SNAS483F February   2010  – August 2015 ADC128D818

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 DC Electrical Characteristics
    6. 7.6 AC Electrical Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Supply Voltage (V+)
      2. 8.3.2 Voltage References (VREF)
      3. 8.3.3 Analog Inputs (IN0 - IN7)
        1. 8.3.3.1 Single-Ended Input
        2. 8.3.3.2 Pseudo-Differential Input
    4. 8.4 Device Functional Modes
      1. 8.4.1 Modes of Operation
    5. 8.5 Programming
      1. 8.5.1 Interface
        1. 8.5.1.1 Serial Bus Address
        2. 8.5.1.2 Time-out
          1. 8.5.1.2.1 Example Writes and Reads
    6. 8.6 Register Maps
      1. 8.6.1  ADC128D818 Internal Registers
      2. 8.6.2  Configuration Register — Address 00h
      3. 8.6.3  Interrupt Status Register — Address 01h
      4. 8.6.4  Interrupt Mask Register — Address 03h
      5. 8.6.5  Conversion Rate Register — Address 07h
      6. 8.6.6  Channel Disable Register — Address 08h
      7. 8.6.7  One-Shot Register — Address 09h
      8. 8.6.8  Deep Shutdown Register — Address 0Ah
      9. 8.6.9  Advanced Configuration Register — Address 0Bh
      10. 8.6.10 Busy Status Register — Address 0Ch
      11. 8.6.11 Channel Readings Registers — Addresses 20h - 27h
      12. 8.6.12 Limit Registers — Addresses 2Ah - 39h
      13. 8.6.13 Manufacturer ID Register — Address 3Eh
      14. 8.6.14 Revision ID Register — Addresses 3Fh
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Digital Output (DOUT)
      2. 9.1.2 Temperature Measurement System
        1. 9.1.2.1 Temperature Limits
      3. 9.1.3 Interrupt Structure
        1. 9.1.3.1 Interrupt Output (INT)
        2. 9.1.3.2 Interrupt Clearing
        3. 9.1.3.3 Temperature Interrupt
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Power Management
        2. 9.2.2.2 Using the ADC128D818
          1. 9.2.2.2.1 Quick Start
          2. 9.2.2.2.2 Poweron Reset (POR)
          3. 9.2.2.2.3 Configuration Register (address 00h)
          4. 9.2.2.2.4 Interrupt Status Register (address 01h)
          5. 9.2.2.2.5 Interrupt Mask Register (address 03h)
          6. 9.2.2.2.6 Conversion Rate Register (address 07h)
          7. 9.2.2.2.7 One-Shot Register (address 09h)
          8. 9.2.2.2.8 Deep Shutdown Register (address 0Ah)
          9. 9.2.2.2.9 Channel Readings Registers (addresses 20h - 27h)
      3. 9.2.3 Application Curve
    3. 9.3 System Examples
      1. 9.3.1 General Voltage Monitoring
      2. 9.3.2 Voltage Monitoring for Power Supplies
      3. 9.3.3 Temperature Sensors
      4. 9.3.4 Bridge Sensors
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from E Revision (March 2013) to F Revision

  • Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section Go
  • Removed Product HighlightsGo

Changes from D Revision (January 2011) to E Revision

  • Changed layout of National Data Sheet to TI formatGo