SBASA53A July 2021 – October 2024 ADC09DJ800-Q1 , ADC09QJ800-Q1 , ADC09SJ800-Q1
PRODUCTION DATA
THERMAL METRIC(1) | ADC09xJ800-Q1 | UNIT | |
---|---|---|---|
AAV (FCBGA) | |||
144 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 20.9 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 1.0 | °C/W |
RθJB | Junction-to-board thermal resistance | 6.54 | °C/W |
ψJT | Junction-to-top characterization parameter | 0.21 | °C/W |
ψJB | Junction-to-board characterization parameter | 6.52 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance (n/a) | n/a | °C/W |