SNOSBI1C November   2009  – June 2015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Operating Ratings
    6. 6.6 Electrical Characteristics
    7. 6.7 AC Electrical Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Tri-State Test Circuits and Waveforms
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Understanding ADC Error Specs
      2. 8.3.2 Digital Control Inputs
    4. 8.4 Device Functional Modes
      1. 8.4.1 Analog Input Modes
        1. 8.4.1.1 Normal Mode
        2. 8.4.1.2 Fault Mode
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Testing the ADC Converter
      2. 9.1.2 Microprocessor Interfacing
        1. 9.1.2.1 Interfacing 8080 Microprocessor Derivatives (8048, 8085)
        2. 9.1.2.2 Sample 8080A CPU Interfacing Circuitry and Program
        3. 9.1.2.3 INS8048 Interface
        4. 9.1.2.4 Interfacing the Z-80
        5. 9.1.2.5 Interfacing 6800 Microprocessor Derivatives (6502, etc.)
    2. 9.2 Typical Applications
      1. 9.2.1 8080 Interface
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Analog Differential Voltage Inputs and Common-Mode Rejection
          2. 9.2.1.2.2 Analog Inputs — Input Current
            1. 9.2.1.2.2.1 Input Bypass Capacitors
            2. 9.2.1.2.2.2 Input Source Resistance
            3. 9.2.1.2.2.3 Noise
          3. 9.2.1.2.3 Reference Voltage
            1. 9.2.1.2.3.1 Span Adjust
            2. 9.2.1.2.3.2 Reference Accuracy Requirements
          4. 9.2.1.2.4 Errors and Reference Voltage Adjustments
            1. 9.2.1.2.4.1 Zero Error
            2. 9.2.1.2.4.2 Full-Scale
            3. 9.2.1.2.4.3 Adjusting for an Arbitrary Analog Input Voltage Range
          5. 9.2.1.2.5 Clocking Option
          6. 9.2.1.2.6 Restart During a Conversion
          7. 9.2.1.2.7 Continuous Conversions
          8. 9.2.1.2.8 Driving the Data Bus
          9. 9.2.1.2.9 Wiring and Hook-Up Precautions
      2. 9.2.2 Multiple ADC0801 Series to MC6800 CPU Interface
      3. 9.2.3 Auto-Zeroed Differential Transducer Amplifier and ADC Converter
      4. 9.2.4 Multiple ADC Converters in a Z-80 Interrupt Driven Mode
    3. 9.3 System Examples
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
  12. 12Device and Documentation Support
    1. 12.1 Related Links
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(3)
MIN MAX UNIT
Supply voltage (VCC)(2) 6.5 V
Voltage Logic control inputs –0.3 18 V
At other input and outputs –0.3 (VCC +0.3)
Lead Temperature (Soldering, 10 seconds) Dual-In-Line Package (plastic 260 °C
Dual-In-Line Package (ceramic) 300
Surface Mount Package Vapor Phase (60 seconds) 215
Infrared (15 seconds) 220
Storage Temperature –65 150
Package Dissipation at TA = 25°C 875 mW
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) A Zener diode exists, internally, from VCC to GND and has a typical breakdown voltage of 7 VDC.
(3) If Military/Aerospace specified devices are required, contact the Sales Office/Distributors for availability and specifications.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±800 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC 4.5 5 5.5 V
Analog Input Voltage GND – 0.05 VCC + 0.05 VDC

6.4 Thermal Information

THERMAL METRIC(1) ADC080x ADC0802, ADC0804 UNIT
NFH (PDIP) DW (SOIC)
20 PINS 20 PINS
RθJA Junction-to-ambient thermal resistance 38.5 63.8 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 23.4 27.2 °C/W
RθJB Junction-to-board thermal resistance 19.5 31.8 °C/W
ψJT Junction-to-top characterization parameter 8.7 5.7 °C/W
ψJB Junction-to-board characterization parameter 19.4 31.3 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance — — °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Operating Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2).
MIN MAX UNIT
Temperature ADC0804LCJ –40 85 °C
ADC0801/02/03/05LCN –40 85
ADC0804LCN 0 70
ADC0802/04LCWM 0 70
Range of VCC 4.5 6.3 VDC
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its specified operating conditions.
(2) All voltages are measured with respect to GND, unless otherwise specified. The separate A GND point should always be wired to the D GND.

