reserved
0x8e_7f80 0x80 C66x CorePac ROM version string
0x8e_8000 0x7f00 Boot Master Table overlayed with scratch
0x8e_767c 4 Boot Master Table Valid Length Field
0x8e_fff0 4 Host Data Address (boot magic address for secure boot through master peripherals)
0x8f_7800 0x410 Secure host Data structure
0x8f_a290 0x4000 Boot Stack
0x8f_e290 0x90 Boot Log Data
0x8f_e320 0x20 Boot Status Stack
0x8f_e410 0xf0 Boot Stats
0x8f_e520 0x13fc Boot Data
0x8f_f91c 0x404 Boot Trace Info
0x8f_fd20 0x180 DDR Config
0x8f_fea0 0x60 Boot RAM call table
0x8f_ff00 0x80 Boot Parameter table
0x8f_fff8 0x4 Secure Signal Magic address
0x8f_fffc 0x4 Boot Magic address

Table 10-2 shows addresses reserved for boot by the ARM CorePac.

Table 10-2 ARM Boot RAM Memory Map

START ADDRESS SIZE DESCRIPTION
0xc57_e000 0xc00 Context RAM not scrubbed on secure boot
0xc58_6f80 0x80 Global level 0 nonsecure translation table
0xc58_7000 0x5000 Global nonsecure page table for memory covering ROM
0xc58_c000 0x1000 Core 0 nonsecure level 1 translation table
0xc58_d000 0x1000 Core 1 nonsecure level 1 translation table
0xc58_e000 0x1000 Core 2 nonsecure level 1 translation table
0xc58_f000 0x1000 Core 3 nonsecure level 1 translation table
0xc59_0000 0x7f00 Packet memory buffer
0xc59_7f00 4 Host Data Address (boot magic address for secure boot through master peripherals)
0xc5a_6e00 0x200 DDR3a configuration structure
0xc5a_7000 0x3000 Boot Data
0xc5a_a000 0x3000 Supervisor stack, each core gets 0xc00 bytes
0xc5a_d000 4 Arm boot magic address, core 0
0xc5a_d004 4 Arm boot magic address, core 1
0xc5a_d008 4 Arm boot magic address, core 2
0xc5a_d00c 4 Arm boot magic address, core 3
0xc5a_e000 0x400 Abort stack, core 0
0xc5a_e400 0x400 Abort stack, core 1
0xc5a_e800 0x400 Abort stack, core 2
0xc5a_ec00 0x400 Abort stack, core 3
0xc5a_f000 0x400 Unknown mode stack, core 0
0xc5a_f400 0x400 Unknown mode stack, core 1
0xc5a_f800 0x400 Unknown mode stack, core 2
0xc5a_fc00 0x400 Unknown mode stack, core 3
0xc5b_0000 0x180 Boot Version string, core 0
0xc5b_0180 0x80 Boot status stack, core 0
0xc5b_0200 0x100 Boot stats, core 0
0xc5b_0300 0x100 Boot log, core 0
0x5b_0400 0x100 Boot RAM call table, core 0
0xc5b_0500 0x100 Boot parameter tables, core 0
0xc5b_0600 0x19e0 Boot Data, core 0
0xc5b_1fe0 0x1010 Boot Trace, core 0
0xc5b_4000 0x180 Boot Version string, core 1
0xc5b_4180 0x80 Boot status stack, core 1
0xc5b_4200 0x100 Boot stats, core 1
0xc5b_4300 0x100 Boot log, core 1
0x5b_4400 0x100 Boot RAM call table, core 1
0xc5b_4500 0x100 Boot parameter tables, core 1
0xc5b_4600 0x19e0 Boot Data, core 1
0xc5b_5fe0 0x1010 Boot Trace, core 1
0xc5b_8000 0x180 Boot Version string, core 2
0xc5b_8180 0x80 Boot status stack, core 2
0xc5b_8200 0x100 Boot stats, core 2
0xc5b_8300 0x100 Boot log, core 2
0x5b_8400 0x100 Boot RAM call table, core 2
0xc5b_8500 0x100 Boot parameter tables, core 2
0xc5b_8600 0x19e0 Boot Data, core 2
0xc5b_9fe0 0x1010 Boot Trace, core 2
0xc5b_c000 0x180 Boot Version string, core 3
0xc5b_c180 0x80 Boot status stack, core 3
0xc5b_c200 0x100 Boot stats, core 3
0xc5b_c300 0x100 Boot log, core 3
0x5b_c400 0x100 Boot RAM call table, core 3
0xc5b_c500 0x100 Boot parameter tables, core 3
0xc5b_c600 0x19e0 Boot Data, core 3
0xc5b_dfe0 0x1010 Boot Trace, core 3
0xc5c_0000 0x4_0000 Secure MSMC

10.1.2 Boot Modes Supported

The device supports several boot processes, which leverage the internal boot ROM. Most boot processes are software-driven, using the BOOTMODE[15:0] device configuration inputs to determine the software configuration that must be completed. From a hardware perspective, there are four possible boot modes:

  • Public ROM Boot when the C66x CorePac0 is the boot master — The C66x CorePac is released from reset and begins executing from the L3 ROM base address. The ARM CorePac is also released from reset at the same time as the C66xCorePac. Both the C66x CorePac and the ARM CorePac read the BOOTMODE register inside the bootCFG module to determine which is the boot master.

    • After the Boot ROM for the Cortex-A15 processor reads the BOOTMODE to determine that the C66x CorePac is the boot master, all Cortex-A15 processors stay idle by executing WFI instruction and waiting for the C66x CorePac’s interrupt. The chip Boot ROM reads the BOOTMODE register to determine that the C66x CorePac0 is the boot master, then the C66x CorePac0 performs the boot process and the other C66x CorePacs execute an IDLE instruction. After the boot process is completed, the C66x CorePac0 begins to execute the code downloaded during the boot process. If the downloaded code included code for the other C66x cores and/or the Cortex-A15 processor cores, the downloaded code may contain logic to write the code execution addresses to the boot address register for the core that is to execute it. The C66x CorePac0 can then generate an interrupt to the core causing it to execute the code. When they receive the IPC interrupt, the rest of the C66x CorePacs and the ARM CorePac complete boot management operations and begin executing from the predefined location in memory.

  • Public ROM Boot when the ARM CorePac Core0 is the boot master — The only difference between this boot mode and when the C66x CorePac is the boot master, is that the ARM CorePac performs the boot process while the C66x CorePacs execute idle instructions. When the ARM CorePac Core0 finishes the boot process, it may send interrupts to the C66x CorePacs and Cortex-A15 processor cores through IPC registers. The C66x CorePacs complete the boot management operations and begin executing from the predefined locations.
  • Secure ROM Boot when the C66x CorePac0 is the boot master —The C66x CorePac0 and the ARM CorePac Core0 are released from reset simultaneously and the C66x CorePac0 begins executing from secure ROM. The C66x CorePac0 performs the boot process including any authentication and decryption required on the bootloaded image for the C66x CorePacs and for the ARM CorePac prior to beginning execution.
  • Secure ROM Boot when the ARM CorePac0 is the boot master — The C66x CorePac0 and the ARM CorePac Core0 are released from reset simultaneously and begin executing from secure ROM. The ARM CorePac Core0 initiates the boot process. The C66x CorePac0 performs any authentication and decryption required on the bootloaded image for the C66x CorePacs and ARM CorePac prior to beginning execution.

The boot process performed by the C66x CorePac0 and the ARM CorePac Core0 in public ROM boot and secure ROM boot are determined by the BOOTMODE[15:0] value in the DEVSTAT register. The C66x CorePac0 and the ARM CorePac Core0 read this value, and then execute the associated boot process in software. Bit 8 determines whether the boot is C66x CorePac boot or ARM CorePac boot. The figure below shows the bits associated with BOOTMODE[15:0] (DEVSTAT[16:1]) when the C66x CorePac or ARM CorePac is the boot master. Figure 10-1 does not include bit 0 of the DEVSTAT contents. Bit 0 is used to select overall system endianess that is independent of the boot mode.

The boot ROM will continue attempting to boot in this mode until successful or an unrecoverable error occurs.

The PLL settings are shown at the end of this section, and the PLL set-up details can be found in Section 11.5.

NOTE

It is important to remember that the BOOTMODE[15:0] pins map to the DEVSTAT[16:1] bits of the DEVSTAT register.
Figure 10-1 DEVSTAT Boot Mode Pins ROM Mapping
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 Mode
X X 0 ARMEN SYSEN ARM PLL CONFIG Boot Master SYS PLL CONFIG Min 0 0 0 SLEEP
SlaveAddr 1 Port 0 0 0 I2C SLAVE
X X X Bus Addr Param ldx X Port 0 0 1 I2C MASTER
Width Csel Mode Npin 0 1 0 SPI
0 Base Addr Wait Width ARM PLL CONFIG SYS PLL CONFIG 0 0 1 1 EMIF (ARM Master)
X Chip Sel EMIF (DSP Master)
1 First Block Clear ARM PLL CONFIG Min NAND (ARM Master)
X Chip Sel NAND (DSP Master)
Lane Ref Clock Data Rate ARM PLL CONFIG 1 0 0 SRIO (ARM Master)
X Lane Setup SRIO (DSP Master)
PA clk Ref clk Ext Con ARM PLL CONFIG 1 0 1 Ethernet (ARM Master)
Rsvd Lane Setup Ethernet (DSP Master)
Ref clk Bar Config ARM PLL CONFIG 0 1 1 0 PCIe (ARM Master)
SerDes Cfg PCIe (DSP Master)
Port Ref clk Data Rate ARM PLL CONFIG 1 1 1 0 HyperLink (ARM Master)
SerDes Cfg HyperLink (DSP Master)
X X X X Port ARM PLL CONFIG Min 1 1 1 UART (ARM Master)
X X X X X X X UART (DSP Master)

10.1.2.1 Boot Device Field

The Boot Device field BOOTMODE[16-14-4-3-2-1] bits define the boot device that is chosen and the BOOTMODE[8] bit defines the boot master that is chosen. Table 10-3 shows the supported boot modes.

Table 10-3 Boot Mode Pins: Boot Device Values

Bit Field Description
16, 14, 4, 3, 2, 1 Boot Device Device boot mode
  • ARM is a boot master when BOOTMODE[8]=0
    • Sleep = X0[Min]000b
    • I2C Slave = [Slave Addr1]1[Min]000b
    • I2C Master = X1[Min]001b
    • SPI = [Width][Csel0][Min]010b
    • EMIF = 0[BaseAddr0][Min]011b
    • NAND = 1[BaseAddr0][Min]011b
    • Serial Rapid I/O = [Lane][Ref Clock0][Min]100b
    • Ethernet (SGMII) = [Pa clk][Ref Clk0][Min]101b
    • PCI = [Ref clk][Bar Config2]0110b
    • HyperLink = [Port][Ref Clk0]1110b
    • UART = XX[Min]111b
  • C66x is a boot master when BOOTMODE[8]=1
    • Sleep = X0[Min]000b
    • I2C Slave = [Slave Addr1]1[Min]000b
    • I2C Master = X1[Min]001b
    • SPI = [Width][Csel0][Min]010b
    • EMIF = 0[BaseAddr0][Min]011b
    • NAND = 1[BaseAddr0][Min]011b
    • Serial Rapid I/O = [Lane][Ref Clock0][Min]100b
    • Ethernet (SGMII) = [Pa clk][Ref Clk0][Min]101b
    • PCI = [Ref clk][Bar Config2]0110b
    • HyperLink = [Port][Ref Clk0]1110b
    • UART = XX[Min]111b

10.1.2.2 Device Configuration Field

The device configuration fields DEVSTAT[16:1] are used to configure the boot peripheral and, therefore, the bit definitions depend on the boot mode.

10.1.2.2.1 Sleep Boot Mode Configuration

Figure 10-2 Sleep Boot Mode Configuration Fields
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
X X 0 ARMen SYSEN ARM PLL Cfg Boot Master Sys PLL Config Min 000 Lendian

Table 10-4 Sleep Boot Configuration Field Descriptions

Bit Field Description
16-15 Reserved Reserved
14 Boot Devices Boot Device- used in conjunction with Boot Devices [Used in conjunction with bits 3-1]
  • 0 = Sleep (default)
  • Others = Other boot modes
13 ARMen Enable the ARM PLL
  • 0 = PLL disabled
  • 1 = PLL enabled
12 SYSEN Enable the System PLL
  • 0 = PLL disabled (default)
  • 1 = PLL enabled
11-9 ARM PLL Setting The PLL default settings are determined by the [11:9] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies.
8 Boot Master Boot Master select
  • 0 = ARM is boot master
  • 1 = C66x is boot master
7-5 SYS PLL Setting The PLL default settings are determined by the [7:5] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies.
4 Min Minimum boot configuration select bit.
  • 0 = Minimum boot pin select disabled
  • 1 = Minimum boot pin select enabled.

When Min = 1, a predetermined set of values is configured (see the Device Configuration Field Descriptions table for configuration bits with a "(default)" tag added in the description column).

When Min = 0, all fields must be independently configured.

3-1 Boot Devices Boot Devices[3:1] used in conjunction with Boot Device [14]
  • 000 = Sleep
  • Others = Other boot modes
0 Lendian Endianess (device)
  • 0 = Big endian
  • 1 = Little endian

10.1.2.2.2 I2C Boot Device Configuration

10.1.2.2.2.1 I2C Passive Mode

In passive mode, the device does not drive the clock, but simply acks data received on the specified address.

Figure 10-3 I2C Passive Mode Device Configuration Fields
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Slave Addr 1 Port ARM PLL Cfg Boot Master Sys PLL Config Min 000 Lendian

Table 10-5 I2C Passive Mode Device Configuration Field Descriptions

Bit Field Description
16-15 Slave Addr I2C Slave boot bus address
  • 0 = I2C slave boot bus address is 0x00
  • 1 = I2C slave boot bus address is 0x10 (default)
  • 2 = I2C slave boot bus address is 0x20
  • 3 = I2C slave boot bus address is 0x30
14 Boot Devices Boot Device[14] used in conjunction with Boot Devices [Use din conjunction with bits 3-1]
  • 0 = Other boot modes
  • 1= I2C Slave boot mode
13-12 Port I2C port number
  • 0 = I2C0
  • 1 = I2C1
  • 2 = I2C2
  • 3 = Reserved
11-9 ARM PLL Setting The PLL default settings are determined by the [11:9] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies.
8 Boot Master Boot Master select
  • 0 = ARM is boot master
  • 1 = C66x is boot master
7-5 SYS PLL Setting The PLL default settings are determined by the [7:5] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies.
4 Min Minimum boot configuration select bit.
  • 0 = Minimum boot pin select disabled
  • 1 = Minimum boot pin select enabled.

When Min = 1, a predetermined set of values is configured (see the Device Configuration Field Descriptions table for configuration bits with a "(default)" tag added in the description column).

When Min = 0, all fields must be independently configured.

3-1 Boot Devices Boot Devices[3:1] used in conjunction with Boot Device [14]
  • 000 = I2C Slave
  • Others = Other boot modes
0 Lendian Endianess
  • 0 = Big endian
  • 1 = Little endian

10.1.2.2.2.2 I2C Master Mode

In master mode, the I2C device configuration uses 10 bits of device configuration instead of seven as used in other boot modes. In this mode, the device makes the initial read of the I2C EEPROM while the PLL is in bypass mode. The initial read contains the desired clock multiplier, which must be set up prior to any subsequent reads.

Figure 10-4 I2C Master Mode Device Configuration Fields
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved Bus Addr Param ldx/Offset Boot Master Reserved Port Min 001 Lendian

Table 10-6 I2C Master Mode Device Configuration Field Descriptions

Bit Field Description
16-14 Reserved Reserved
13-12 Bus Addr I2C bus address slave device
  • 0 = I2C slave boot bus address is 0x50 (default)
  • 1 = I2C slave boot bus address is 0x51
  • 2 = I2C slave boot bus address is 0x52
  • 3 = I2C slave boot bus address is 0x53
11-9 Param Idx/Offset Parameter Table Index: 0-7

This value specifies the parameter table index when the C66x is the boot master

This value specifies the start read address at 8K times this value when the ARM is the boot master

8 Boot Master Boot Master select
  • 0 = ARM is boot master
  • 1 = C66x is boot master
7 Reserved
  • Reserved
6-5 Port I2C port number
  • 0 = I2C0 (default)
  • 1 = I2C1
  • 2 = I2C2
  • 3 = Reserved
4 Min Minimum boot configuration select bit.
  • 0 = Minimum boot pin select disabled
  • 1 = Minimum boot pin select enabled.

When Min = 1, a predetermined set of values is configured (see the Device Configuration Field Descriptions table for configuration bits with a "(default)" tag added in the description column).

When Min = 0, all fields must be independently configured.

3-1 Boot Devices Boot Devices[3:1]
  • 001 = I2C Master
  • Others = Other boot modes
0 Lendian Endianess
  • 0 = Big endian
  • 1 = Little endian

10.1.2.2.3 SPI Boot Device Configuration

Figure 10-5 SPI Device Configuration Fields
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Width Csel Mode Param ldx/Offset Boot Master Npin Port Min 010 Lendian

Table 10-7 SPI Device Configuration Field Descriptions

Bit Field Description
16 Width SPI address width configuration
  • 0 = 16-bit address values are used
  • 1 = 24-bit address values are used (default)
15-14 Csel The chip select field value 0-3 (default = 0)
13-12 Mode Clk Polarity/ Phase
  • 0 = Data is output on the rising edge of SPICLK. Input data is latched on the falling edge.
  • 1 = Data is output one half-cycle before the first rising edge of SPICLK and on subsequent falling edges. Input data is latched on the rising edge of SPICLK.
  • 2 = Data is output on the falling edge of SPICLK. Input data is latched on the rising edge (default).
  • 3 = Data is output one half-cycle before the first falling edge of SPICLK and on subsequent rising edges. Input data is latched on the falling edge of SPICLK.
11-9 Param Idx/Offset Parameter Table Index: 0-7

This value specifies the parameter table index when the C66x is the boot master

This value specifies the start read address at 8K times this value when the ARM is the boot master

8 Boot Master Boot Master select
  • 0 = ARM is boot master (default)
  • 1 = C66x is boot master
7 Npin Selected Chip Select driven
  • 0 = CS0 to the selected chip select is driven
  • 1 = CS0-CS3 to the selected chip select are driven (default)
6-5 Port Specify SPI port
  • 0 = SPI0 used (default)
  • 1 = SPI1 used
  • 2 = SPI2 used
  • 3 = Reserved
4 Min Minimum boot configuration select bit.
  • 0 = Minimum boot pin select disabled
  • 1 = Minimum boot pin select enabled.

