SNAS717A April   2017  – October 2021 ADC12D1620QML-SP

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Converter Electrical Characteristics: Static Converter Characteristics
    6. 6.6  Converter Electrical Characteristics: Dynamic Converter Characteristics
    7. 6.7  Converter Electrical Characteristics: Analog Input/Output and Reference Characteristics
    8. 6.8  Converter Electrical Characteristic: Channel-to-Channel Characteristics
    9. 6.9  Converter Electrical Characteristics: LVDS CLK Input Characteristics
    10. 6.10 Electrical Characteristics: AutoSync Feature
    11. 6.11 Converter Electrical Characteristics: Digital Control and Output Pin Characteristics
    12. 6.12 Converter Electrical Characteristics: Power Supply Characteristics
    13. 6.13 Converter Electrical Characteristics: AC Electrical Characteristics
    14. 6.14 Electrical Characteristics: Delta Parameters
    15. 6.15 Timing Requirements: Serial Port Interface
    16. 6.16 Timing Requirements: Calibration
    17. 6.17 Quality Conformance Inspection
    18. 6.18 Timing Diagrams
    19. 6.19 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Operation Summary
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Input Control and Adjust
        1. 7.3.1.1 AC- and DC-Coupled Modes
        2. 7.3.1.2 Input Full-Scale Range Adjust
        3. 7.3.1.3 Input Offset Adjust
        4. 7.3.1.4 Low-Sampling Power-Saving Mode (LSPSM)
        5. 7.3.1.5 DES Timing Adjust
        6. 7.3.1.6 Sampling Clock Phase Adjust
      2. 7.3.2 Output Control and Adjust
        1. 7.3.2.1 SDR / DDR Clock
        2. 7.3.2.2 LVDS Output Differential Voltage
        3. 7.3.2.3 LVDS Output Common-Mode Voltage
        4. 7.3.2.4 Output Formatting
        5. 7.3.2.5 Test-Pattern Mode
        6. 7.3.2.6 Time Stamp
      3. 7.3.3 Calibration Feature
        1. 7.3.3.1 Calibration Control Pins and Bits
        2. 7.3.3.2 How to Execute a Calibration
        3. 7.3.3.3 On-Command Calibration
        4. 7.3.3.4 Calibration Adjust
          1. 7.3.3.4.1 Read/Write Calibration Settings
        5. 7.3.3.5 Calibration and Power-Down
        6. 7.3.3.6 Calibration and the Digital Outputs
      4. 7.3.4 Power Down
      5. 7.3.5 Low-Sampling Power-Saving Mode (LSPSM)
    4. 7.4 Device Functional Modes
      1. 7.4.1 DES/Non-DES Mode
      2. 7.4.2 Demux/Non-Demux Mode
    5. 7.5 Programming
      1. 7.5.1 Control Modes
        1. 7.5.1.1 Non-ECM
          1. 7.5.1.1.1  Dual-Edge Sampling Pin (DES)
          2. 7.5.1.1.2  Non-Demultiplexed Mode Pin (NDM)
          3. 7.5.1.1.3  Dual Data-Rate Phase Pin (DDRPh)
          4. 7.5.1.1.4  Calibration Pin (CAL)
          5. 7.5.1.1.5  Low-Sampling Power-Saving Mode Pin (LSPSM)
          6. 7.5.1.1.6  Power-Down I-Channel Pin (PDI)
          7. 7.5.1.1.7  Power-Down Q-Channel Pin (PDQ)
          8. 7.5.1.1.8  Test-Pattern Mode Pin (TPM)
          9. 7.5.1.1.9  Full-Scale Input-Range Pin (FSR)
          10. 7.5.1.1.10 AC- or DC-Coupled Mode Pin (VCMO)
          11. 7.5.1.1.11 LVDS Output Common-Mode Pin (VBG)
        2. 7.5.1.2 Extended Control Mode
          1. 7.5.1.2.1 Serial Interface
    6. 7.6 Register Maps
      1. 7.6.1 Register Definitions
  8. 8 Application Information Disclaimer
    1. 8.1 Application Information
      1. 8.1.1 Analog Inputs
        1. 8.1.1.1 Acquiring the Input
        2. 8.1.1.2 Driving the ADC in DES Mode
        3. 8.1.1.3 FSR and the Reference Voltage
        4. 8.1.1.4 Out-Of-Range Indication
        5. 8.1.1.5 AC-Coupled Input Signals
        6. 8.1.1.6 DC-Coupled Input Signals
        7. 8.1.1.7 Single-Ended Input Signals
      2. 8.1.2 Clock Inputs
        1. 8.1.2.1 CLK Coupling
        2. 8.1.2.2 CLK Frequency
        3. 8.1.2.3 CLK Level
        4. 8.1.2.4 CLK Duty Cycle
        5. 8.1.2.5 CLK Jitter
        6. 8.1.2.6 CLK Layout
      3. 8.1.3 LVDS Outputs
        1. 8.1.3.1 Common-Mode and Differential Voltage
        2. 8.1.3.2 Output Data Rate
        3. 8.1.3.3 Terminating Unused LVDS Output Pins
      4. 8.1.4 Synchronizing Multiple ADC12D1620 Devices in a System
        1. 8.1.4.1 AutoSync Feature
        2. 8.1.4.2 DCLK Reset Feature
      5. 8.1.5 Temperature Sensor
    2. 8.2 Radiation Environments
      1. 8.2.1 Total Ionizing Dose
      2. 8.2.2 Single Event Latch-Up and Functional Interrupt
      3. 8.2.3 Single Event Upset
    3. 8.3 Cold Sparing
  9. 9 Power Supply Recommendations
    1. 9.1 System Power-On Considerations
      1. 9.1.1 Control Pins
      2. 9.1.2 Power On in Non-ECM
      3. 9.1.3 Power On in ECM
      4. 9.1.4 Power-on and Data Clock (DCLK)
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Power Planes
      2. 10.1.2 Bypass Capacitors
      3. 10.1.3 Ground Planes
      4. 10.1.4 Power System Example
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
    4. 10.4 Board Mounting Recommendation
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
      2. 11.1.2 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Engineering Samples