6.6 Electrical Characteristics

The following specifications apply for VCC = 5 VDC, TMIN ≤ TA ≤ TMAX and fCLK = 640 kHz (unless otherwise specified).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ADC0801: Total Adjusted Error(1) With Full-Scale Adj. (See Full-Scale) ±1/4 LSB
ADC0802: Total Unadjusted Error(1) VREF/2=2.500 VDC ±1/2
ADC0803: Total Adjusted Error(1) With Full-Scale Adj. (See Full-Scale) ±1/2
ADC0804: Total Unadjusted Error (1) VREF/2=2.500 VDC ±1
ADC0805: Total Unadjusted Error (1) VREF/2-No Connection ±1
VREF/2 Input Resistance (Pin 9) ADC0801/02/03/05 2.5 8 kΩ
ADC0804 (2) 0.75 1.1
Analog Input Voltage Range V(+) or V(–)(3) GND–0.05 VCC+0.05 VDC
DC Common-Mode Error Over Analog Input Voltage Range ±1/16 ±1/8 LSB
Power Supply Sensitivity VCC=5 VDC ±10% Over Allowed VIN(+) and VIN(–) Voltage Range(3) ±1/16 ±1/8 LSB
(1) None of these ADCs requires a zero adjust (see Zero Error). To obtain zero code at other analog input voltages see Errors and Reference Voltage Adjustments.
(2) The VREF/2 pin is the center point of a two-resistor divider connected from VCC to ground. In all versions of the ADC0801, ADC0802, ADC0803, and ADC0805, and in the ADC0804LCJ, each resistor is typically 16 kΩ. In all versions of the ADC0804 except the ADC0804LCJ, each resistor is typically 2.2 kΩ.
(3) For VIN(−)≥ VIN(+) the digital output code will be 0000 0000. Two on-chip diodes are tied to each analog input (see block diagram) which will forward conduct for analog input voltages one diode drop below ground or one diode drop greater than the VCC supply. Be careful, during testing at low VCC levels (4.5V), as high level analog inputs (5V) can cause this input diode to conduct–especially at elevated temperatures, and cause errors for analog inputs near full-scale. The spec allows 50 mV forward bias of either diode. This means that as long as the analog VIN does not exceed the supply voltage by more than 50 mV, the output code will be correct. To achieve an absolute 0 VDC to 5 VDC input voltage range will therefore require a minimum supply voltage of 4.950 VDC over temperature variations, initial tolerance and loading.