When Min = 1, a predetermined set of values is configured (see the Device Configuration Field Descriptions table for configuration bits with a "(default)" tag added in the description column).

When Min = 0, all fields must be independently configured.

3-1 Boot Devices Boot Devices[3:1]
  • 010 = SPI boot mode
  • Others = Other boot modes
0 Lendian Endianess
  • 0 = Big endian
  • 1 = Little endian

10.1.2.2.4 EMIF Boot Device Configuration

Figure 10-6 EMIF Boot Device Configuration Fields
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
0 Base Addr Wait Width X Chip Sel Boot Master=1 Sys PLL Cfg 0 011 Lendian
0 Base Addr Wait Width ARM PLL Cfg Boot Master=0 Sys PLL Cfg 0 011 Lendian

Table 10-8 EMIF Boot Device Configuration Field Descriptions

Bit Field Description
16 Boot Devices Boot Devices[16] used conjunction with Boot Devices[4] and Boot Devices [Used in conjunction with bits 3-1]
  • 0 = EMIF boot mode
  • 1 = Other boot modes
15-14 Base Addr Base address (0-3) used to calculate the branch address. Branch address is the chip select plus Base Address *16MB
13 Wait Extended Wait
  • 0 = Extended Wait disabled
  • 1 = Extended Wait enabled
12 Width EMIF Width
  • 0 = 8-bit EMIF Width
  • 1 = 16-bit EMIF Width
11-9 Chip Sel/ARM PLL Setting When Boot Master = 0 (ARM is Boot Master), Pin[11:9] used as ARM PLL Setting and the chip select region CS0 is used. The PLL default settings are determined by the [11:9] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies.

When Boot Master =1 (C66x is Boot Master), Pin[10:9] used as Chip Sel that specifies the chip select region, CS0-CS3.

  • 00 = CS0 (EMIFCE0)
  • 01 = CS1 (EMIFCE1)
  • 10 = CS2 (EMIFCE2)
  • 11 = CS3 (EMIFCE3)
8 Boot Master Boot Master select
  • 0 = ARM is boot master
  • 1 = C66x is boot master
7-5 SYS PLL Setting The PLL default settings are determined by the [7:5] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies.
4 Boot Devices Boot Devices[4] used conjunction with Boot Devices[16] and Boot Devices [Use din conjunction with bits 3-1]
  • 0 = EMIF boot mode
  • 1 = Other boot modes
3-1 Boot Devices Boot Devices[3:1] used in conjunction with Boot Device [4]
  • 011 = EMIF boot mode
  • Others = Other boot modes
0 Lendian Endianess
  • 0 = Big endian
  • 1 = Little endian

10.1.2.2.5 NAND Boot Device Configuration

Figure 10-7 NAND Boot Device Configuration Fields
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
1 First Block Clear X Chip Sel Boot Master=1 Sys PLL Cfg Min 011 Lendian
1 First Block Clear ARM PLL Cfg Boot Master=0 Sys PLL Cfg Min 011 Lendian

Table 10-9 NAND Boot Device Configuration Field Descriptions

Bit Field Description
16 Boot Devices Boot Devices[16] used conjunction with Boot Devices [3-1]
  • 0 = Other boot modes
  • 1 = NAND boot mode
15-13 First Block First Block. This value is used to calculate the first block read. The first block read is the first block value *16.
12 Clear ClearNAND
  • 0 = Device is not a ClearNAND (default)
  • 1 = Device is a ClearNAND
11-9 Chip Sel/ARM PLL Setting When Boot Master = 0 (ARM is Boot Master), Pin[11:9] used as ARM PLL Setting and the chip select region CS2 is used. The PLL default settings are determined by the [11:9] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies.

When Boot Master =1 (C66x is Boot Master), Pin[10:9] used as Chip Sel that specifies the chip select region, CS2-CS5.

  • 00 = CS2
  • 01 = CS3
  • 10 = CS4
  • 11 = CS5
8 Boot Master Boot Master select
  • 0 = ARM is boot master (default)
  • 1 = C66x is boot master
7-5 SYS PLL Setting The PLL default settings are determined by the [7:5] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies.
4 Min Minimum boot pin select. When Min is 1, it means that the BOOTMODE [15:3] pins are don't cares. Only BOOTMODE [2:0] pins (DEVSTAT[3:1]) will determine boot. Default values are assigned to values that would normally be set by the other BOOTMODE pins when Min is 0.
  • 0 = Minimum boot pin select disabled
  • 1 = Minimum boot pin select enabled.
3-1 Boot Devices Boot Devices
  • 011 = NAND boot mode
  • Others = Other boot modes
0 Lendian Endianess
  • 0 = Big endian
  • 1 = Little endian

10.1.2.3 Serial Rapid I/O Boot Device Configuration

The device ID is always set to 0xff (8-bit node IDs) or 0xffff (16 bit node IDs) at power-on reset.

Figure 10-8 Serial Rapid I/O Boot Device Configuration Fields
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
X Ref Clock Data Rate Lane Setup Boot Master=1 Sys PLL Cfg Min 100 Lendian
Lane Ref Clock Data Rate ARM PLL Cfg Boot Master=0 Sys PLL Cfg Min 100 Lendian

Table 10-10 Serial Rapid I/O Boot Device Configuration Field Descriptions

Bit Field Description
16 Lane When Boot Master =0 (ARM is Boot Master), Pin[16] is used as Lane.
  • 0 = 4 ports, each 1 lane wide (default)
  • 1 = 2 ports, each 2 lanes wide

When Boot Master =1 (C66x is Boot Master), Pin[16] is reserved.

15-14 Ref Clock SRIO Reference clock frequency
  • 0 = 125 MHz
  • 1 = 156.25 MHz (default)
  • 2 = Reserved
  • 3 = Reserved
13-12 Data Rate SRIO Data Rate
  • 0 = 1.25GB
  • 1 = 2.5GB
  • 2 = 3.125GB
  • 3 = 5GB (default)
11-9 Lane Setup/ARM PLL Setting When Boot Master =0 (ARM is Boot Master), pin[11:9] used as ARM PLL Setting with all lanes enabled. The PLL default settings are determined by the [11:9] bits. This will set the PLL to the maximum clock setting for the device. The default value is 156.26 MHz. Table 10-27 shows settings for various input clock frequencies.

When Boot Master =1 (C66x is Boot Master), pin [11:9] are used as Lane Set up.

  • 0 = 4 ports, each 1 lane wide (default)
  • 1 = 3 ports, lanes 0, 1 form a 2 lane port, lane 2,3 are single ports
  • 2 = 3 ports, lanes 0, 1 are single lane ports, lanes 2,3 form a 2 lane port
  • 3 = 2 ports, lane 0, 1 are one port, lane 2, 3 are a second port
  • 4 = 1 port, 4 lanes wide
  • 5-7 = 4 ports, each 1 lane wide
8 Boot Master Boot Master select
  • 0 = ARM is boot master (default)
  • 1 = C66x is boot master
7-5 SYS PLL Setting The PLL default settings are determined by the [7:5] bits. This will set the PLL to the maximum clock setting for the device. Default system reference clock is 156.25 MHz. Table 10-27 shows settings for various input clock frequencies. (default = 4)
4 Min Minimum boot configuration select bit.
  • 0 = Minimum boot pin select disabled
  • 1 = Minimum boot pin select enabled.

When Min = 1, a predetermined set of values is configured (see the Device Configuration Field Descriptions table for configuration bits with a "(default)" tag added in the description column).

When Min = 0, all fields must be independently configured.

3-1 Boot Devices Boot Devices
  • 100 = SRIO boot mode
  • Others = Other boot modes
0 Lendian Endianess
  • 0 = Big endian
  • 1 = Little endian

In SRIO boot mode, both the message mode and DirectIO mode will be enabled by default. If use of the memory reserved for received messages is required and reception of messages cannot be prevented, the master can disable the message mode by writing to the boot table and generating a boot restart.

10.1.2.4 Ethernet (SGMII) Boot Device Configuration

Figure 10-9 Ethernet (SGMII) Boot Device Configuration Fields
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Pa clk Ref Clock Ext Con Lane Setup Boot Master=1 Sys PLL Cfg Min 101 Lendian
Pa clk Ref Clock Ext Con ARM PLL Cfg Boot Master=0 Sys PLL Cfg Min 101 Lendian

Table 10-11 Ethernet (SGMII) Boot Device Configuration Field Descriptions

Bit Field Description
16 Pa clk PA clock reference
  • 0 = PA clocked at the same reference as the core reference
  • 1 = PA clocked at the same reference as the SerDes reference (default)
15-14 Ref Clock SRIO Reference clock frequency
  • 0 = 125 MHz
  • 1 = 156.25 MHz (default)
  • 2 = Reserved
  • 3 = Reserved
13-12 Ext Con External connection mode
  • 0 = MAC to MAC connection, master with auto negotiation
  • 1 = MAC to MAC connection, slave with auto negotiation (default)
  • 2 = MAC to MAC, forced link, maximum speed
  • 3 = MAC to fiber connection
11-9 Lane Setup/ARM PLL Setting When Boot Master = 0 (ARM is Boot Master), pin[11:9] used as ARM PLL Setting. The PLL default settings are determined by the [11:9] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies.

When Boot Master =1 (C66x is Boot Master), pin [10:9] are used as Lane Set up.

  • 0 = All SGMII ports enabled (default)
  • 1 = Only SGMII port 0 enabled
  • 2 = SGMII port 0 and 1 enabled
  • 3 = SGMII port 0, 1 and 2 enabled
  • 4-7 = Reserved
8 Boot Master Boot Master select
  • 0 = ARM is boot master (default)
  • 1 = C66x is boot master
7-5 SYS PLL Setting The PLL default settings are determined by the [7:5] bits. This will set the PLL to the maximum clock setting for the device. Default system reference clock is 156.25 MHz. Table 10-27 shows settings for various input clock frequencies. (default = 4)
4 Min Minimum boot configuration select bit.
  • 0 = Minimum boot pin select disabled
  • 1 = Minimum boot pin select enabled.
When Min = 1, a predetermined set of values is configured (see the Device Configuration Field Descriptions table for configuration bits with a "(default)" tag added in the description column).

When Min = 0, all fields must be independently configured.

3-1 Boot Devices Boot Devices
  • 101 = Ethernet boot mode
  • Others = Other boot modes
0 Lendian Endianess
  • 0 = Big endian
  • 1 = Little endian

10.1.2.4.1 PCIe Boot Device Configuration

Figure 10-10 PCIe Boot Device Configuration Fields
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Ref clk Bar Config Reserved Boot Master=1 Sys PLL Cfg 0110 Lendian
Ref clk Bar Config ARM PLL Cfg Boot Master=0 Sys PLL Cfg 0110 Lendian

Table 10-12 PCIe Boot Device Configuration Field Descriptions

Bit Field Description
16 Ref clk PCIe Reference clock frequency
  • 0 = 100MHz
  • 1 = Reserved
15-12 Bar Config PCIe BAR registers configuration

This value can range from 0 to 0xf. See Table 10-13.

11-9 Reserved/ARM PLL Setting When Boot Master =0 (ARM is Boot Master), pin[11:9] used as ARM PLL Setting. The PLL default settings are determined by the [11:9] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies.

When Boot Master =1 (C66x is Boot Master), pin [10:9] are reserved.

8 Boot Master Boot Master select
  • 0 = ARM is boot master (default)
  • 1 = C66x is boot master
7-5 SYS PLL Setting The PLL default settings are determined by the [7:5] bits. This will set the PLL to the maximum clock setting for the device. Default system reference clock is 156.25 MHz. Table 10-27 shows settings for various input clock frequencies.
4-1 Boot Devices Boot Devices[4:1]
  • 0110 = PCIe boot mode
  • Others = Other boot modes
0 Lendian Endianess
  • 0 = Big endian
  • 1 = Little endian

Table 10-13 BAR Config / PCIe Window Sizes

BAR CFG BAR0 32-BIT ADDRESS TRANSLATION 64-BIT ADDRESS TRANSLATION
BAR1 BAR2 BAR3 BAR4 BAR5 BAR2/3 BAR4/5
0b0000 PCIe MMRs 32 32 32 32 Clone of BAR4
0b0001 16 16 32 64
0b0010 16 32 32 64
0b0011 32 32 32 64
0b0100 16 16 64 64
0b0101 16 32 64 64
0b0110 32 32 64 64
0b0111 32 32 64 128
0b1000 64 64 128 256
0b1001 4 128 128 128
0b1010 4 128 128 256
0b1011 4 128 256 256
0b1100 256 256
0b1101 512 512
0b1110 1024 1024
0b1111 2048 2048

10.1.2.4.2 HyperLink Boot Device Configuration

Figure 10-11 HyperLink Boot Device Configuration Fields
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Port RefClk Data Rate Reserved Boot Master=1 Sys PLL Cfg 1110 Lendian
Port RefClk Data Rate ARM PLL Cfg Boot Master=0 Sys PLL Cfg 1110 Lendian

Table 10-14 HyperLink Boot Device Configuration Field Descriptions

Bit Field Description
16 Port HyperLink port
  • 0 = HyperLink0
  • 1 = HyperLink1
15-14 Ref Clocks HyperLink reference clock configuration
  • 0 = 125 MHz
  • 1 = 156.25 MHz
  • 2-3 = Reserved
13-12 Data Rate HyperLink data rate configuration
  • 0 = 1.25 GBs
  • 1 = 3.125 GBs
  • 2 = 6.25 GBs
  • 3 = 12.5 GBs
11-9 Reserved/ARM PLL Setting When Boot Master =0 (ARM is Boot Master), pin[11:9] used as ARM PLL Setting. The PLL default settings are determined by the [11:9] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies.

When Boot Master =1 (C66x is Boot Master), pin [10:9] are reserved.

8 Boot Master Boot Master select
  • 0 = ARM is boot master (default)
  • 1 = C66x is boot master
7-5 SYS PLL Setting The PLL default settings are determined by the [7:5] bits. This will set the PLL to the maximum clock setting for the device. Default system reference clock is 156.25 MHz. Table 10-27 shows settings for various input clock frequencies.
4-1 Boot Devices Boot Devices[4:1]
  • 1110 = HyperLink boot mode
  • Others = Other boot modes
0 Lendian Endianess
  • 0 = Big endian
  • 1 = Little endian

10.1.2.4.3 UART Boot Device Configuration

Figure 10-12 UART Boot Mode Configuration Field Description
DEVSTAT Boot Mode Pins ROM Mapping
16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
X X X X Port X X X Boot Master=1 Sys PLL Config Min 111 Lendian
X X X X Port ARM PLL Cfg Boot Master=0 Sys PLL Config Min 111 Lendian

Table 10-15 UART Boot Configuration Field Descriptions

Bit Field Description
16-13 Reserved Not Used
12 Port UART Port number
  • 0 = UART0
  • 1 = UART1
11-9 ARM PLL Setting The PLL default settings are determined by the [11:9] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies.
8 Boot Master Boot Master select
  • 0 = ARM is boot master
  • 1 = C66x is boot master
7-5 SYS PLL Setting The PLL default settings are determined by the [7:5] bits. This will set the PLL to the maximum clock setting for the device. Table 10-27 shows settings for various input clock frequencies. (default = 4)
4 Min Minimum boot configuration select bit.
  • 0 = Minimum boot pin select disabled
  • 1 = Minimum boot pin select enabled.

When Min = 1, a predetermined set of values is configured (see the Device Configuration Field Descriptions table for configuration bits with a "(default)" tag added in the description column).

When Min = 0, all fields must be independently configured.

3-1 Boot Devices Boot Devices[3:1]
  • 111 = UART boot mode
  • Others = Other boot modes
0 Lendian Endianess
  • 0 = Big endian
  • 1 = Little endian

10.1.2.5 Boot Parameter Table

The ROM Bootloader (RBL) uses a set of tables to carry out the boot process. The boot parameter table is the most common format the RBL employs to determine the boot flow. These boot parameter tables have certain parameters common across all the boot modes, while the rest of the parameters are unique to the boot modes. The common entries in the boot parameter table are shown in Table 10-16.

Table 10-16 Boot Parameter Table Common Parameters

BYTE OFFSET NAME DESCRIPTION
0 Length The length of the table, including the length field, in bytes.
2 Checksum The 16 bits ones complement of the ones complement of the entire table. A value of 0 will disable checksum verification of the table by the boot ROM.
4 Boot Mode Internal values used by RBL for different boot modes.
6 Port Num Identifies the device port number to boot from, if applicable
8 SW PLL, MSW PLL configuration, MSW
10 SW PLL, LSW PLL configuration, LSW
12 Sec PLL Config, MSW ARM PLL configuration, MSW
14 Sec PLL Config, LSW ARM PLL configuration, LSW
16 System Freq The frequency of the system clock in MHz
18 Core Freq The frequency of the core clock in MHz
20 Boot Master Set to TRUE if C66x is the master core.

