SBASAG1A October   2021  – October 2024 ADC09DJ800 , ADC09QJ800 , ADC09SJ800

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: DC Specifications
    6. 5.6  Electrical Characteristics: Power Consumption
    7. 5.7  Electrical Characteristics: AC Specifications
    8. 5.8  Timing Requirements
    9. 5.9  Switching Characteristics
    10. 5.10 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Device Comparison
      2. 6.3.2 Analog Input
        1. 6.3.2.1 Analog Input Protection
        2. 6.3.2.2 Full-Scale Voltage (VFS) Adjustment
        3. 6.3.2.3 Analog Input Offset Adjust
        4. 6.3.2.4 ADC Core
          1. 6.3.2.4.1 ADC Theory of Operation
          2. 6.3.2.4.2 ADC Core Calibration
          3. 6.3.2.4.3 Analog Reference Voltage
          4. 6.3.2.4.4 ADC Over-range Detection
          5. 6.3.2.4.5 Code Error Rate (CER)
      3. 6.3.3 Temperature Monitoring Diode
      4. 6.3.4 Timestamp
      5. 6.3.5 Clocking
        1. 6.3.5.1 Converter PLL (C-PLL) for Sampling Clock Generation
        2. 6.3.5.2 LVDS Clock Outputs (PLLREFO±, TRIGOUT±)
        3. 6.3.5.3 Optional CMOS Clock Outputs (ORC, ORD)
        4. 6.3.5.4 SYSREF for JESD204C Subclass-1 Deterministic Latency
          1. 6.3.5.4.1 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          2. 6.3.5.4.2 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
      6. 6.3.6 JESD204C Interface
        1. 6.3.6.1  Transport Layer
        2. 6.3.6.2  Scrambler
        3. 6.3.6.3  Link Layer
        4. 6.3.6.4  8B/10B Link Layer
          1. 6.3.6.4.1 Data Encoding (8B/10B)
          2. 6.3.6.4.2 Multiframes and the Local Multiframe Clock (LMFC)
          3. 6.3.6.4.3 Code Group Synchronization (CGS)
          4. 6.3.6.4.4 Initial Lane Alignment Sequence (ILAS)
          5. 6.3.6.4.5 Frame and Multiframe Monitoring
        5. 6.3.6.5  64B/66B Link Layer
          1. 6.3.6.5.1 64B/66B Encoding
          2. 6.3.6.5.2 Multiblocks, Extended Multiblocks and the Local Extended Multiblock Clock (LEMC)
            1. 6.3.6.5.2.1 Block, Multiblock and Extended Multiblock Alignment using Sync Header
              1. 6.3.6.5.2.1.1 Cyclic Redundancy Check (CRC) Mode
              2. 6.3.6.5.2.1.2 Forward Error Correction (FEC) Mode
          3. 6.3.6.5.3 Initial Lane Alignment
          4. 6.3.6.5.4 Block, Multiblock and Extended Multiblock Alignment Monitoring
        6. 6.3.6.6  Physical Layer
          1. 6.3.6.6.1 SerDes Pre-Emphasis
        7. 6.3.6.7  JESD204C Enable
        8. 6.3.6.8  Multi-Device Synchronization and Deterministic Latency
        9. 6.3.6.9  Operation in Subclass 0 Systems
        10. 6.3.6.10 Alarm Monitoring
          1. 6.3.6.10.1 Clock Upset Detection
          2. 6.3.6.10.2 FIFO Upset Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Low Power Mode and High Performance Mode
      2. 6.4.2 JESD204C Modes
        1. 6.4.2.1 JESD204C Transport Layer Data Formats
        2. 6.4.2.2 64B/66B Sync Header Stream Configuration
        3. 6.4.2.3 Redundant Data Mode (Alternate Lanes)
      3. 6.4.3 Power-Down Modes
      4. 6.4.4 Test Modes
        1. 6.4.4.1 Serializer Test-Mode Details
        2. 6.4.4.2 PRBS Test Modes
        3. 6.4.4.3 Clock Pattern Mode
        4. 6.4.4.4 Ramp Test Mode
        5. 6.4.4.5 Short and Long Transport Test Mode
          1. 6.4.4.5.1 Short Transport Test Pattern
        6. 6.4.4.6 D21.5 Test Mode
        7. 6.4.4.7 K28.5 Test Mode
        8. 6.4.4.8 Repeated ILA Test Mode
        9. 6.4.4.9 Modified RPAT Test Mode
      5. 6.4.5 Calibration Modes and Trimming
        1. 6.4.5.1 Foreground Calibration Mode
        2. 6.4.5.2 Background Calibration Mode
        3. 6.4.5.3 Low-Power Background Calibration (LPBG) Mode
      6. 6.4.6 Offset Calibration
      7. 6.4.7 Trimming
    5. 6.5 Programming
      1. 6.5.1 Using the Serial Interface
      2. 6.5.2 SCS
      3. 6.5.3 SCLK
      4. 6.5.4 SDI
      5. 6.5.5 SDO
      6. 6.5.6 Streaming Mode
      7. 6.5.7 SPI_Register_Map Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Light Detection and Ranging (LiDAR) Digitizer
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Analog Front-End Requirements
          2. 7.2.1.2.2 Calculating Clock and SerDes Frequencies
        3. 7.2.1.3 Application Curves
    3. 7.3 Initialization Set Up
    4. 7.4 Power Supply Recommendations
      1. 7.4.1 Power Sequencing
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4.1 Low Power Mode and High Performance Mode

Device power consumption can be reduced at the tradeoff of performance by programming the device into the Low Power Mode. This mode is recommended to only be used for 1st Nyquist zone applications. The default operating mode is High Performance Mode which is enabled by the default register values. Table 6-13 shows the register writes to switch between the lowest power configuration of Low Power Mode and High Performance Mode. These writes should only be performed when CAL_EN is set to 0 and JESD_EN is set to 0.

Table 6-13 Low Power Mode Register Writes
Register Name (Address)Low Power Mode ValueHigh Performance Mode Value (Default Mode)
LOW_POWER1 (0x037)0x460x4B
LOW_POWER2 (0x29A)0x060x0F
LOW_POWER3 (0x29B)0x000x04
LOW_POWER4 (0x29C)0x140x1B

The magnitude of the glitch during the transition between ADC cores during background calibration and low power background calibration is affected by the setting of the LOW_POWER3 register setting (Address = 0x29B). A lower power can be traded off vs larger glitch magnitude. The ADC output during the transition between ADC cores for low power mode is shown in Figure 6-12 and the power dissipation change vs LOW_POWER3 setting is shown in Figure 6-13. A setting of 4 reduces the glitch to the same magnitude as high performance mode.

ADC09QJ800 ADC09DJ800 ADC09SJ800 Background Calibration Core Transition In Low Power ModeFigure 6-12 Background Calibration Core Transition In Low Power Mode
ADC09QJ800 ADC09DJ800 ADC09SJ800 Power Dissipation Change vs LOW_POWER3 register settingFigure 6-13 Power Dissipation Change vs LOW_POWER3 register setting

In low power background calibration mode, the timing of the ADC transition can be controlled by setting register LP_TRIG = 1. The ADC transition will occur in the ADC output data between 500 and 1000 ADC sample clocks after triggering by the CALTRIG ball or SPI write to CAL_SOFT_TRIG register (Address = 0x6C).

Foreground calibration mode has no ADC core transitions and no glitch.