6.7 AC Electrical Characteristics

The following specifications apply for VCC=5 VDC and TMIN≤ TA≤TMAX (unless otherwise specified)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
TC Conversion Time fCLK = 640 kHz(1) 103 114 µs
See (2)(1) 66 73 1/fCLK
fCLK Clock Frequency VCC = 5V(2) 100 640 1460 kHz
Clock Duty Cycle 40% 60%
CR Conversion Rate in Free-Running Mode INTR tied to WR with CS = 0 VDC,
fCLK = 640 kHz		 8770 9708 conv/s
tW(WR)L Width of WR Input (Start Pulse Width) CS = 0 VDC (3) 100 ns
tACC Access Time (Delay from Falling Edge of RD to Output Data Valid) CL = 100 pF 135 200
t1H, t0H Tri-State Control (Delay from Rising Edge of RD to Hi-Z State) CL = 10 pF, RL = 10k (See Tri-State Test Circuits and Waveforms) 125 200
tWI, tRI Delay from Falling Edge of WR or RD to Reset of INTR 300 450
CIN Input Capacitance of Logic Control Inputs 5 7.5 pF
COUT Tri-State Output Capacitance (Data Buffers) 5 7.5
CONTROL INPUTS [Note: CLK IN (Pin 4) is the input of a Schmitt trigger circuit and is therefore specified separately]
VIN (1) Logical “1” Input Voltage (Except Pin 4 CLK IN) VCC = 5.25 VDC 2 15 VDC
VIN (0) Logical “0” Input Voltage (Except Pin 4 CLK IN) VCC = 4.75 VDC 0.8
IIN (1) Logical “1” Input Current (All Inputs) VIN = 5 VDC 0.005 1 µADC
IIN (0) Logical “0” Input Current (All Inputs) VIN = 0 VDC –1 –0.005
CLOCK IN AND CLOCK R
VT+ CLK IN (Pin 4) Positive Going Threshold Voltage 2.7 3.1 3.5 VDC
VT− CLK IN (Pin 4) Negative Going Threshold Voltage 1.5 1.8 2.1
VH CLK IN (Pin 4) Hysteresis (VT+)–(VT−) 0.6 1.3 2
VOUT (0) Logical “0” CLK R Output Voltage IO = 360 µA, VCC = 4.75 VDC 0.4
VOUT (1) Logical “1” CLK R Output Voltage IO = −360 µA, VCC = 4.75 VDC 2.4
DATA OUTPUTS AND INTR
VOUT (0) Logical “0” Output Voltage Data Outputs IOUT = 1.6 mA, VCC = 4.75 VDC 0.4 VDC
INTR Output IOUT = 1.0 mA, VCC = 4.75 VDC 0.4
VOUT (1) Logical “1” Output Voltage IO = −360 µA, VCC = 4.75 VDC 2.4
IO = −10 µA, VCC = 4.75 VDC 4.5
IOUT Tri-State Disabled Output Leakage (All Data Buffers) VOUT = 0 VDC –3 µADC
VOUT = 5 VDC 3
ISOURCE VOUT Short to GND, TA = 2 5°C 4.5 6 mADC
ISINK VOUT Short to VCC, TA = 25°C 9 16
POWER SUPPLY
ICC Supply Current (Includes Ladder Current) ADC0801/02/03/04LCJ/05 fCLK = 640 kHz, VREF/2 = NC,
TA = 25°C and CS = 5 V		 1.1 1.8 mA
ADC0804LCN/LCWM 1.9 2.5
(1) Accuracy is specified at fCLK = 640 kHz. At higher clock frequencies accuracy can degrade. For lower clock frequencies, the duty cycle limits can be extended so long as the minimum clock high time interval or minimum clock low time interval is no less than 275 ns.
(2) With an asynchronous start pulse, up to 8 clock periods may be required before the internal clock phases are proper to start the conversion process. The start request is internally latched. Refer to Detailed Description.
(3) The CS input is assumed to bracket the WR strobe input and therefore timing is dependent on the WR pulse width. An arbitrarily wide pulse width will hold the converter in a reset mode and the start of conversion is initiated by the low to high transition of the WR pulse.
ADC0801 ADC0802 ADC0803 ADC0804 ADC0805 00567151.gifFigure 1. Start Conversion
ADC0801 ADC0802 ADC0803 ADC0804 ADC0805 00567152.gif

NOTE:

Read strobe must occur 8 clock periods (8/fCLK) after assertion of interrupt to specify reset of INTR.
Figure 2. Output Enable and Reset With INTR

6.8 Typical Characteristics

ADC0801 ADC0802 ADC0803 ADC0804 ADC0805 00567138.gif
Figure 3. Logic Input Threshold Voltage vs Supply Voltage
ADC0801 ADC0802 ADC0803 ADC0804 ADC0805 00567140.gif
Figure 5. CLK IN Schmitt Trip Levels vs Supply Voltage
ADC0801 ADC0802 ADC0803 ADC0804 ADC0805 00567142.gif
Figure 7. Full-Scale Error vs Conversion Time
ADC0801 ADC0802 ADC0803 ADC0804 ADC0805 00567144.gif
Figure 9. Output Current vs Temperature
ADC0801 ADC0802 ADC0803 ADC0804 ADC0805 00567146.gif
Figure 11. Linearity Error at Low VREF/2 Voltages
ADC0801 ADC0802 ADC0803 ADC0804 ADC0805 00567139.gif
Figure 4. Delay From Falling Edge of RD to Output Data Valid vs Load Capacitance
ADC0801 ADC0802 ADC0803 ADC0804 ADC0805 00567141.gif
Figure 6. fCLK vs Clock Capacitor
ADC0801 ADC0802 ADC0803 ADC0804 ADC0805 00567143.gif
Figure 8. Effect of Unadjusted Offset Error vs VREF/2 Voltage
ADC0801 ADC0802 ADC0803 ADC0804 ADC0805 00567145.gif
Figure 10. Power Supply Current vs Temperature(2)