10.1.2.5.1 EMIF16 Boot Parameter Table

Table 10-17 EMIF16 Boot Parameter Table

BYTE OFFSET NAME DESCRIPTION CONFIGURED THROUGH BOOT CONFIGURATION PINS
22 Options Async Config Parameters are used.
  • 0 = Value in the async config paramters are not used to program async config registers.
  • 1 = Value in the async config paramters are used to program async config registers.
 NO
24 Type Set to 0 for EMIF16 (NOR) boot NO
26 Branch Address MSW Most significant bit for Branch address (depends on chip select) YES
28 Branch Address LSW Least significant bit for Branch address (depends on chip select) YES
30 Chip Select Chip Select for the NOR flash YES
32 Memory Width Memory width of the EMIF16 bus (16 bits) YES
34 Wait Enable Extended wait mode enabled
  • 0 = Wait enable is disabled
  • 1 = Wait enable is enabled
 YES
36 Async Config MSW Async Config Register MSW NO
38 Async Config LSW Async Config Register LSW NO

10.1.2.5.2 SRIO Boot Parameter Table

Table 10-18 SRIO Boot Parameter Table

BYTE OFFSET NAME DESCRIPTION CONFIGURED THROUGH BOOT CONFIGURATION PINS
22 Options Bit 0 Tx enable
  • 0 = SRIO Transmit disable
  • 1 = SRIO Transmit Enable

Bit 1 Mailbox Enable

  • 0 = Mailbox mode disabled. (SRIO boot is in DirectIO mode).
  • 1 = Mailbox mode enabled. (SRIO boot is in Messaging mode).

Bit 2 Bypass Configuration

  • 0 = Configure the SRIO
  • 1 = Bypass SRIO configuration

Bit 3 Bypass QM Configuration

  • 0 = Configure the QM and CPDMA
  • 1 = Bypass the QM and CPDMA configuration

Bit 4 PLL setup

  • 0 = SERDES Configuration registers are taken without modification.
  • 1 = SERDES Configuration are modified based on the reference clock and link rate.

Bit 5-15 = Reserved

NO
24 Lane Setup
  • 0b0000 = SRIO configured as four 1x ports
  • 0b0001 = SRIO configured as 3 ports (2x, 1x, 1x)
  • 0b0010 = SRIO configured as 3 ports (1x, 1x, 2x)
  • 0b0011 =SRIO configured as 2 ports (2x, 2x)
  • 0b0100 = SRIO configured as 1 4x port
  • 0b 0101-0bffff = Reserved
YES (but not all lane setup are possible through the boot configuration pins)
26 Reserved Reserved NA
28 Node ID The node ID value to set for this device NO
30 SerDes ref clk The SerDes reference clock frequency, in 1/100 MHZ YES
32 Link Rate Link rate, MHz YES
34 PF Low Packet forward address range, low value NO
36 PF High Packet Forward address range, high value NO
38 Promiscuous Mask The bit is set for each lane/port that is configured as promiscuous NO
40 Time-out Sec Number of seconds before time-out. The value 0 disables the time-out. NO
44 SERDES Aux, MSW SERDES Auxillary Register Configuration, MSW NO
48 SERDES Aux, LSW SERDES Auxillary Register Configuration, LSW NO
52 SERDES Rx Lane0 MSW SERDES Rx Configuration, Lane0, MSW NO
56 SERDES Rx Lane0 LSW SERDES Rx Configuration, Lane0, LSW NO
60 SERDES Rx Lane1 MSW SERDES Rx Configuration, Lane1, MSW NO
64 SERDES Rx Lane1 LSW SERDES Rx Configuration, Lane1, LSW NO
68 SERDES Rx Lane2 MSW SERDES Rx Configuration, Lane2, MSW NO
72 SERDES Rx Lane2 LSW SERDES Rx Configuration, Lane2, LSW NO
76 SERDES Rx Lane3 MSW SERDES Rx Configuration, Lane3, MSW NO
80 SERDES Rx Lane3 LSW SERDES Rx Configuration, Lane3, LSW NO

10.1.2.5.3 Ethernet Boot Parameter Table

Table 10-19 Ethernet Boot Parameter Table

BYTE OFFSET NAME DESCRIPTION CONFIGURED THROUGH BOOT CONFIGURATION PINS
22 Options Bits 02-00 Interface
  • 000-100 = Reserved
  • 101 = SGMII
  • 110 = Reserved
  • 111 = Reserved

Bits 03 HD

  • 0 = Half Duplex
  • 1 = Full Duplex

Bit 4 Skip TX

  • 0 = Send Ethernet Ready Frame every 3 seconds
  • 1 = Don't send Ethernet Ready Frame

Bits 06-05 Initialize Config

  • 00 = Switch, SerDes, SGMII and PASS are configured
  • 01 = Initialization is not done for the peripherals that are already enabled and running.
  • 10 = Reserved
  • 11 = None of the Ethernet system is configured.

Bits 15-07 Reserved

NO
24 MAC High The 16 MSBs of the MAC address to receive during boot NO
26 MAC Med The 16 middle bits of the MAC address to receive during boot NO
28 MAC Low The 16 LSBs of the MAC address to receive during boot NO
30 Multi MAC High The 16 MSBs of the multicast MAC address to receive during boot NO
32 Multi MAC Med The 16 middle bits of the multicast MAC address to receive during boot NO
34 Multi MAC Low The 16 LSBs of the multicast MAC address to receive during boot NO
36 Source Port The source UDP port to accept boot packets from.

A value of 0 will accept packets from any UDP port

NO
38 Dest Port The destination port to accept boot packets on. NO
40 Device ID 12 The first 2 bytes of the device ID.

This is typically a string value, and is sent in the Ethernet ready frame

NO
42 Device ID 34 The second 2 bytes of the device ID. NO
44 Dest MAC High The 16 MSBs of the MAC destination address used

for the Ethernet ready frame. Default is broadcast.

NO
46 Dest MAC Med The 16 middle bits of the MAC destination address NO
48 Dest MAC Low The 16 LSBs of the MAC destination address NO
50 Lane Enable One bit per lane.
  • 0 = Lane disabled
  • 1 = Lane enabled
52 SGMII Config Bits 0-3 are the config index, bit 4 set if direct config used, bit 5 set if no configuration done NO
54 SGMII Control The SGMII control register value NO
56 SGMII Adv Ability The SGMII ADV Ability register value NO
58 SGMII TX Cfg High The 16 MSBs of the SGMII Tx config register NO
60 SGMII TX Cfg Low The 16 LSBs of the SGMII Tx config register NO
62 SGMII RX Cfg High The 16 MSBs of the SGMII Rx config register NO
64 SGMII RX Cfg Low The 16 LSBs of the SGMII Rx config register NO
66 SGMII Aux Cfg High The 16 MSBs of the SGMII Aux config register NO
68 SGMII Aux Cfg Low The 16 LSBs of the SGMII Aux config register NO
70 PKT PLL Cfg MSW The packet subsystem PLL configuration, MSW NO
72 PKT PLL CFG LSW The packet subsystem PLL configuration, LSW NO

10.1.2.5.4 PCIe Boot Parameter Table

Table 10-20 PCIe Boot Parameter Table

BYTE OFFSET NAME DESCRIPTION CONFIGURED THROUGH BOOT CONFIGURATION PINS
22 Options Bits 00 Mode
  • 0 = Host Mode (Direct boot mode)
  • 1 = Boot Table Boot Mode

Bits 01 Configuration of PCIe

  • 0 = PCIe is configured by RBL
  • 1 = PCIe is not configured by RBL

Bit 03-02 Reserved

Bits 04 Multiplier

  • 0 = SERDES PLL configuration is done based on SERDES register values
  • 1 = SERDES PLL configuration based on the reference clock values

Bits 05-15 Reserved

NO
24 Address Width PCI address width, can be 32 or 64 YES with in conjunction with BAR sizes
26 Link Rate SerDes frequency, in Mbps. Can be 2500 or 5000 NO
28 Reference clock Reference clock frequency, in units of 10 kHz. Value values are 10000 (100 MHz), 12500 (125 MHz), 15625 (156.25 MHz), 25000 (250 MHz) and 31250 (312.5 MHz). A value of 0 means that value is already in the SerDes cfg parameters and will not be computed by the boot ROM. NO
30 Window 1 Size Window 1 size. YES
32 Window 2 Size Window 2 size. YES
34 Window 3 Size Window 3 size. Valid only if address width is 32. YES
36 Window 4 Size Window 4 Size. Valid only if the address width is 32. YES
38 Vendor ID Vendor ID NO
40 Device ID Device ID NO
42 Class code Rev ID MSW Class code revision ID MSW NO
44 Class code Rev ID LSW Class code revision ID LSW NO
46 SerDes cfg msw PCIe SerDes config word, MSW NO
48 SerDes cfg lsw PCIe SerDes config word, LSW NO
50 SerDes lane 0 cfg msw SerDes lane config word, msw lane 0 NO
52 SerDes lane 0 cfg lsw SerDes lane config word, lsw, lane 0 NO
54 SerDes lane 1 cfg msw SerDes lane config word, msw, lane 1 NO
56 SerDes lane 1 cfg lsw SerDes lane config word, lsw, lane 1 NO
58 Time-out period (Secs) The time-out period. Values 0 disables the time-out.

10.1.2.5.5 I2C Boot Parameter Table

Table 10-21 I2C Boot Parameter Table

OFFSET FIELD VALUE CONFIGURED THROUGH BOOT CONFIGURATION PINS
22 Option Bits 02-00 Mode
  • 000 = Boot Parameter Table Mode
  • 001 = Boot Table Mode
  • 010 = Boot Config Mode
  • 011 = Load GP header format data
  • 100 = Slave Receive Boot Config

Bits 15-03 Reserved

NO
24 Boot Dev Addr The I2C device address to boot from YES
26 Boot Dev Addr Ext Extended boot device address YES
28 Broadcast Addr I2C address used to send data in the I2C master broadcast mode. NO
30 Local Address The I2C address of this device NO
34 Bus Frequency The desired I2C data rate (kHz) NO
36 Next Dev Addr The next device address to boot (Used only if boot config option is selected) NO
38 Next Dev Addr Ext The extended next device address to boot (Used only if boot config option is selected) NO
40 Address Delay The number of CPU cycles to delay between writing the address to an I2C EEPROM and reading data. NO

10.1.2.5.6 SPI Boot Parameter Table

Table 10-22 SPI Boot Parameter Table

BYTE OFFSET NAME DESCRIPTION CONFIGURED THROUGH BOOT CONFIGURATION PINS
22 Options Bits 01 and 00 Modes
  • 00 = Load a boot parameter table from the SPI (Default mode)
  • 01 = Load boot records from the SPI (boot tables)
  • 10 = Load boot config records from the SPI (boot config tables)
  • 11 = Load GP header blob
Bits 15- 02= Reserved		 NO
24 Address Width The number of bytes in the SPI device address. Can be 16 or 24 bit YES
26 NPin The operational mode, 4 or 5 pin YES
28 Chipsel The chip select used (valid in 4 pin mode only). Can be 0-3. YES
30 Mode Standard SPI mode (0-3) YES
32 C2Delay Setup time between chip assert and transaction NO
34 Bus Freq, 100kHz The SPI bus frequency in kHz. NO
36 Read Addr MSW The first address to read from, MSW (valid for 24 bit address width only) YES
38 Read Addr LSW The first address to read from, LSW YES
40 Next Chip Select Next Chip Select to be used (Used only in boot Config mode) NO
42 Next Read Addr MSW The Next read address (used in boot config mode only) NO
44 Next Read Addr LSW The Next read address (used in boot config mode only) NO

10.1.2.5.7 HyperLink Boot Parameter Table

Table 10-23 HyperLink Boot Parameter Table

BYTE OFFSET NAME DESCRIPTION CONFIGURED THROUGH BOOT CONFIGURATION PINS
12 Options Bits 00 Reserved

Bits 01 Configuration of Hyperlink

  • 0 = HyperLink is configured by RBL
  • 1 = HyperLink is not configured by RBL
Bits 15-02 = Reserved		 NO
14 Number of Lanes Number of Lanes to be configured NO
16 SerDes cfg msw PCIe SerDes config word, MSW NO
18 SerDes cfg lsw PCIe SerDes config word, LSW NO
20 SerDes CFG RX lane 0 cfg msw SerDes RX lane config word, msw lane 0 NO
22 SerDes CFG RXlane 0 cfg lsw SerDes RX lane config word, lsw, lane 0 NO
24 SerDes CFG TX lane 0 cfg msw SerDes TX lane config word, msw lane 0 NO
26 SerDes CFG TXlane 0 cfg lsw SerDes TX lane config word, lsw, lane 0 NO
28 SerDes CFG RX lane 1 cfg msw SerDes RX lane config word, msw lane 1 NO
30 SerDes CFG RXlane 1 cfg lsw SerDes RX lane config word, lsw, lane 1 NO
32 SerDes CFG TX lane 1 cfg msw SerDes TX lane config word, msw lane 1 NO
34 SerDes CFG TXlane 1 cfg lsw SerDes TX lane config word, lsw, lane 1 NO
36 SerDes CFG RX lane 2 cfg msw SerDes RX lane config word, msw lane 2 NO
38 SerDes CFG RXlane 2 cfg lsw SerDes RX lane config word, lsw, lane 2 NO
40 SerDes CFG TX lane 2 cfg msw SerDes TX lane config word, msw lane 2 NO
42 SerDes CFG TXlane 2 cfg lsw SerDes TX lane config word, lsw, lane 2 NO
44 SerDes CFG RX lane 3 cfg msw SerDes RX lane config word, msw lane 3 NO
46 SerDes CFG RXlane 3 cfg lsw SerDes RX lane config word, lsw, lane 3 NO
48 SerDes CFG TX lane 3 cfg msw SerDes TX lane config word, msw lane 3 NO
50 SerDes CFG TXlane 3 cfg lsw SerDes TX lane config word, lsw, lane 3 NO

10.1.2.5.8 UART Boot Parameter Table

Table 10-24 UART Boot Parameter Table

BYTE OFFSET NAME DESCRIPTION CONFIGURED THROUGH BOOT CONFIGURATION PINS
22 Reserved None NA
24 Data Format Bits 00 Data Format
  • 0 = Data Format is BLOB
  • 1 = Data Format is Boot Table
Bits 15-01 Reserved		 NO
26 Protocol Bits 00 Protocol
  • 0 = Xmodem Protocol
  • 1 = Reserved
Bits 15-01 Reserved		 NO
28 Initial NACK Count Number of NACK pings to be sent before giving up NO
30 Max Err Count Maximum number of consecutive receive errors acceptable. NO
32 NACK Time-out Time (ms) waiting for NACK/ACK. NO
34 Character Time-out Time Period between characters NO
36 nDatabits Number of bits supported for data. Only 8 bits is supported. NO
38 Parity Bits 01-00 Parity
  • 00 = No Parity
  • 01 = Odd parity
  • 10 = Even Parity
Bits 15-02 Reserved		 NO
40 nStopBitsx2 Number of stop bits times two. Valid values are 2 (stop bits = 1), 3 (Stop Bits = 1.5), 4 (Stop Bits = 2) NO
42 Over sample factor The over sample factor. Only 13 and 16 are valid. NO
44 Flow Control Bits 00 Flow Control
  • 0 = No Flow Control
  • 1 = RTS_CTS flow control
Bits 15-01 Reserved		 NO
46 Data Rate MSW Baud Rate, MSW NO
48 Data Rate LSW Baud Rate, LSW NO

10.1.2.5.9 NAND Boot Parameter Table

Table 10-25 NAND Boot Parameter Table

BYTE OFFSET NAME DESCRIPTION CONFIGURED THROUGH BOOT CONFIGURATION PINS
22 Options Bits 00 Geometry
  • 0 = Geometry is taken from this table
  • 1 = Geometry is queried from NAND device.
Bits 01 Clear NAND
  • 0 = NAND Device is a non clear NAND and requires ECC
  • 1 = NAND is a clear NAND and doesn.t need ECC.
Bits 15-02 Reserved		 NO
24 numColumnAddrBytes Number of bytes used to specify column address NO
26 numRowAddrBytes Number of bytes used to specify row address. NO
28 numofDataBytesperPage_msw Number of data bytes in each page, MSW NO
30 numofDataBytesperPage_lsw Number of data bytes in each page, LSW NO
32 numPagesperBlock Number of Pages per Block NO
34 busWidth EMIF bus width. Only 8 or 16 bits is supported. NO
36 numSpareBytesperPage Number of spare bytes allocated per page. NO
38 csel Chip Select number (valid chip selects are 2-5) YES (If ARM is the boot master only chip select 2 is supported)
40 First Block First block for RBL to try to read. YES

10.1.2.5.10 DDR3 Configuration Table

The RBL also provides an option to configure the DDR table before loading the image into the external memory. More information on how to configure the DDR3, see the KeyStone Architecture DSP Bootloader User's Guide. The configuration table for DDR3 is shown in Table 10-26