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • FVA|256
  • NAA|376
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.7 Converter Electrical Characteristics: Analog Input/Output and Reference Characteristics

The following specifications apply after calibration for VA = VDR = VTC = VE = 1.9 V; I and Q channels AC-coupled, FSR pin = high; CL = 10-pF; differential AC-coupled sine wave input clock, fCLK = 1.6 GHz at 0.5 VP-P with 50% duty cycle; VBG = floating; non-extended control mode; Rext = Rtrim = 3300 Ω ±0.1%; analog signal source impedance = 100-Ω differential; 1:2 demultiplex non-DES mode; I and Q channels; duty-cycle stabilizer on.(1)(2)
PARAMETER TEST CONDITIONS SUB-GROUPS MIN TYP(3) MAX UNIT
VIN_FSR Analog differential input full-scale range FSR pin Y3 Low [4, 5, 6] 630 mVP-P
FSR pin Y3 High [4, 5, 6] 750 820 890 mVP-P
EXTENDED CONTROL MODE
FM(14:0) = 0000h 600 mVP-P
FM(14:0) = 4000h (default) 800 mVP-P
FM(14:0) = 7FFFh 1000 mVP-P
CIN Analog input capacitance,
Non-DES mode (4)(5)		 Differential 0.02 pF
Each input pin to ground 1.6 pF
Analog input capacitance,
DES mode  (4)(5)		 Differential 0.02 pF
Each input pin to ground 2.2 pF
RIN Differential input resistance [1, 2, 3] 99 103 107 Ω
COMMON-MODE OUTPUT
VCMO Common-mode output voltage ICMO = ±100 μA [1, 2, 3] 1.15 1.25 1.35 V
TC_VCMO Common-mode output voltage temperature coefficient ICMO = ±100 μA 38 ppm/°C
VCMO_LVL VCMO input threshold to set DC-coupling mode 0.63 V
CL_VCMO Maximum VCMO load capacitance See(5) 80 pF
BANDGAP REFERENCE
VBG Bandgap reference output voltage IBG = ±100 µA [1, 2, 3] 1.15 1.27 1.35 V
TC_VBG Bandgap reference voltage temperature coefficient IBG = ±100 µA 50 ppm/°C
CLOAD VBG Maximum bandgap reference load capacitance 80 pF
(1) The analog inputs are protected as shown below. Input voltage magnitudes beyond the Absolute Maximum Ratings may damage this device.
GUID-0E180FB8-5707-431A-A0F2-8F15E7197F19-low.gif
(2) To ensure accuracy, it is required that VA, VTC, VE and VDR be well bypassed. Each supply pin must be decoupled with separate bypass capacitors.
(3) Typical figures are at TA = 25°C, and represent most likely parametric norms. Test limits are ensured to Texas Instrument's average outgoing quality level (AOQL).
(4) The analog and clock input capacitances are die capacitances only. Additional package capacitances of 0.22-pF differential and 1.06-pF each pin to ground are isolated from the die capacitances by lead and bond wire inductances.
(5) This parameter is specified by design and/or characterization and is not tested in production.