Table 10-26 DDR3 Boot Parameter

BYTE OFFSET NAME DESCRIPTION
0 Enable bitmap MSW Bits 31:0 of the PLL/EMIF enable bitmap. Bit 0 corresponds to the PLL config, Bit 1 to the SDRAM configuration register. There are 24 valid bits in this field (with the MSB corresponding to Rw/exc thresh).
4 Enable bitmap SLSW Bits 31:0 of the chip level register enable bit map. Bit 0 corresponds to chip level configuration register 0.
8 Enable bitmap LSW Bits 60:32 of the chip level register enable bit map. Bit 0 corresponds to chip level configuration register 32.
12 PLL Predivier PLL Predivision (1 = divide by 1, 2 = divide by 2, and so on)
16 PLL Multiplier PLL Multiplication
20 PLL Post Divider PLL Postdivision
24 sdRamConfig SDRAM Configuration Register
28 Refresh ctl SDRAM Refresh Control Register
32 Timing 1 SDRAM Timing 1 Register
36 Timing 2 SDRAM Timing 2 Register
40 Timing 3 SDRAM Timing 3 Register
44 Timing4 SDRAM Timing 4 Register
48 Pwr management Power Management Control Register
52 Vbus M cfg VBUS M Configuration
56 Vbus M cfg val 1 VBUS M Configuration Value 1
60 Vbus M cfg val 2 VBUSM Configuration Value 2
64 IO DFT Test I/O DFT test logic control
68 Perf ctl sel Performance Counter Master Region Select Register
72 Perf cnt Mst Reg Performance Count Master Region Select
76 Zq config SDRAM Output Impedance Calibration Configuration Register
80 Pri Class Svc Map Priority class Service Map
84 Mst Id class 1 Master ID class service map 1
88 Mst Id class 2 Master ID class service map 2
92 ECC ctrl ECC Control Register
96 ECC addr rng 1 ECC Address Range 1 Register
100 ECC addr rng 2 ECC Address Range 2 Register
104 Rw/exc thresh Read Write Execution Threshold Register
108 PHY PIR PHY PIR register (SLSW mask bit 0)
112 PHY PGCR0 PHY PGCR0 register (SLSW mask bit 1)
116 PHY PGCR1 PHY PGCR1 register (SLSW mask bit 2)
120 PHY PGCR2 PHY PGCR2 register (SLSW mask bit 3)
124 PHY PGSR0 PHY PGSR0 register (SLSW mask bit 4)
128 PHY PGSR1 PHY PGSR1 register (SLSW mask bit 5)
132 PHY PTR0 PHY PTR 0 register (SLSW mask bit 6)
136 PHY PTR1 PHY PTR 1 register (SLSW mask bit 7)
140 PHY PTR2 PHY PTR 2 register (SLSW mask bit 8)
144 PHY PTR3 PHY PTR 3 register (SLSW mask bit 9)
148 PHY PTR4 PHY PTR 4 register (SLSW mask bit 10)
152 PHY DCR PHY DCR register (SLSW mask bit 11)
156 PHY DTPR0 PHY DTPR 0 register (SLSW mask bit 12)
160 PHY DTPR1 PHY DTPR 1 register (SLSW mask bit 13)
164 PHY DTPR2 PHY DTPR 2 register (SLSW mask bit 14)
168 PHY MR0 PHY MR 0 register (SLSW mask bit 15)
172 PHY MR1 PHY MR 1 register (SLSW mask bit 16)
176 PHY MR2 PHY MR 2 register (SLSW mask bit 17)
180 PHY DTCR PHY DTCR register (SLSW mask bit 18)
184 PHY DX0GCR PHY DX 0 GCR register (SLSW mask bit 19)
188 PHY DX1GCR PHY DX 1 GCR register (SLSW mask bit 20)
192 PHY DX2GCR PHY DX 2 GCR register (SLSW mask bit 21)
196 PHY DX3GCR PHY DX 3 GCR register (SLSW mask bit 22)
200 PHY DX4CGR PHY DX 4 GCR register (SLSW mask bit 23)
204 PHY DX5GCR PHY DX 5 GCR register (SLSW mask bit 24)
208 PHY DX6GCR PHY DX 6 GCR register (SLSW mask bit 25)
212 PHY DX7GCR PHY DX 7 GCR register (SLSW mask bit 26)
216 PHY DX8GCR PHY DX 8 GCR register (SLSW mask bit 27)

10.1.2.6 Second-Level Bootloaders

Any of the boot modes can be used to download a second-level bootloader. A second-level bootloader allows for:

  • Any level of customization to current boot methods
  • Definition of a completely customized boot

10.1.3 SoC Security

The TI SoC contains security architecture that allows the C66x CorePacs and ARM CorePac to perform secure accesses within the device. For more information, contact a TI sales office for additional information available with the purchase of a secure device.

10.1.4 System PLL Settings

The PLL default settings are determined by the BOOTMODE[7:5] bits. Table 10-27 shows the settings for various input clock frequencies. This will set the PLL to the maximum clock setting for the device.

Equation 1. CLK = CLKIN × ((PLLM+1) ÷ ((CLKOD+1) × (PLLD+1)))

Where OUTPUT_DIVIDE is the value of the field of SECCTL[22:19]

The configuration for the PASS PLL is also shown. The PASS PLL is configured with these values only if the Ethernet boot mode is selected with the input clock set to match the main PLL clock (not the SGMII SerDes clock). See Table 10-11 for details on configuring Ethernet boot mode. The output from the PASS PLL goes through an on-chip divider to reduce the frequency before reaching the NETCP. The PASS PLL generates 1050 MHz, and after the chip divider (/3), applies 350 MHz to the NETCP.

The Main PLL is controlled using a PLL controller and a chip-level MMR. The ARM CorePac PLL, DDR3A PLL, DDR3BPLL, and PASS PLL are controlled by chip level MMRs. For details on how to set up the PLL see Section 11.5. For details on the operation of the PLL controller module, see the KeyStone Architecture Phase Locked Loop (PLL) Controller User's Guide.

Table 10-27 System PLL Configuration

BOOTMODE [7:5] INPUT CLOCK FREQ (MHz)(3) 800-MHz DEVICE 1000-MHz DEVICE 1200-MHz DEVICE PA = 350 MHz(1)
PLLD PLLM DSP ƒ PLLD PLLM DSP ƒ PLLD PLLM DSP ƒ PLLD PLLM DSP ƒ(2)
0b000 50.00 0 31 800 0 39 1000 0 47 1200 0 41 1050
0b001 66.67 0 23 800.04 0 29 1000.05 0 35 1200.06 1 62 1050.053
0b010 80.00 0 19 800 0 24 1000 0 29 1200 3 104 1050
0b011 100.00 0 15 800 0 19 1000 0 23 1200 0 20 1050
0b100 156.25 3 40 800.78 4 63 1000 2 45 1197.92 24 335 1050
0b101 250.00 4 31 800 0 7 1000 4 47 1200 4 41 1050
0b110 312.50 7 40 800.78 4 31 1000 2 22 1197.92 24 167 1050
0b111 122.88 0 12 798.72 3 64 999.989 0 19 1228.80 11 204 1049.6
(1) The PASS PLL generates 1050 MHz and is internally divided by 3 to feed 350 MHz to the packet accelerator.
(2) ƒ represents frequency in MHz.
(3) The CLKOD reset value = 1, and the value of 1 is used for all calculations in this table (based on Equation 1).

10.1.4.1 ARM CorePac System PLL Settings

The PLL default settings are determined by the BOOTMODE[11:9] bits. Table 10-28 shows settings for various input clock frequencies. This will set the PLL to the maximum clock setting for the device.

Equation 2. CLK = CLKIN × ((PLLM+1) ÷ ((CLKOD+1) × (PLLD+1)))

The ARM CorePac PLL is controlled using a PLL controller and a chip-level MMR. For details on how to set up the PLL see Section 11.5. For details on the operation of the PLL controller module, see the KeyStone Architecture Phase Locked Loop (PLL) Controller User's Guide.

Table 10-28 ARM PLL Configuration

BOOTMODE [11:9] INPUT CLOCK FREQ (MHz)(2) 800-MHz DEVICE 1000-MHz DEVICE 1200-MHz DEVICE 1400-MHz DEVICE
PLLD PLLM ARM ƒ PLLD PLLM ARM ƒ PLLD PLLM ARM ƒ PLLD PLLM ARM ƒ(1)
0b000 50.00 0 31 800 0 39 1000 0 47 1200 0 55 1400
0b001 66.67 0 23 800.04 0 29 1000.05 0 35 1200.06 0 41 1400.07
0b010 80.00 0 19 800 0 24 1000 0 29 1200 0 34 1400
0b011 100.00 0 15 800 0 19 1000 0 23 1200 0 27 1400
0b100 156.25 3 40 800.78 4 63 1000 2 45 1197.92 0 17 1406.25
0b101 250.00 4 31 800 0 7 1000 4 47 1200 4 55 1400
0b110 312.50 7 40 800.78 4 31 1000 2 22 1197.92 0 8 1406.25
0b111 122.88 0 12 798.72 3 64 999.40 0 19 1200.80 0 22 1413.12
(1) ƒ represents frequency in MHz.
(2) The CLKOD reset value = 1, and the value of 1 is used for all calculations in this table (based on Equation 2).

10.2 Device Configuration

Certain device configurations like boot mode and endianess are selected at device power-on reset. The status of the peripherals (enabled/disabled) is determined after device power-on reset. By default, the peripherals on the device are disabled and need to be enabled by software before being used.

10.2.1 Device Configuration at Device Reset

The logic level present on each device configuration pin is latched at power-on reset to determine the device configuration. The logic level on the device configuration pins can be set by using external pullup/pulldown resistors or by using some control device (for example, FPGA/CPLD) to intelligently drive these pins. When using a control device, care should be taken to ensure there is no contention on the lines when the device is out of reset. The device configuration pins are sampled during power-on reset and are driven after the reset is removed. To avoid contention, the control device must stop driving the device configuration pins of the SoC. Table 10-29 describes the device configuration pins.

NOTE

If a configuration pin must be routed out from the device and it is not driven (Hi-Z state), the internal pullup/pulldown (IPU/IPD) resistor should not be relied upon. TI recommends the use of an external pullup/pulldown resistor. For more detailed information on pullup/pulldown resistors and situations in which external pullup/pulldown resistors are required, see Section 4.4.

Table 10-29 Device Configuration Pins

CONFIGURATION PIN PIN NO. IPD/IPU (1) DESCRIPTION
LENDIAN(1)(2) F29 IPU Device endian mode (LENDIAN)
  • 0 = Device operates in big endian mode
  • 1 = Device operates in little endian mode
BOOTMODE[15:0](1)(2) B30, D29, A35, B29, E29, D30, C30, A30, G30, F31, E30, F30, A31, F24, E24, D24 IPD Method of boot
AVSIFSEL[1:0](1)(2) M1, M2 IPD AVS interface selection
  • 00 = AVS 4-pin 6-bit Dual-Phase VCNTL[5:2] (Default)
  • 01 = AVS 4-pin 4-bit Single-Phase VCNTL[5:2]
  • 10 = AVS 6-pin 6-bit Single-Phase VCNTL[5:0]
  • 11 = I2C
MAINPLLODSEL(1)(2) E32 IPD Main PLL Output divider select
  • 0 = Main PLL output divider needs to be set to 2 by BOOTROM
  • 1 = Reserved
ARMAVSSHARED(1) G24 IPD ARM AVS Shared with the rest of SOC AVS
  • 0 = Reserved
  • 1 = ARM Core voltage and rest of SoC core voltage shared
BOOTMODE_RSVD(1) B31 IPD Boot mode reserved. Pulldown resistor required on pin.
DDR3A_MAP_EN(1) A36 IPD Control ARM remapping of DDR3A address space in the lower 4GB (32b space) Mode select
  • 0 = DDR3A memory is accessible from ARM at 0x08 0000 0000-0x09 FFFF FFFF.
  • 1 = DDR3A memory is accessible from ARM at 0x00 8000 0000-0x00 FFFF FFFF with 0x00 8000 0000-0x00 FFFF FFFF aliased at 0x08 0000 0000-0x08 7FFF FFFF.
(1) Internal 100-μA pulldown or pullup is provided for this terminal. In most systems, a 1-kΩ resistor can be used to oppose the IPD/IPU. For more detailed information on pulldown/pullup resistors and situations in which external pulldown/pullup resistors are required, see Section 4.4.
(2) These signal names are the secondary functions of these pins.

10.2.2 Peripheral Selection After Device Reset

Several of the peripherals on the 66AK2Hxx are controlled by the Power Sleep Controller (PSC). By default, the PCIe, SRIO, and HyperLink are held in reset and clock-gated. The memories in these modules are also in a low-leakage sleep mode. Software is required to turn these memories on. Then, the software enables the modules (turns on clocks and deasserts reset) before these modules can be used.

If one of the above modules is used in the selected ROM boot mode, the ROM code automatically enables the module.

All other modules come up enabled by default and there is no special software sequence to enable. For more detailed information on the PSC usage, see the KeyStone Architecture Power Sleep Controller (PSC) User's Guide.

10.2.3 Device State Control Registers

The 66AK2Hxx device has a set of registers that are used to control the status of its peripherals. These registers are shown in Table 10-30.

Table 10-30 Device State Control Registers

ADDRESS START ADDRESS END SIZE ACRONYM DESCRIPTION
0x02620000 0x02620007 8B Reserved
0x02620008 0x02620017 16B Reserved
0x02620018 0x0262001B 4B JTAGID See Section 10.2.3.3
0x0262001C 0x0262001F 4B Reserved
0x02620020 0x02620023 4B DEVSTAT See Section 10.2.3.1
0x02620024 0x02620037 20B Reserved
0x02620038 0x0262003B 4B KICK0 See Section 10.2.3.4
0x0262003C 0x0262003F 4B KICK1
0x02620040 0x02620043 4B DSP_BOOT_ADDR0 The boot address for C66x CorePac0. See Section 10.2.3.5
0x02620044 0x02620047 4B DSP_BOOT_ADDR1 The boot address for C66x CorePac1. See Section 10.2.3.5
0x02620048 0x0262004B 4B DSP_BOOT_ADDR2 The boot address for C66x CorePac2. See Section 10.2.3.5
0x0262004C 0x0262004F 4B DSP_BOOT_ADDR3 The boot address for C66x CorePac3. See Section 10.2.3.5
0x02620050 0x02620053 4B DSP_BOOT_ADDR4 The boot address for C66x CorePac4 (66AK2H14/12 only). See Section 10.2.3.5
0x02620054 0x02620057 4B DSP_BOOT_ADDR5 The boot address for C66x CorePac5 (66AK2H14/12 only). See Section 10.2.3.5
0x02620058 0x0262005B 4B DSP_BOOT_ADDR6 The boot address for C66x CorePac6 (66AK2H14/12 only). See Section 10.2.3.5
0x0262005C 0x0262005F 4B DSP_BOOT_ADDR7 The boot address for C66x CorePac7 (66AK2H14/12 only). See Section 10.2.3.5
0x02620060 0x026200DF 128B Reserved
0x026200E0 0x0262010F 48B Reserved
0x02620110 0x02620117 8B MACID See Section 11.17
0x02620118 0x0262012F 24B Reserved
0x02620130 0x02620133 4B LRSTNMIPINSTAT_CLR See Section 10.2.3.7
0x02620134 0x02620137 4B RESET_STAT_CLR See Section 10.2.3.9
0x02620138 0x0262013B 4B Reserved
0x0262013C 0x0262013F 4B BOOTCOMPLETE See Section 10.2.3.10
0x02620140 0x02620143 4B Reserved
0x02620144 0x02620147 4B RESET_STAT See Section 10.2.3.8
0x02620148 0x0262014B 4B LRSTNMIPINSTAT See Section 10.2.3.6
0x0262014C 0x0262014F 4B DEVCFG See Section 10.2.3.2
0x02620150 0x02620153 4B PWRSTATECTL See Section 10.2.3.11
0x02620154 0x02620157 4B Reserved
0x02620158 0x0262015B 4B Reserved
0x0262015C 0x0262015F 4B Reserved
0x02620160 0x02620160 4B Reserved
0x02620164 0x02620167 4B Reserved
0x02620168 0x0262016B 4B Reserved
0x0262016C 0x0262017F 20B Reserved
0x02620180 0x02620183 4B SmartReflex Class0 See Section 11.2.4
0x02620184 0x0262018F 12B Reserved
0x02620190 0x02620193 4B Reserved
0x02620194 0x02620197 4B Reserved
0x02620198 0x0262019B 4B Reserved
0x0262019C 0x0262019F 4B Reserved
0x026201A0 0x026201A3 4B Reserved
0x026201A4 0x026201A7 4B Reserved
0x026201A8 0x026201AB 4B Reserved
0x026201AC 0x026201AF 4B Reserved
0x026201B0 0x026201B3 4B Reserved
0x026201B4 0x026201B7 4B Reserved
0x026201B8 0x026201BB 4B Reserved
0x026201BC 0x026201BF 4B Reserved
0x026201C0 0x026201C3 4B Reserved
0x026201C4 0x026201C7 4B Reserved
0x026201C8 0x026201CB 4B Reserved
0x026201CC 0x026201CF 4B Reserved
0x026201D0 0x026201FF 48B Reserved
0x02620200 0x02620203 4B NMIGR0 See Section 10.2.3.12
0x02620204 0x02620207 4B NMIGR1
0x02620208 0x0262020B 4B NMIGR2
0x0262020C 0x0262020F 4B NMIGR3
0x02620210 0x02620213 4B NMIGR4 (66AK2H14/12 only)
0x02620214 0x02620217 4B NMIGR5 (66AK2H14/12 only)
0x02620218 0x0262021B 4B NMIGR6 (66AK2H14/12 only)
0x0262021C 0x0262021F 4B NMIGR7 (66AK2H14/12 only)
0x02620220 0x0262023F 32B Reserved
0x02620240 0x02620243 4B IPCGR0 See Section 10.2.3.13
0x02620244 0x02620247 4B IPCGR1
0x02620248 0x0262024B 4B IPCGR2
0x0262024C 0x0262024F 4B IPCGR3
0x02620250 0x02620253 4B IPCGR4
0x02620254 0x02620257 4B IPCGR5
0x02620258 0x0262025B 4B IPCGR6
0x0262025C 0x0262025F 4B IPCGR7
0x02620260 0x02620263 4B IPCGR8
0x02620264 0x02620267 4B IPCGR9
0x02620268 0x0262026B 4B IPCGR10
0x0262026C 0x0262026F 4B IPCGR11
0x02620270 0x0262027B 12B Reserved
0x0262027C 0x0262027F 4B IPCGRH See Section 10.2.3.15
0x02620280 0x02620283 4B IPCAR0 See Section 10.2.3.14
0x02620284 0x02620287 4B IPCAR1
0x02620288 0x0262028B 4B IPCAR2
0x0262028C 0x0262028F 4B IPCAR3
0x02620290 0x02620293 4B IPCAR4
0x02620294 0x02620297 4B IPCAR5
0x02620298 0x0262029B 4B IPCAR6
0x0262029C 0x0262029F 4B IPCAR7
0x026202A0 0x026202A3 4B IPCAR8
0x026202A4 0x026202A7 4B IPCAR9
0x026202A8 0x026202AB 4B IPCAR10
0x026202AC 0x026202AF 4B IPCAR11
0x026202B0 0x026202BB 12B Reserved
0x026202BC 0x026202BF 4B IPCARH See Section 10.2.3.16
0x026202C0 0x026202FF 64B Reserved
0x02620300 0x02620303 4B TINPSEL See Section 10.2.3.17
0x02620304 0x02620307 4B TOUTPSEL See Section 10.2.3.18
0x02620308 0x0262030B 4B RSTMUX0 See Section 10.2.3.19
0x0262030C 0x0262030F 4B RSTMUX1
0x02620310 0x02620313 4B RSTMUX2
0x02620314 0x02620317 4B RSTMUX3
0x02620318 0x0262031B 4B RSTMUX4
0x0262031C 0x0262031F 4B RSTMUX5
0x02620320 0x02620323 4B RSTMUX6
0x02620324 0x02620327 4B RSTMUX7
0x02620328 0x0262032B 4B RSTMUX8
0x0262032C 0x0262032F 4B RSTMUX9
0x02620330 0x02620333 4B RSTMUX10
0x02620334 0x02620337 4B RSTMUX11
0x02620338 0x0262034F 4B Reserved
0x02620350 0x02620353 4B MAINPLLCTL0 See Section 11.5
0x02620354 0x02620357 4B MAINPLLCTL1
0x02620358 0x0262035B 4B PASSPLLCTL0 See Section 11.7
0x0262035C 0x0262035F 4B PASSPLLCTL1
0x02620360 0x02620363 4B DDR3APLLCTL0 See Section 11.6
0x02620364 0x02620367 4B DDR3APLLCTL1
0x02620368 0x0262036B 4B DDR3BPLLCTL0 See Section 11.6
0x0262036C 0x0262036F 4B DDR3BPLLCTL1
0x02620370 0x02620373 4B ARMPLLCTL0 See Section 10.1.4.1
0x02620374 0x02620377 4B ARMPLLCTL1
0x02620378 0x0262039B 132B Reserved
0x0262039C 0x0262039F 4B Reserved
0x02620400 0x02620403 4B ARMENDIAN_CFG0_0 See Section 10.2.3.21
0x02620404 0x02620407 4B ARMENDIAN_CFG0_1
0x02620408 0x0262040B 4B ARMENDIAN_CFG0_2
0x0262040C 0x026205FF 62B Reserved
0x02620600 0x026206FF 256B Reserved
0x02620700 0x02620703 4B CHIP_MISC_CTL0 See Section 10.2.3.24
0x02620704 0x0262070F 12B Reserved
0x02620710 0x02620713 4B SYSENDSTAT See Section 10.2.3.26
0x02620714 0x02620717 4B Reserved
0x02620718 0x0262071B 4B Reserved
0x0262071C 0x0262071F 4B Reserved
0x02620720 0x0262072F 16B Reserved
0x02620730 0x02620733 4B SYNECLK_PINCTL See Section 10.2.3.27
0x02620734 0x02620737 4B Reserved
0x02620738 0x0262074F 24B USB_PHY_CTL See Section 10.2.3.28
0x02620750 0x026207FF 176B Reserved
0x02620800 0x02620C7B 1148B Reserved
0x02620C7C 0x02620C7F 4B CHIP_MISC_CTL1 See Section 10.2.3.25
0x02620C80 0x02620C97 24B Reserved
0x02620C90
(silicon revisions 2.0, 3.0, and 3.1)		 0x02620C93
(silicon revisions 2.0, 3.0, and 3.1) 		4B DEVSPEED See Section 10.2.3.20
0x02620C98
(silicon revision 1.1, 1.0)		 0x02620C9B
(silicon revision 1.1, 1.0) 		4B DEVSPEED See Section 10.2.3.20
0x02620C9C 0x02620FFF 868B Reserved

10.2.3.1 Device Status (DEVSTAT) Register

The Device Status register depicts device configuration selected upon a power-on reset by the POR or RESETFULL pin. Once set, these bits remain set until a power-on reset. The Device Status register is shown in Figure 10-13 and described in Table 10-31.

Figure 10-13 Device Status Register
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Reserved DDR3A_
MAP_EN 		Reserved ARMAVSSHARED Rsvd MAINPLLODSEL AVSIFSEL BOOT
MODE
R-0000 0000 0000 00 R-x R-x R/W-x R-x R/W-x R/W-xx R/W-x xxxx xxxx xxxx xxx
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
BOOTMODE LENDIAN
R/W-x xxxx xxxx xxxx xxx R-x (1)
Legend: R = Read only; RW = Read/Write; -n = value after reset
(1) x indicates the bootstrap value latched via the external pin

Table 10-31 Device Status Register Field Descriptions

Bit Field Description
31-26 Reserved Reserved. Read only, writes have no effect.
25 DDR3A_MAP_EN DDR3A mapping enable
  • 0 = DDR3A memory is accessible from ARM at 0x8:0000_0000-0x9:FFFF_FFFF.
  • 1 = DDR3A memory is accessible in 32b space from ARM, that is, at 0x0:8000_0000-0x0:FFFF_FFFF. DDR3A is also accessible at 0x8:0000_0000-0x9:FFFF_FFFF, with the space 0x0:8000_0000-0x0:FFFF_FFFF address aliased at 0x8:0000_0000-0x8:7FFF_FFFF.
24-22 Reserved Reserved
21 ARMAVSSHARED ARM AVS Shared with the rest of SOC AVS
  • 0 = Reserved
  • 1 = ARM Core voltage and rest of SoC core voltage share
20 Reserved Reserved
19 MAINPLLODSEL Main PLL Output divider select
  • 0 = Main PLL output divider needs to be set to 2 by BOOTROM
  • 1 = Reserved
18-17 AVSIFSEL AVS interface selection
  • 00 = AVS 4pin 6bit Dual-Phase VCNTL[5:2] (Default)
  • 01 = AVS 4pin 4bit Single-Phase VCNTL[5:2]
  • 10 = AVS 6pin 6bit Single-Phase VCNTL[5:0]
  • 11 = I2C
16-1 BOOTMODE Determines the boot mode configured for the device. For more information on boot mode, see Section 10.1.2 and the KeyStone Architecture DSP Bootloader User's Guide.
0 LENDIAN Device endian mode (LENDIAN) — shows the status of whether the system is operating in big endian mode or little endian mode (default).
  • 0 = System is operating in big endian mode
  • 1 = System is operating in little endian mode (default)

10.2.3.2 Device Configuration Register

The Device Configuration Register is one-time writeable through software. The register is reset on all hard resets and is locked after the first write. The Device Configuration Register is shown in Figure 10-14 and described in Table 10-32.

Figure 10-14 Device Configuration Register (DEVCFG)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved PCIESSMODE SYSCLK
OUTEN
R-0 R/W-00 R/W-1
Legend: R = Read only; RW = Read/Write; -n = value after reset

Table 10-32 Device Configuration Register Field Descriptions

Bit Field Description
31-3 Reserved Reserved. Read only, writes have no effect.
2-1 PCIESSMODE Device Type Input of PCIeSS
  • 00 = Endpoint
  • 01 = Legacy Endpoint
  • 10 = Rootcomplex
  • 11 = Reserved
0 SYSCLKOUTEN SYSCLKOUT enable
  • 0 = No clock output
  • 1 = Clock output enabled (default)

10.2.3.3 JTAG ID (JTAGID) Register Description

The JTAG ID register is a read-only register that identifies to the customer the JTAG/Device ID. For the device, the JTAG ID register resides at address location 0x02620018. The JTAG ID register is shown in Figure 10-15 and described in Table 10-33.

Figure 10-15 JTAG ID (JTAGID) Register
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
VARIANT PART NUMBER MANUFACTURER LSB
R-xxxx R-1011 1001 1000 0001 R-0000 0010 111 R-1
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset

Table 10-33 JTAG ID Register Field Descriptions

Bit Field Value Description
31-28 VARIANT xxxx Variant value
27-12 PART NUMBER 1011 1001 1000 0001 Part Number for boundary scan
11-1 MANUFACTURER 0000 0010 111 Manufacturer
0 LSB 1 This bit is read as a 1

NOTE

The value of the VARIANT and PART NUMBER fields depends on the silicon revision being used. See the Silicon Errata for details.

10.2.3.4 Kicker Mechanism (KICK0 and KICK1) Register

The Bootcfg module contains a kicker mechanism to prevent spurious writes from changing any of the Bootcfg MMR (memory mapped registers) values. When the kicker is locked (which it is initially after power on reset), none of the Bootcfg MMRs are writable (they are only readable). This mechanism requires an MMR write to each of the KICK0 and KICK1 registers with exact data values before the kicker lock mechanism is unlocked. See Table 10-30 for the address location. Once released, all the Bootcfg MMRs having write permissions are writable (the read only MMRs are still read only). The KICK0 data is 0x83e70b13. The KICK1 data is 0x95a4f1e0. Writing any other data value to either of these kick MMRs locks the kicker mechanism and blocks writes to Bootcfg MMRs. To ensure protection to all Bootcfg MMRs, software must always relock the kicker mechanism after completing the MMR writes.

10.2.3.5 DSP Boot Address Register (DSP_BOOT_ADDRn)

The DSP_BOOT_ADDRn register stores the initial boot fetch address of CorePac_n (n = core number). The fetch address is the public ROM base address (for any boot mode) by default. DSP_BOOT_ADDRn register access should be permitted to any master or emulator when the device is non-secure. CorePac boots from that address when a reset is performed. The DSP_BOOT_ADDRn register is shown in Table 10-1 and described in Table 10-34.

Table 10-1 DSP BOOT Address Register (DSP_BOOT_ADDRn)

31 10 9 0
DSP_BOOT_ADDR Reserved
RW-0010000010110000000000 R-0
Legend: R = Read only; -n = value after reset

Table 10-34 DSP BOOT Address Register (DSP_BOOT_ADDRn) Field Descriptions

Bit Field Description
31-10 DSP_BOOT_ADDR Boot address of CorePac. CorePac boots from that address when a reset is performed. The reset value is 22 MSBs of ROM base address = 0x20B00000.
9-0 Reserved Reserved

10.2.3.6 LRESETNMI PIN Status (LRSTNMIPINSTAT) Register

The LRSTNMIPINSTAT register latches the status of LRESET and NMI. The LRESETNMI PIN Status register is shown in Figure 10-16 and described in Table 10-35.

Figure 10-16 LRESETNMI PIN Status Register (LRSTNMIPINSTAT)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved NMI7 NMI6 NMI5 NMI4 NMI3 NMI2 NMI1 NMI0 LR7 LR6 LR5 LR4 LR3 LR2 LR1 LR0
R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
Legend: R = Read only; -n = value after reset

Table 10-35 LRESETNMI PIN Status Register Field Descriptions

Bit Field Description
31-16 Reserved Reserved
15 NMI7 C66x CorePac7 in NMI (66AK2H14/12 only)
14 NMI6 C66x CorePac6 in NMI (66AK2H14/12 only)
13 NMI5 C66x CorePac5 in NMI (66AK2H14/12 only)
12 NMI4 C66x CorePac4 in NMI (66AK2H14/12 only)
11 NMI3 C66x CorePac3 in NMI
10 NMI2 C66x CorePac2 in NMI
9 NMI1 C66x CorePac1 in NMI
8 NMI0 C66x CorePac0 in NMI
7 LR7 C66x CorePac7 in Local Reset (66AK2H14/12 only)
6 LR6 C66x CorePac6 in Local Reset (66AK2H14/12 only)
5 LR5 C66x CorePac5 in Local Reset (66AK2H14/12 only)
4 LR4 C66x CorePac4 in Local Reset (66AK2H14/12 only)
3 LR3 C66x CorePac3 in Local Reset
2 LR2 C66x CorePac2 in Local Reset
1 LR1 C66x CorePac1 in Local Reset
0 LR0 C66x CorePac0 in Local Reset

10.2.3.7 LRESETNMI PIN Status Clear (LRSTNMIPINSTAT_CLR) Register

The LRSTNMIPINSTAT_CLR register clears the status of LRESET and NMI. The LRESETNMI PIN Status Clear register is shown in Figure 10-17 and described in Table 10-36.

Figure 10-17 LRESETNMI PIN Status Clear Register (LRSTNMIPINSTAT_CLR)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved NMI7 NMI6 NMI5 NMI4 NMI3 NMI2 NMI1 NMI0 LR7 LR6 LR5 LR4 LR3 LR2 LR1 LR0
R-0 WC-0 WC-0 WC-0 WC-0 WC-0 WC-0 WC-0 WC-0 WC-0 WC-0 WC-0 WC-0 WC-0 WC-0 WC-0 WC-0
Legend: R = Read only; -n = value after reset; WC = Write 1 to Clear

Table 10-36 LRESETNMI PIN Status Clear Register Field Descriptions

Bit Field Description
31-16 Reserved Reserved
15 NMI7 C66x CorePac7 in NMI Clear (66AK2H14/12 only)
14 NM6 C66x CorePac6 in NMI Clear (66AK2H14/12 only)
13 NMI5 C66x CorePac5 in NMI Clear (66AK2H14/12 only)
12 NMI4 C66x CorePac4 in NMI Clear (66AK2H14/12 only)
11 NMI3 C66x CorePac3 in NMI Clear
10 NMI2 C66x CorePac2 in NMI Clear
9 NMI1 C66x CorePac1 in NMI Clear
8 NMI0 C66x CorePac0 in NMI Clear
7 LR7 C66x CorePac7 in Local Reset Clear (66AK2H14/12 only)
6 LR6 C66x CorePac6 in Local Reset Clear (66AK2H14/12 only)
5 LR5 C66x CorePac5 in Local Reset Clear (66AK2H14/12 only)
4 LR4 C66x CorePac4 in Local Reset Clear (66AK2H14/12 only)
3 LR3 C66x CorePac3 in Local Reset Clear
2 LR2 C66x CorePac2 in Local Reset Clear
1 LR1 C66x CorePac1 in Local Reset Clear
0 LR0 C66x CorePac0 in Local Reset Clear

10.2.3.8 Reset Status (RESET_STAT) Register

The Reset Status register (RESET_STAT) captures the status of local reset (LRx) for each of the cores and also the global device reset (GR). Software can use this information to take different device initialization steps.

  • In case of local reset: The LRx bits are written as 1 and the GR bit is written as 0 only when the C66x CorePac receives a local reset without receiving a global reset.
  • In case of global reset: The LRx bits are written as 0 and the GR bit is written as 1 only when a global reset is asserted.

The Reset Status register is shown in Figure 10-18 and described in Table 10-37.

Figure 10-18 Reset Status Register (RESET_STAT)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
GR Reserved LR7 LR6 LR5 LR4 LR3 LR2 LR1 LR0
R-1 R-000 0000 0000 0000 0000 0000 R-0 R-0 R-0 R-0 R-0 R-0 R-0 R-0
Legend: R = Read only; -n = value after reset

Table 10-37 Reset Status Register Field Descriptions

Bit Field Description
31 GR Global reset status
  • 0 = Device has not received a global reset.
  • 1 = Device received a global reset.
30-8 Reserved Reserved.
7 LR7 C66x CorePac7 reset status (66AK2H14/12 only)
  • 0 = C66x CorePac7 has not received a local reset.
  • 1 = C66x CorePac7 received a local reset.
6 LR6 C66x CorePac6 reset status (66AK2H14/12 only)
  • 0 = C66x CorePac6 has not received a local reset.
  • 1 = C66x CorePac6 received a local reset.
5 LR5 C66x CorePac5 reset status (66AK2H14/12 only)
  • 0 = C66x CorePac5 has not received a local reset.
  • 1 = C66x CorePac5 received a local reset.
4 LR4 C66x CorePac4 reset status (66AK2H14/12 only)
  • 0 = C66x CorePac4 has not received a local reset.
  • 1 = C66x CorePac4received a local reset.
3 LR3 C66x CorePac3 reset status
  • 0 = C66x CorePac3 has not received a local reset.
  • 1 = C66x CorePac3 received a local reset.
2 LR2 C66x CorePac2 reset status
  • 0 = C66x CorePac2 has not received a local reset.
  • 1 = C66x CorePac2 received a local reset.
1 LR1 C66x CorePac1 reset status
  • 0 = C66x CorePac1 has not received a local reset.
  • 1 = C66x CorePac1 received a local reset.
0 LR0 C66x CorePac0 reset status
  • 0 = C66x CorePac0 has not received a local reset.
  • 1 = C66x CorePac0 received a local reset.

10.2.3.9 Reset Status Clear (RESET_STAT_CLR) Register

The RESET_STAT bits can be cleared by writing 1 to the corresponding bit in the RESET_STAT_CLR register. The Reset Status Clear register is shown in Figure 10-19 and described in Table 10-38.

Figure 10-19 Reset Status Clear Register (RESET_STAT_CLR)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
GR Reserved LR7 LR6 LR5 LR4 LR3 LR2 LR1 LR0
RW-0 R-000 0000 0000 0000 0000 0000 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0
Legend: R = Read only; RW = Read/Write; -n = value after reset

Table 10-38 Reset Status Clear Register Field Descriptions

Bit Field Description
31 GR Global reset clear bit
  • 0 = Writing a 0 has no effect.
  • 1 = Writing a 1 to the GR bit clears the corresponding bit in the RESET_STAT register.
30-8 Reserved Reserved.
7 LR7 C66x CorePac7 reset clear bit (66AK2H14/12 only)
  • 0 = Writing a 0 has no effect.
  • 1 = Writing a 1 to the LR7 bit clears the corresponding bit in the RESET_STAT register.
6 LR6 C66x CorePac6 reset clear bit (66AK2H14/12 only)
  • 0 = Writing a 0 has no effect.
  • 1 = Writing a 1 to the LR6 bit clears the corresponding bit in the RESET_STAT register.
5 LR5 C66x CorePac5 reset clear bit (66AK2H14/12 only)
  • 0 = Writing a 0 has no effect.
  • 1 = Writing a 1 to the LR5 bit clears the corresponding bit in the RESET_STAT register.
4 LR4 C66x CorePac4 reset clear bit (66AK2H14/12 only)
  • 0 = Writing a 0 has no effect.
  • 1 = Writing a 1 to the LR4 bit clears the corresponding bit in the RESET_STAT register.
3 LR3 C66x CorePac3 reset clear bit
  • 0 = Writing a 0 has no effect.
  • 1 = Writing a 1 to the LR3 bit clears the corresponding bit in the RESET_STAT register.
2 LR2 C66x CorePac2 reset clear bit
  • 0 = Writing a 0 has no effect.
  • 1 = Writing a 1 to the LR2 bit clears the corresponding bit in the RESET_STAT register.
1 LR1 C66x CorePac1 reset clear bit
  • 0 = Writing a 0 has no effect.
  • 1 = Writing a 1 to the LR1 bit clears the corresponding bit in the RESET_STAT register.
0 LR0 C66x CorePac0 reset clear bit
  • 0 = Writing a 0 has no effect.
  • 1 = Writing a 1 to the LR0 bit clears the corresponding bit in the RESET_STAT register.

10.2.3.10 Boot Complete (BOOTCOMPLETE) Register

The BOOTCOMPLETE register controls the BOOTCOMPLETE pin status to indicate the completion of the ROM booting process. The Boot Complete register is shown in Figure 10-20 and described in Table 10-39.

Figure 10-20 Boot Complete Register (BOOTCOMPLETE)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved BC11 BC10 BC9 BC8 BC7 BC6 BC5 BC4 BC3 BC BC1 BC0
R,-0000 0000 0000 0000 0000 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset

Table 10-39 Boot Complete Register Field Descriptions

Bit Field Description
31-12 Reserved Reserved.
11 BC11 ARM CorePac 3 boot status (66AK2H14/12 only)
  • 0 = ARM CorePac 3 boot NOT complete
  • 1 = ARM CorePac 3 boot complete
10 BC10 ARM CorePac 2 boot status (66AK2H14/12 only)
  • 0 = ARM CorePac 2 boot NOT complete
  • 1 = ARM CorePac 2 boot complete
9 BC9 ARM CorePac 1 boot status
  • 0 = ARM CorePac 1 boot NOT complete
  • 1 = ARM CorePac 1 boot complete
8 BC8 ARM CorePac 0 boot status
  • 0 = ARM CorePac 0 boot NOT complete
  • 1 = ARM CorePac 0 boot complete
7 BC7 C66x CorePac 7 boot status (66AK2H14/12 only)
  • 0 = C66x CorePac 7 boot NOT complete
  • 1 = C66x CorePac 7 boot complete
6 BC6 C66x CorePac 6 boot status (66AK2H14/12 only)
  • 0 = C66x CorePac 6 boot NOT complete
  • 1 = C66x CorePac 6 boot complete
5 BC5 C66x CorePac 5 boot status (66AK2H14/12 only)
  • 0 = C66x CorePac 5 boot NOT complete
  • 1 = C66x CorePac 5 boot complete
4 BC4 C66x CorePac 4 boot status (66AK2H14/12 only)
  • 0 = C66x CorePac 4 boot NOT complete
  • 1 = C66x CorePac 4 boot complete
3 BC3 C66x CorePac 3 boot status
  • 0 = C66x CorePac 3 boot NOT complete
  • 1 = C66x CorePac 3 boot complete
2 BC2 C66x CorePac2 boot status
  • 0 = C66x CorePac 2 boot NOT complete
  • 1 = C66x CorePac 2 boot complete
1 BC1 C66x CorePac1 boot status
  • 0 = C66x CorePac 1 boot NOT complete
  • 1 = C66x CorePac 1 boot complete
0 BC0 C66x CorePac 0 boot status
  • 0 = C66x CorePac 0 boot NOT complete
  • 1 = C66x CorePac 0 boot complete

The BCx bit indicates the boot complete status of the corresponding C66x CorePac. All BCx bits are sticky bits — that is, they can be set only once by the software after device reset and they will be cleared to 0 on all device resets (warm reset and power-on reset).

Boot ROM code is implemented such that each C66x CorePac sets its corresponding BCx bit immediately before branching to the predefined location in memory.

10.2.3.11 Power State Control (PWRSTATECTL) Register

The Power State Control register (PWRSTATECTL) is controlled by the software to indicate the power-saving mode. Under ROM code, the C66x CorePac reads this register to differentiate between the various power saving modes. This register is cleared only by POR and is not changed by any other device reset. See Hardware Design Guide for KeyStone II Devices for more information. The PWRSTATECTL register is shown in Figure 10-21 and described in Table 10-40.

Figure 10-21 Power State Control Register (PWRSTATECTL)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Hibernation Recovery Branch Address Width Wait Recovery Master Local Reset Action Stored SR Index Hibernation Mode Hibernation Rsvd
RW-0000 0000 0000 0000 00 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 R-0
Legend: R = Read Only, RW = Read/Write; -n = value after reset

Table 10-40 Power State Control Register Field Descriptions

Bit Field Description
31-10 Hibernation Recovery Branch Address Used to provide a start address for execution out of the hibernation modes. See the KeyStone Architecture DSP Bootloader User's Guide.
9 Width EMIF16 Width (if the recovery address is in EMIF16 space).
  • 0 = 8-bit
  • 1 = 16-bit
8 Wait Extended Wait (if the recovery address is in EMIF16 space)
  • 0 = Extended Wait disabled
  • 1 = Extended Wait enabled
7 Recovery Master Master performs hibernation recovery
  • 0 = C66x CorePacs perform hibernation recovery
  • 1 = ARM CorePac performs hibernation recovery
6-5 Local Reset Action Action of Local Reset
  • 00 = Idle on Local Reset
  • 01 = Branch to the base of MSMC on Local Reset
  • 10 = Branch to the base of DDR3 on Local Reset
  • 11 = Branch to the base of L2 on Local Reset (C66x CorePac)
4-3 Stored Index 0-3 value latched in the SR bits of the DEVSTAT register
2 Hibernation Mode Indicates whether the device is in hibernation mode 1 or mode 2.
  • 0 = Hibernation mode 1
  • 1 = Hibernation mode 2
1 Hibernation Indicates whether the device is in hibernation mode or not.
  • 0 = Not in hibernation mode
  • 1 = Hibernation mode
0 Reserved Reserved

10.2.3.12 NMI Event Generation to C66x CorePac (NMIGRx) Register

NMIGRx registers generate NMI events to the corresponding C66x CorePac. The 66AK2Hxx has eight (66AK2H12) or four (66AK2H06) NMIGRx registers (NMIGR0 through NMIGR7). The NMIGR0 register generates an NMI event to C66x CorePac0, the NMIGR1 register generates an NMI event to C66x CorePac1, and so on. Writing a 1 to the NMIG field generates an NMI pulse. Writing a 0 has no effect and Reads return 0 and have no other effect. The NMI event generation to the C66x CorePac is shown in Figure 10-22 and described in Table 10-41.

Figure 10-22 NMI Generation Register (NMIGRx)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved NMIG
R-0000 0000 0000 0000 0000 0000 0000 000 RW-0
Legend: RW = Read/Write; -n = value after reset

Table 10-41 NMI Generation Register Field Descriptions

Bit Field Description
31-1 Reserved Reserved
0 NMIG Reads return 0

Writes:

  • 0 = No effect
  • 1 = Creates NMI pulse to the corresponding C66x CorePac — C66x CorePac0 for NMIGR0, and so forth.

10.2.3.13 IPC Generation (IPCGRx) Registers

The IPCGRx registers facilitate inter-C66x CorePac interrupts.

The 66AK2H12 device has 12 IPCGRx registers (IPCGR0 through IPCGR11) and the 66AK2H06 has six IPCGRx registers (IPCGR0 through IPCGR3 and IPCGR8 and IPCGR9). These registers can be used by external hosts or CorePacs to generate interrupts to other CorePacs. A write of 1 to the IPCG field of the IPCGRx register generates an interrupt pulse to the:

  • C66x CorePacx (0 <= x <= 7) (66AK2H12) (0 <= x <= 3) (66AK2H06)
  • ARM CorePac core (x-8) (8<=x<=11) (66AK2H12) or (8<=x<=9) (66AK2H06).

These registers also provide a Source ID facility identifying up to 28 different sources of interrupts. Allocation of source bits to source processor and meaning is entirely based on software convention. The register field descriptions are given in the following tables. There can be numerous sources for these registers as this is completely controlled by software. Any master that has access to BOOTCFG module space can write to these registers. The IPC Generation register is shown in Figure 10-23 and described in Table 10-42.

Figure 10-23 IPC Generation Registers (IPCGRx)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
SRCS27-SRCS0 Reserved IPCG
RW +0 (per bit field) R-000 RW-0
Legend: R = Read only; RW = Read/Write; -n = value after reset

Table 10-42 IPC Generation Registers Field Descriptions

Bit Field Description
31-4 SRCSx Reads return current value of internal register bit.

Writes:

  • 0 = No effect
  • 1 = Sets both SRCSx and the corresponding SRCCx.
3-1 Reserved Reserved
0 IPCG Reads return 0.

Writes:

  • 0 = No effect
  • 1 = Creates an inter-DSP/ARM interrupt.

10.2.3.14 IPC Acknowledgment (IPCARx) Registers

The IPCARx registers facilitate inter-CorePac interrupt acknowledgment.

The 66AK2H12 device has 12 IPCARx registers and the 66AK2H06 has six IPCARx registers. These registers also provide a Source ID facility by which up to 28 different sources of interrupts can be identified. Allocation of source bits to source processor and meaning is entirely based on software convention. The register field descriptions are given in the following tables. Virtually anything can be a source for these registers as this is completely controlled by software. Any master that has access to BOOTCFG module space can write to these registers. The IPC Acknowledgment register is shown in Figure 10-24 and described in Table 10-43.

Figure 10-24 IPC Acknowledgment Registers (IPCARx)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
SRCC27-SRCC0 Reserved
RW +0 (per bit field) R-0000
Legend: R = Read only; RW = Read/Write; -n = value after reset

Table 10-43 IPC Acknowledgment Registers Field Descriptions

Bit Field Description
31-4 SRCCx Reads return current value of internal register bit.

Writes:

  • 0 = No effect
  • 1 = Clears both SRCCx and the corresponding SRCSx
3-0 Reserved Reserved

10.2.3.15 IPC Generation Host (IPCGRH) Register

The IPCGRH register facilitates interrupts to external hosts. Operation and use of the IPCGRH register is the same as for other IPCGR registers. The interrupt output pulse created by the IPCGRH register appears on device pin HOUT.

The host interrupt output pulse is stretched so that it is asserted for four bootcfg clock cycles (SYSCLK1/6) followed by a deassertion of four bootcfg clock cycles. Generating the pulse results in a pulse-blocking window that is eight SYSCLK1/6-cycles long. Back-to-back writes to the IPCRGH register with the IPCG bit (bit 0) set, generates only one pulse if the back-to-back writes to IPCGRH are less than the eight SYSCLK1/6 cycle window — the pulse blocking window. To generate back-to-back pulses, the back-to-back writes to the IPCGRH register must be written after the eight SYSCLK1/6 cycle pulse-blocking window has elapsed. The IPC Generation Host register is shown in Figure 10-25 and described in Table 10-44.

Figure 10-25 IPC Generation Registers (IPCGRH)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
SRCS27-SRCS0 Reserved IPCG
RW +0 (per bit field) R-000 RW +0
Legend: R = Read only; RW = Read/Write; -n = value after reset

Table 10-44 IPC Generation Registers Field Descriptions

Bit Field Description
31-4 SRCSx Reads return current value of internal register bit.

Writes:

  • 0 = No effect
  • 1 = Sets both SRCSx and the corresponding SRCCx.
3-1 Reserved Reserved
0 IPCG Reads return 0.

Writes:

  • 0 = No effect
  • 1 = Creates an interrupt pulse on device pin (host interrupt/event output in HOUT pin)

10.2.3.16 IPC Acknowledgment Host (IPCARH) Register

The IPCARH register facilitates external host interrupts. Operation and use of the IPCARH register is the same as for other IPCAR registers. The IPC Acknowledgment Host register is shown in Figure 10-26 and described in Table 10-45.

Figure 10-26 Acknowledgment Register (IPCARH)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
SRCC27-SRCC0 Reserved
RW +0 (per bit field) R-0000
Legend: R = Read only; RW = Read/Write; -n = value after reset

Table 10-45 IPC Acknowledgment Register Field Descriptions

Bit Field Description
31-4 SRCCx Reads the return current value of the internal register bit.

Writes:

  • 0 = No effect
  • 1 = Clears both SRCCx and the corresponding SRCSx
3-0 Reserved Reserved

10.2.3.17 Timer Input Selection Register (TINPSEL)

The Timer Input Selection register selects timer inputs and is shown in Figure 10-27 and described in Table 10-46.

Figure 10-27 Timer Input Selection Register (TINPSEL)
31 30 29 28 27 26 25 24
TINPHSEL15 TINPLSEL15 TINPHSEL14 TINPLSEL14 TINPHSEL13 TINPLSEL13 TINPHSEL12 TINPLSEL12
RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0
23 22 21 20 19 18 17 16
TINPHSEL11 TINPLSEL11 TINPHSEL10 TINPLSEL10 TINPHSEL9 TINPLSEL9 TINPHSEL8 TINPLSEL8
RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0
15 14 13 12 11 10 9 8
TINPHSEL7 TINPLSEL7 TINPHSEL6 TINPLSEL6 TINPHSEL5 TINPLSEL5 TINPHSEL4 TINPLSEL4
RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0
7 6 5 4 3 2 1 0
TINPHSEL3 TINPLSEL3 TINPHSEL2 TINPLSEL2 TINPHSEL1 TINPLSEL1 TINPHSEL0 TINPLSEL0
RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0 RW-0
LEGEND: R = Read only; RW = Read/Write; -n = value after reset

Table 10-46 Timer Input Selection Field Description

Bit Field Description
31 TINPHSEL15 Input select for TIMER15 high.
  • 0 = TIMI0
  • 1 = TIMI1
30 TINPLSEL15 Input select for TIMER15 low.
  • 0 = TIMI0
  • 1 = TIMI1
29 TINPHSEL14 Input select for TIMER14 high.
  • 0 = TIMI0
  • 1 = TIMI1
28 TINPLSE14 Input select for TIMER14 low.
  • 0 = TIMI0
  • 1 = TIMI1
27 TINPHSEL13 Input select for TIMER13 high.
  • 0 = TIMI0
  • 1 = TIMI1
26 TINPLSEL13 Input select for TIMER13 low.
  • 0 = TIMI0
  • 1 = TIMI1
25 TINPHSEL12 Input select for TIMER12 high.
  • 0 = TIMI0
  • 1 = TIMI1
24 TINPLSEL12 Input select for TIMER12low.
  • 0 = TIMI0
  • 1 = TIMI1
23 TINPHSEL11 Input select for TIMER11 high.
  • 0 = TIMI0
  • 1 = TIMI1
22 TINPLSEL11 Input select for TIMER11 low.
  • 0 = TIMI0
  • 1 = TIMI1
21 TINPHSEL10 Input select for TIMER10 high.
  • 0 = TIMI0
  • 1 = TIMI1
20 TINPLSEL10 Input select for TIMER10 low.
  • 0 = TIMI0
  • 1 = TIMI1
19 TINPHSEL9 Input select for TIMER9 high.
  • 0 = TIMI0
  • 1 = TIMI1
18 TINPLSEL9 Input select for TIMER9 low.
  • 0 = TIMI0
  • 1 = TIMI1
17 TINPHSEL8 Input select for TIMER8 high.
  • 0 = TIMI0
  • 1 = TIMI1
16 TINPLSEL8 Input select for TIMER8 low.
  • 0 = TIMI0
  • 1 = TIMI1
15 TINPHSEL7 Input select for TIMER7 high. (66AK2H14/12 only)
  • 0 = TIMI0
  • 1 = TIMI1
14 TINPLSEL7 Input select for TIMER7 low. (66AK2H14/12 only)
  • 0 = TIMI0
  • 1 = TIMI1
13 TINPHSEL6 Input select for TIMER6 high. (66AK2H14/12 only)
  • 0 = TIMI0
  • 1 = TIMI1
12 TINPLSEL6 Input select for TIMER6 low. (66AK2H14/12 only)
  • 0 = TIMI0
  • 1 = TIMI1
11 TINPHSEL5 Input select for TIMER5 high. (66AK2H14/12 only)
  • 0 = TIMI0
  • 1 = TIMI1
10 TINPLSEL5 Input select for TIMER5 low. (66AK2H14/12 only)
  • 0 = TIMI0
  • 1 = TIMI1
9 TINPHSEL4 Input select for TIMER4 high. (66AK2H14/12 only)
  • 0 = TIMI0
  • 1 = TIMI1
8 TINPLSEL4 Input select for TIMER4 low. (66AK2H14/12 only)
  • 0 = TIMI0
  • 1 = TIMI1
7 TINPHSEL3 Input select for TIMER3 high.
  • 0 = TIMI0
  • 1 = TIMI1
6 TINPLSEL3 Input select for TIMER3 low.
  • 0 = TIMI0
  • 1 = TIMI1
5 TINPHSEL2 Input select for TIMER2 high.
  • 0 = TIMI0
  • 1 = TIMI1
4 TINPLSEL2 Input select for TIMER2 low.
  • 0 = TIMI0
  • 1 = TIMI1
3 TINPHSEL1 Input select for TIMER1 high.
  • 0 = TIMI0
  • 1 = TIMI1
2 TINPLSEL1 Input select for TIMER1 low.
  • 0 = TIMI0
  • 1 = TIMI1

10.2.3.18 Timer Output Selection Register (TOUTPSEL)

The control register TOUTSEL handles the timer output selection and is shown in Figure 10-28 and described in Table 10-47.

Figure 10-28 Timer Output Selection Register (TOUTPSEL)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved TOUTPSEL1 TOUTPSEL0
R-0000000000000000000000 RW-00001 RW-00000
Legend: R = Read only; RW = Read/Write; -n = value after reset

Table 10-47 Timer Output Selection Register Field Descriptions

Bit Field Description
31-10 Reserved Reserved
9-5 TOUTPSEL1 Output select for TIMO1
  • 00000: TOUTL0
  • 00001: TOUTH0
  • 00010: TOUTL1
  • 00011: TOUTH1
  • 00100: TOUTL2
  • 00101: TOUTH2
  • 00110: TOUTL3
  • 00111: TOUTH3
  • 01000: TOUTL4 (66AK2H14/12 only)
  • 01001: TOUTH4 (66AK2H14/12 only)
  • 01010: TOUTL5 (66AK2H14/12 only)
  • 01011: TOUTH5 (66AK2H14/12 only)
  • 01100: TOUTL6 (66AK2H14/12 only)
  • 01101: TOUTH6 (66AK2H14/12 only)
  • 01110: TOUTL7 (66AK2H14/12 only)
  • 01111: TOUTH7 (66AK2H14/12 only)
  • 10000: TOUTL8
  • 10001: TOUTH8
  • 10010: TOUTL9
  • 10011: TOUTH9
  • 10100: TOUTL10
  • 10101: TOUTH10
  • 10110: TOUTL11
  • 10111: TOUTH11
  • 11000: TOUTL12
  • 11001: TOUTH12
  • 11010: TOUTL13
  • 11011: TOUTH13
  • 11100: TOUTL14
  • 11101: TOUTH14
  • 11110: TOUTL15
  • 11111: TOUTH15
4-0 TOUTPSEL0 Output select for TIMO0
  • 00000: TOUTL0
  • 00001: TOUTH0
  • 00010: TOUTL1
  • 00011: TOUTH1
  • 00100: TOUTL2
  • 00101: TOUTH2
  • 00110: TOUTL3
  • 00111: TOUTH3
  • 01000: TOUTL4 (66AK2H14/12 only)
  • 01001: TOUTH4 (66AK2H14/12 only)
  • 01010: TOUTL5 (66AK2H14/12 only)
  • 01011: TOUTH5 (66AK2H14/12 only)
  • 01100: TOUTL6 (66AK2H14/12 only)
  • 01101: TOUTH6 (66AK2H14/12 only)
  • 01110: TOUTL7 (66AK2H14/12 only)
  • 01111: TOUTH7 (66AK2H14/12 only)
  • 10000: TOUTL8
  • 10001: TOUTH8
  • 10010: TOUTL9
  • 10011: TOUTH9
  • 10100: TOUTL10
  • 10101: TOUTH10
  • 10110: TOUTL11
  • 10111: TOUTH11
  • 11000: TOUTL12
  • 11001: TOUTH12
  • 11010: TOUTL13
  • 11011: TOUTH13
  • 11100: TOUTL14
  • 11101: TOUTH14
  • 11110: TOUTL15
  • 11111: TOUTH15

10.2.3.19 Reset Mux (RSTMUXx) Register

Software controls the Reset Mux block through the reset multiplex registers using RSTMUX0 through RSTMUX11 (66AK2H12) or RSTMUX0 through RSTMUX3 (66AK2H06) for each of the C66x CorePacs and RSTMUX8 and RSTMUX9 (66AK2H06) for the ARM CorePac on the device. These registers are in Bootcfg memory space. The Reset Mux register is shown in Figure 10-29 and described in Table 10-48.

Figure 10-29 Reset Mux Register
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Reserved
R-0000 0000 0000 0000 0000 00
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved EVTSTATCLR Rsvd DELAY EVTSTAT OMODE LOCK
R-0000 0000 0000 0000 0000 00 RC-0 R-0 RW-100 R-0 RW-000 RW-0
Legend: R = Read only; RW = Read/Write; -n = value after reset; RC = Read only and write 1 to clear

Table 10-48 Reset Mux Register Field Descriptions

Bit Field Description
31-10 Reserved Reserved
9 EVTSTATCLR Clear event status
  • 0 = Writing 0 has no effect
  • 1 = Writing 1 to this bit clears the EVTSTAT bit
8 Reserved Reserved
7-5 DELAY Delay cycles between NMI and local reset
  • 000b = 256 SYSCLK1/6 cycles delay between NMI and local reset, when OMODE = 100b
  • 001b = 512 SYSCLK1/6 cycles delay between NMI and local reset, when OMODE = 100b
  • 010b = 1024 SYSCLK1/6 cycles delay between NMI and local reset, when OMODE = 100b
  • 011b = 2048 SYSCLK1/6 cycles delay between NMI and local reset, when OMODE = 100b
  • 100b = 4096 SYSCLK1/6 cycles delay between NMI and local reset, when OMODE = 100b (default)
  • 101b = 8192 SYSCLK1/6 cycles delay between NMI and local reset, when OMODE = 100b
  • 110b = 16384 SYSCLK1/6 cycles delay between NMI and local reset, when OMODE = 100b
  • 111b = 32768 SYSCLK1/6 cycles delay between NMI and local reset, when OMODE = 100b
4 EVTSTAT Event status
  • 0 = No event received (Default)
  • 1 = WD timer event received by Reset Mux block
3-1 OMODE Timer event operation mode
  • 000b = WD timer event input to the Reset Mux block does not cause any output event (default)
  • 001b = Reserved
  • 010b = WD Timer Event input to the Reset Mux block causes local reset input to C66x CorePac. Note that for Cortex-A15 processor watchdog timers, the Local Reset output event of the RSTMUX logic is connected to the Device Reset generation to generate reset to PLL Controller.
  • 011b = WD Timer Event input to the Reset Mux block causes NMI input to C66x CorePac. Note that for Cortex-A15 processor watchdog timers, the Local Reset output event of the RSTMUX logic is connected to the Device Reset generation to generate reset to PLL Controller.
  • 100b = WD Timer Event input to the Reset Mux block causes NMI input followed by local reset input to C66x CorePac. Delay between NMI and local reset is set in DELAY bit field. Note that for Cortex-A15 processor watchdog timers, the Local Reset output event of the RSTMUX logic is connected to the Device Reset generation to generate reset to PLL Controller.
  • 101b = WD timer event input to the Reset Mux block causes device reset to 66AK2Hxx. Note that for Cortex-A15 processor watchdog timers, the Local Reset output event of the RSTMUX logic is connected to the Device Reset generation to generate reset to PLL Controller.
  • 110b = Reserved
  • 111b = Reserved
0 LOCK Lock register fields
  • 0 = Register fields are not locked (default)
  • 1 = Register fields are locked until the next timer reset

10.2.3.20 Device Speed (DEVSPEED) Register

The Device Speed register shows the device speed grade and is shown in Figure 10-30 and described in Table 10-49.

Figure 10-30 Device Speed Register (DEVSPEED)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved DEVSPEED Reserved ARMSPEED
R-n R-n R-n R-n
Legend: R = Read only; -n = value after reset

Table 10-49 Device Speed Register Field Descriptions

Bit Field Description
31-28 Reserved Reserved. Read only
27-16 DEVSPEED Indicates the speed of the device (read only)
  • 0b0000 0000 0000 = 800 MHz
  • 0b0000 0000 0001 = 1000 MHz
  • 0b0000 0000 001x = 1200 MHz
  • 0b0000 0000 01xx = Reserved
  • 0b0000 0000 1xxx = Reserved
  • 0b0000 0001 xxxx = Reserved
  • 0b0000 001x xxxx = Reserved
  • 0b0000 01xx xxxx = Reserved
  • 0b0000 1xxx xxxx = 1200 MHz
  • 0b0001 xxxx xxxx= 1000 MHz
  • 0b001x xxxx xxxx = 800 MHz
15-12 Reserved Reserved. Read only
11-0 ARMSPEED Indicates the speed of the ARM (read only)
  • 0b0000 0000 0000 = 800 MHz
  • 0b0000 0000 0001 = 1000 MHz
  • 0b0000 0000 001x = 1200 MHz
  • 0b0000 0000 01xx = 1350 MHz(1)
  • 0b0000 0000 1xxx = 1400 MHz(1)
  • 0b0000 0001 xxxx = Reserved
  • 0b0000 001x xxxx = 1400 MHz(1)
  • 0b0000 01xx xxxx = 1350.8 MHz(1)
  • 0b0000 1xxx xxxx = 1200 MHz
  • 0b0001 xxxx xxxx= 1000 MHz
  • 0b001x xxxx xxxx = 800 MHz
(1) Possible future support.

10.2.3.21 ARM Endian Configuration Register 0 (ARMENDIAN_CFGr_0), r=0..7

The registers defined in ARM Configuration register 0 (ARMENDIAN_CFGr_0) control the way Cortex-A15 processor core access to peripheral MMRs shows up in the Cortex-A15 processor registers. The purpose is to provide an endian-invariant view of the peripheral MMRs when performing a 32-bit access. (Only one of the eight register sets is shown in Figure 10-31 and described in Table 10-50.)

Figure 10-31 ARM Endian Configuration Register 0 (ARMENDIAN_CFGr_0), r=0..7
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
BASEADDR Reserved
RW-0000 0000 0000 0000 0000 0000 R-0000 0000
Legend: RW = Read/Write; R = Read only

Table 10-50 ARM Endian Configuration Register 0 Field Descriptions

Bit Field Description
31-8 BASEADDR 24-bit Base Address of Configuration Region R

This base address defines the start of a contiguous block of memory-mapped register space for which a word swap is done by the ARM CorePac bridge.

7-0 Reserved Reserved

10.2.3.22 ARM Endian Configuration Register 1 (ARMENDIAN_CFGr_1), r=0..7

The registers defined in ARM Configuration register 1 (ARMENDIAN_CFGr_1) control the way Cortex-A15 processor core access to peripheral MMRs shows up in the Cortex-A15 processor registers. The purpose is to provide an endian-invariant view of the peripheral MMRs when performing a 32-bit access. (Only one of the eight register sets is shown in Figure 10-32 and described in Table 10-51.)

Figure 10-32 ARM Endian Configuration Register 1 (ARMENDIAN_CFGr_1), r=0..7
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved SIZE
R-0000 0000 0000 0000 0000 0000 0000 RW-0000
Legend: RW = Read/Write; R = Read only

Table 10-51 ARM Endian Configuration Register 1 Field Descriptions

Bit Field Description
31-4 Reserved Reserved
3-0 SIZE 4-bit encoded size of Configuration Region R

The value in the SIZE field defines the size of the contiguous block of memory-mapped register space for which a word swap is done by the ARM CorePac bridge (starting from ARMENDIAN_CFGr_0.BASEADDR).

  • 0000 : 64KB
  • 0001 : 128KB
  • 0010 : 256KB
  • 0011 : 512KB
  • 0100 : 1MB
  • 0101 : 2MB
  • 0110 : 4MB
  • 0111 : 8MB
  • 1000 : 16MB
  • 1001 : 32MB
  • 1010 : 64MB
  • 1011 : 128MB
  • Others : Reserved

10.2.3.23 ARM Endian Configuration Register 2 (ARMENDIAN_CFGr_2), r=0..7

The registers defined in ARM Configuration register 2 (ARMENDIAN_CFGr_2) enable the word swapping of a region. The ARMENDIAN_CFGr_2 register is shown in Figure 10-33 and described in Table 10-52.

Figure 10-33 ARM Endian Configuration Register 2 (ARMENDIAN_CFGr_2), r=0..7
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved DIS
R-0000 0000 0000 0000 0000 0000 0000 000 RW-0
Legend: RW = Read/Write

Table 10-52 ARM Endian Configuration Register 2 Field Descriptions

Bit Field Description
31-1 Reserved Reserved
0 DIS Disabling the word swap of a region
  • 0 : Enable word swap for region
  • 1 : Disable word swap for region

10.2.3.24 Chip Miscellaneous Control (CHIP_MISC_CTL0) Register

The Chip Miscellaneous Control (CHIP_MISC_CTL0) register is shown in Figure 10-34 and described in Table 10-53.

Figure 10-34 Chip Miscellaneous Control Register (CHIP_MISC_CTL0)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Reserved USB_PME_EN AETMUX
SEL1		 AETMUX
SEL0
R-0 RW-0 RW-0 RW-0
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved Rsvd MSMC_
BLOCK_
PARITY_
RST		 Reserved QM_PRIORITY
RW-0 RW-0 RW-0 RW-0 RW-0
Legend: R = Read only; W = Write only; -n = value after reset

Table 10-53 Chip Miscellaneous Control Register Field Descriptions

Bit Field Description
31-19 Reserved Reserved.
18 USB_PME_EN Enables wakeup event generation from USB
  • 0 = Disable PME event generation
  • 1 = Enable PME event generation
17 AETMUXSEL1 Controls the mux that selects whether an AET event from EDMA CC2 or EDMA CC3 is connected to the C66x Interrupt Controller
  • 0 = EDMA CC2 (default)
  • 1 = EDMA CC3
16 AETMUXSEL0 Controls the mux that selects whether an AET event from EDMA CC2 or EDMA CC4 is connected to the C66x Interrupt Controller
  • 0 = EDMA CC2 (default)
  • 1 = EDMA CC4
15-14 Reserved Reserved
13 Reserved Reserved
12 MSMC_BLOCK_PARITY_RST Controls MSMC parity RAM reset. When set to ‘1’ means the MSMC parity RAM will not be reset.
11-3 Reserved Reserved
2-0 QM_PRIORITY Control the priority level for the transactions from QM_Master port, which access the external linking RAM.

10.2.3.25 Chip Miscellaneous Control (CHIP_MISC_CTL1) Register

The Chip Miscellaneous Control (CHIP_MISC_CTL1) register is shown in Figure 10-35 and described in Table 10-54.

Figure 10-35 Chip Miscellaneous Control Register (CHIP_MISC_CTL1)
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved IO_TRACE_SEL ARM_PLL_
EN		 Reserved
R-0000 0000 00000000 RW-0 RW-0 RW-0000000000000
Legend: R = Read only; RW = Read/Write; -n = value after reset

Table 10-54 Chip Miscellaneous Control Register Field Descriptions

Bit Field Description
31-15 Reserved Reserved.
14 IO_TRACE_SEL This bit controls the pin muxing of GPIO[31:17] and EMU[33:19] pin
  • 0 = GPIO[31:17] is selected
  • 1 = EMU[33:19] pins is selected
13 ARM_PLL_EN This bit controls the glitchfree clock mux between bypass clock and ARM PLL output clock
  • 0 = Bypass clock (default)
  • 1 = PLL output clock
12-0 Reserved

10.2.3.26 System Endian Status Register (SYSENDSTAT)

This register provides a way for reading the system endianness in an endian-neutral way. A zero value indicates big endian and a nonzero value indicates little endian. The SYSENDSTAT register captures the LENDIAN BOOTMODE pin and is used by the BOOTROM to guide the bootflow. The value is latched on the rising edge of POR or RESETFULL . The SYSENDSTAT register is shown in Figure 10-36 and described in Table 10-55.

Figure 10-36 System Endian Status Register
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved SYSENDSTAT
R-0000 0000 0000 0000 0000 0000 0000 000 R-0
Legend: RW = Read/Write; -n = value after reset

Table 10-55 System Endian Status Register Field Descriptions

Bit Field Description
31-1 Reserved Reserved
0 SYSENDSTAT Reflects the same value as the LENDIAN bit in the DEVSTAT register.
  • 0 = C66x/System is in Big Endian
  • 1 = C66x/System is in Little Endian

10.2.3.27 SYNECLK_PINCTL Register

This register controls the routing of recovered clock signals from any Ethernet port (SGMII of the multiport switches) to the clock output TSRXCLKOUT0/TSRXCLKOUT1. The SYNECLK_PINCTL register is shown in Figure 10-37 and described in Table 10-56.

Figure 10-37 SYNECLK_PINCTL Register
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved TSRXCLKOUT1SEL Rsvd TSRXCLKOUT0SEL
R-0000 0000 0000 0000 0000 0000 0 RW-0 RW-0
Legend: RW = Read/Write; -n = value after reset

Table 10-56 SYNECLK_PINCTL Register Field Descriptions

Bit Field Description
31-7 Reserved
6-4 TSRXCLKOUT1SEL
  • 000 = SGMII Lane 0 rxbclk
  • 001 = SGMII Lane 1 rxbclk
  • 010 = SGMII Lane 2 rxbclk
  • 011 = SGMII Lane 3 rxbclk
  • 100 = Reserved. Do not write.
  • 101 = Reserved. Do not write.
  • 110 = Reserved. Do not write.
  • 111 = Reserved. Do not write.
3 Reserved
2-0 TSRXCLKOUT0SEL
  • 000 = SGMII Lane 0 rxbclk
  • 001 = SGMII Lane 1 rxbclk
  • 010 = SGMII Lane 2 rxbclk
  • 011 = SGMII Lane 3 rxbclk
  • 100 = Reserved. Do not write.
  • 101 = Reserved. Do not write.
  • 110 = Reserved. Do not write.
  • 111 = Reserved. Do not write.

10.2.3.28 USB PHY Control (USB_PHY_CTLx) Registers

The USB PHY Control (USB_PHY_CTLx) registers are shown in Figure 10-38, Figure 10-39, Figure 10-40, Figure 10-41, Figure 10-42, and Figure 10-43 and described in Table 10-57, Table 10-58, Table 10-59, Table 10-60, Figure 10-42, and Table 10-62.

Figure 10-38 USB_PHY_CTL0 Register
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Reserved
R-0
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved PHY_
RTUNE_
ACK		 PHY_
RTUNE_
REQ		 Rsvd PHY_TC_
VATESTENB		 PHY_TC_TEST_
POWER
DOWN_
SSP		 PHY_TC_TEST_
POWER
DOWN_
HSP		 PHY_TC_LOOP
BACKENB		 Rsvd UTMI_
VBUS
VLDEXT		 UTMI_TXBITSTUFFENH UTMI_TXBITSTUFFEN
R-0 R-0 R/W-0 R-0 R/W-00 R/W-0 R/W-0 R/W-0 R-0 R/W-0 R/W-0 R/W-0
Legend: R = Read only; W = Write only; -n = value after reset

Table 10-57 USB_PHY_CTL0 Register Field Descriptions

Bit Field Description
31-12 Reserved Reserved
11 PHY_RTUNE_ACK The PHY uses an external resistor to calibrate the termination impedances of the PHY's high-speed inputs and outputs.

The resistor is shared between the USB2.0 high-speed outputs and the Super-speed I/O. Each time the PHY is taken out of a reset, a termination calibration is performed. For SS link, the calibration can also be requested externally by asserting the PHY_RTUNE_REQ. When the calibration is complete, the PHY_RTUNE_ACK transitions low.

A resistor calibration on the SS link cannot be performed while the link is operational

10 PHY_RTUNE_REQ See PHY_RTUNE_ACK.
9 Reserved Reserved
8-7 PHY_TC_VATESTENB Analog Test Pin Select.

Enables analog test voltages to be placed on the ID pin.

  • 11 = Invalid setting.
  • 10 = Invalid setting.
  • 01 = Analog test voltages can be viewed or applied on ID.
  • 00 = Analog test voltages cannot be viewed or applied on ID.
6 PHY_TC_TEST_POWERDOWN_SSP SS Function Circuits Power-Down Control.

Powers down all SS function circuitry in the PHY for IDDQ testing.

5 PHY_TC_TEST_POWERDOWN_HSP HS Function Circuits Power-Down Control

Powers down all HS function circuitry in the PHY for IDDQ testing.

4 PHY_TC_LOOPBACKENB Loop-back Test Enable

Places the USB3.0 PHY in HS Loop-back mode, which concurrently enables the HS receive and transmit logic.

  • 1 = During HS data transmission, the HS receive logic is enabled.
  • 0 = During HS data transmission, the HS receive logic is disabled.
3 Reserved
  • Reserved
2 UTMI_VBUSVLDEXT External VBUS Valid Indicator

Function: Valid in Device mode and only when the VBUSVLDEXTSEL signal is set to 1'b1. VBUSVLDEXT indicates whether the VBUS signal on the USB cable is valid. In addition, VBUSVLDEXT enables the pull-up resistor on the D+ line.

  • 1 = VBUS signal is valid, and the pull-up resistor on D+ is enabled.
  • 0 = VBUS signal is not valid, and the pull-up resistor on D+ is disabled.
1 UTMI_TXBITSTUFFENH High-byte Transmit Bit-Stuffing Enable

Function: controls bit stuffing on DATAINH[7:0] when OPMODE[1:0]=11b.

  • 1 = Bit stuffing is enabled.
  • 0 = Bit stuffing is disabled.
0 UTMI_TXBITSTUFFEN Low-byte Transmit Bit-Stuffing Enable

Function: controls bit stuffing on DATAIN[7:0] when OPMODE[1:0]=11b.

  • 1 = Bit stuffing is enabled.
  • 0 = Bit stuffing is disabled.
Figure 10-39 USB_PHY_CTL1 Register
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Reserved
R-0
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved PIPE_REF_CLKREQ_N PIPE_TX2RX_LOOPBK PIPE_EXT_PCLK_
REQ		 PIPE_ALT_CLK_
SEL		 PIPE_ALT_CLK_
REQ		 PIPE_ALT_CLK_EN
R-0 R-0 R/W-0 R/W-0 R/W-0 R-0 R/W-0
Legend: R = Read only; R/W = Read/Write, -n = value after reset

Table 10-58 USB_PHY_CTL1 Register Field Descriptions

Bit Field Description
31-6 Reserved Reserved
5 PIPE_REF_CLKREQ_N Reference Clock Removal Acknowledge.

When the pipeP_power-down control into the PHY turns off the MPLL in the P3 state, PIPE_REF_CLKREQ_N is asserted after the PLL is stable and the reference clock can be removed.

4 PIPE_TX2RX_LOOPBK Loop-back.

When this signal is asserted, data from the transmit predriver is looped back to the receiver slicers. LOS is bypassed and based on the tx_en input so that rx_los=!tx_data_en.

3 PIPE_EXT_PCLK_REQ External PIPE Clock Enable Request.

When asserted, this signal enables the pipeP_pclk output regardless of power state (along with the associated increase in power consumption).

2 PIPE_ALT_CLK_SEL Alternate Clock Source Select.

Selects the alternate clock sources instead of the internal MPLL outputs for the PCS clocks.

  • 1 = Uses alternate clocks.
  • 0 = Users internal MPLL clocks.

Change only during a reset.

1 PIPE_ALT_CLK_REQ Alternate Clock Source Request.

Indicates that the alternate clocks are needed by the slave PCS (that is, to boot the master MPLL). Connect to the alt_clk_en on the master.

0 PIPE_ALT_CLK_EN Alternate Clock Enable.

Enables the ref_pcs_clk and ref_pipe_pclk output clocks (if necessary, powers up the MPLL).

Figure 10-40 USB_PHY_CTL2 Register
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Reserved PHY_PC_LOS_BIAS PHY_PC_TXVREFTUNE PHY_PC_
TXRISETUNE		 PHY_PC_
TXRESTUNE		 PHY_PC_
TX
PREEMP
PULSE
T
UNE		 PHY_PC_TXPREEMPAMPTUNE
R-0 R/W-101 R/W-1000 R/W-01 R/W-01 R/W-0 R/W-00
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
PHY_PC_
TXHSXVTUNE		 PHY_PC_TXFSLSTUNE PHY_PC_SQRXTUNE PHY_PC_OTGTUNE Rsvd PHY_PC_
COMPDISTUNE
R/W-11 R/W-0011 R/W-011 R/W-100 R-0 R/W-100
Legend: R = Read only; R/W = Read/Write, -n = value after reset

Table 10-59 USB_PHY_CTL2 Register Field Descriptions

Bit Field Description
31-30 Reserved Reserved
29-27 PHY_PC_LOS_BIAS Loss-of-Signal Detector Threshold Level Control.

Sets the LOS detection threshold level.

  • +1 = results in a +15 mVp incremental change in the LOS threshold.
  • –1 = results in a –15 mVp incremental change in the LOS threshold.

Note: the 000b setting is reserved and must not be used.

26-23 PHY_PC_TXVREFTUNE HS DC Voltage Level Adjustment.

Adjusts the high-speed DC level voltage.

  • +1 = results in a +1.25% incremental change in high-speed DC voltage level.
  • –1 = results in a –1.25% incremental change in high-speed DC voltage level.
22-21 PHY_PC_TXRISETUNE HS Transmitter Rise/Fall TIme Adjustment.

Adjusts the rise/fall times of the high-speed waveform.

  • +1 = results in a –4% incremental change in the HS rise/fall time.
  • –1 = results in a +4% incremental change in the HS rise/fall time.
20-19 PHY_PC_TXRESTUNE USB Source Impedance Adjustment.

Some applications require additional devices to be added on the USB, such as a series switch, which can add significant series resistance. This bus adjusts the driver source impedance to compensate for added series resistance on the USB.

18 PHY_PC_
TXPREEMPPULSETUNE		 HS Transmitter Pre-Emphasis Duration Control.

Controls the duration for which the HS pre-emphasis current is sourced onto DP or DM. It is defined in terms of unit amounts. One unit of pre-emphasis duration is approximately 580 ps and is defined as 1x pre-emphasis duration. This signal valid only if either txpreempamptune[1] or txpreempamptune[0] is set to 1.

  • 1 = 1x, short pre-emphasis current duration.
  • 0 = 2x, long pre-emphasis current duration.
17-16 PHY_PC_TXPREEMPAMPTUNE HS Transmitter Pre-Emphasis Current Control.

Controls the amount of current sourced to DP and DM after a J-to-K or K-to-J transition.

The HS Transmitter pre-emphasis current is defined in terms of unit amounts. One unit amount is approximately 600 µA and is defined as 1x pre-emphasis current.

  • 11 = 3x pre-emphasis current.
  • 10 = 2x pre-emphasis current.
  • 01 = 1x pre-emphasis current.
  • 00 = HS Transmitter pre-emphasis is disabled.
15-14 PHY_PC_TXHSXVTUNE Transmitter High-Speed Crossover Adjustment.

Adjusts the voltage at which the DP and DM signals cross while transmitting in HS mode.

  • 11 = Default setting.
  • 10 = +15 mV
  • 01 = –15 mV
  • 00 = Reserved
13-10 PHY_PC_TXFSLSTUNE FS/LS Source Impedance Adjustment.

Adjusts the low- and full-speed single-ended source impedance while driving high.

This parameter control is encoded in thermometer code.

  • +1 = results in a –2.5% incremental change in threshold voltage level.
  • –1 = results in a +2.5% incremental change in threshold voltage level.

Any nonthermometer code setting (that is 1001) is not supported and reserved.

9-7 PHY_PC_SQRXTUNE Squelch Threshold Adjustment.

Adjusts the voltage level for the threshold used to detect valid high-speed data.

  • +1 = results in a –5% incremental change in threshold voltage level.
  • –1 = results in a +5% incremental change in threshold voltage level.
6-4 PHY_PC_OTGTUNE VBUS Valid Threshold Adjustment.

Adjusts the voltage level for the VBUS valid threshold.

  • +1 = results in a +1.5% incremental change in threshold voltage level.
  • –1 = results in a –1.5% incremental change in threshold voltage level.
3 Reserved Reserved
2-0 PHY_PC_COMPDISTUNE Disconnect Threshold Adjustment.

Adjusts the voltage level for the threshold used to detect a disconnect event at the host.

  • +1 = results in a +1.5% incremental change in the threshold voltage level.
  • –1 = results in a –1.5% incremental change in the threshold voltage level.
Figure 10-41 USB_PHY_CTL3 Register
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Reserved PHY_PC_PCS_TX_SWING_FULL PHY_PC_PCS_TX_DEEMPH_6DB Rsvd
R-0 R/W-1111000 R/W-100000 R-0
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Reserved PHY_PC_PCS_TX_DEEMPH_3P5DB PHY_PC_LOS_LEVEL
R-0 R/W-010101 R/W-01001
Legend: R = Read only; R/W = Read/Write, -n = value after reset

Table 10-60 USB_PHY_CTL3 Register Field Descriptions

Bit Field Description
31-30 Reserved Reserved
29-23 PHY_PC_PCS_TX_SWING_
FULL		 Tx Amplitude (Full Swing Mode).

Sets the launch amplitude of the transmitter. It can be used to tune Rx eye for compliance.

22-17 PHY_PC_PCS_TX_DEEMPH_
6DB		 Tx De-Emphasis at 6 dB.

Sets the Tx driver de-emphasis value when pipeP_tx_deemph[1:0] is set to 10b (according to the PIPE3 specification). This bus is provided for completeness and as a second potential launch amplitude.

16-11 Reserved Reserved
10-5 PHY_PC_PCS_TX_DEEMPH_
3P5DB		 Tx De-Emphasis at 3.5 dB.

Sets the Tx driver de-emphasis value when pipeP_tx_deemph[1:0] is set to 10b (according to the PIPE3 specification). Can be used for Rx eye compliance.

4-0 PHY_PC_LOS_LEVEL Loss-of-Signal Detector Sensitivity Level Control.

Sets the LOS detection threshold level. This signal must be set to 0x9.

Figure 10-42 USB_PHY_CTL4 Register
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
PHY_SSC_EN PHY_REF_USE_
PAD		 PHY_REF_SSP_EN PHY_
MPLL_
REFSSC_
CLK_EN		 PHY_FSEL PHY_RETENABLEN PHY_REFCLKSEL PHY_
COMMON
ONN		 Rsvd PHY_OTG_VBUSVLDEXTSEL
R/W-1 R/W-0 R/W-0 R/W-0 R/W-100111 R/W-1 R/W-10 R/W-0 R-0 R/W-0
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
PHY_OTG
_ OTG
DISABLE		 PHY_PC_TX_VBOOST_LVL PHY_PC_LANE0_TX_TERM_
OFFSET		 Reserved
R/W-1 R/W-100 R/W-00000 R-0
Legend: R = Read only; R/W = Read/Write, -n = value after reset

Table 10-61 USB_PHY_CTL4 Register Field Descriptions

Bit Field Description
31 PHY_SSC_EN Spread Spectrum Enable.

Enables spread spectrum clock production (0.5% down-spread at ~31.5 KHz) in the USB3.0 PHY. If the reference clock already has spread spectrum applied, ssc_en must be deasserted.

30 PHY_REF_USE_PAD Select Reference Clock Connected to ref_pad_clk_{p,m}.

When asserted, selects the external ref_pad_clk_{p,m} inputs as the reference clock source. When deasserted, ref_alt_clk_{p,m} are selected for an on-chip reference clock source.

29 PHY_REF_SSP_EN Reference Clock Enables for SS function.

Enables the reference clock to the prescaler. The ref_ssp_en signal must remain deasserted until the reference clock is running at the appropriate frequency, at which point ref_ssp_en can be asserted. For lower power states, ref_ssp_en can also be de asserted.

28 PHY_MPLL_REFSSC_CLK_EN Double-Word Clock Enable.

Enables/disables the mpll_refssc_clk signal. To prevent clock glitch, it must be changed when the PHY is inactive.

27-22 PHY_FSEL Frequency Selection.

Selects the reference clock frequency used for both SS and HS operations. The value for fsel combined with the other clock and enable signals will determine the clock frequency used for SS and HS operations and if a shared or separate reference clock will be used.

21 PHY_RETENABLEN Lowered Digital Supply Indicator.

Indicates that the vp digital power supply has been lowered in Suspend mode. This signal must be deasserted before the digital power supply is lowered.

  • 1 = Normal operating mode.
  • 0 = The analog blocks are powered down.
20-19 PHY_REFCLKSEL Reference Clock Select for PLL Block.

Selects reference clock source for the HS PLL block.

  • 11 = HS PLL uses EXTREFCLK as reference.
  • 10 = HS PLL uses either ref_pad_clk_{p,m} or ref_alt_clk_{p,m} as reference.
  • x0 = Reserved.
18 PHY_COMMONONN Common Block Power-Down Control.

Controls the power-down signals in the HS Bias and PLL blocks when the USB3.0 PHY is in Suspend or Sleep mode.

  • 1 = In Suspend or Sleep mode, the HS Bias and PLL blocks are powered down.
  • 0 = In Suspend or Sleep mode, the HS Bias and PLL blocks remain powered and continue to draw current.
17 Reserved Reserved
16 PHY_OTG_VBUSVLDEXTSEL External VBUS Valid Select.

Selects the VBUSVLDEXT input or the internal Session Valid comparator to indicate when the VBUS signal on the USB cable is valid.

  • 1 = VBUSVLDEXT input is used.
  • 0 = Internal Session Valid comparator is used.
15 PHY_OTG_OTGDISABLE OTG Block Disable.

Powers down the OTG block, which disables the VBUS Valid and Session End comparators. The Session Valid comparator (the output of which is used to enable the pull-up resistor on DP in Device mode) is always on irrespective of the state of otgdisable. If the application does not use the OTG function, setting this signal to high to save power.

  • 1 = OTG block is powered down.
  • 0 = OTG block is powered up.
14-12 PHY_PC_TX_VBOOST_LVL Tx Voltage Boost Level.

Sets the boosted transmit launch amplitude (mVppd).

The default setting is intended to set the launch amplitude to approximately 1,008mVppd.

  • +1 = results in a +156 mVppd change in the Tx launch amplitude.
  • –1 = results in a –156 mVppd change in the Tx launch amplitude.
11-7 PHY_PC_LANE0_TX_TERM_
OFFSET		 Transmitter Termination Offset.

Enables adjusting the transmitter termination value from the default value of 60 Ω.

6-0 Reserved Reserved
Figure 10-43 USB_PHY_CTL5 Register
31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 16
Reserved PHY_REF_CLKDIV2 PHY_MPLL_MULTIPLIER[6:0]
R-0 R/W-0 R/W +0011001
15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
PHY_MPLL_MULTIPLIER[6:0] PHY_SSC_REF_CLK_SEL Rsvd PHY_SSC_RANGE
R/W +0011001 R/W-000000000 R-0 R/W-000
Legend: R = Read only; R/W = Read/Write, -n = value after reset

Table 10-62 USB_PHY_CTL5 Register Field Descriptions

Bit Field Description
31-21 Reserved Reserved
20 PHY_REF_CLKDIV2 Input Reference Clock Divider Control.

If the input reference clock frequency is greater than 100 MHz, this signal must be asserted. The reference clock frequency is then divided by 2 to keep it in the range required by the MPLL.

When this input is asserted, the ref_ana_usb2_clk (if used) frequency will be the reference clock frequency divided by 4.

19-13 PHY_MPLL_MULTIPLIER[6:0] MPLL Frequency Multiplier Control.

Multiplies the reference clock to a frequency suitable for intended operating speed.

12-4 PHY_SSC_REF_CLK_SEL Spread Spectrum Reference Clock Shifting.

Enables nonstandard oscillator frequencies to generate targeted MPLL output rates. Input corresponds to frequency-synthesis coefficient.

  • . ssc_ref_clk_sel[8:6] = modulous – 1
  • . ssc_ref_clk_sel[5:0] = 2's complement push amount.
3 Reserved Reserved
2-0 PHY_SSC_RANGE Spread Spectrum Clock Range.

Selects the range of spread spectrum modulation when ssc_en is asserted and the PHY is spreading the high-speed transmit clocks. Applies a fixed offset to the phase accumulator.