over operating free-air temperature range (unless otherwise noted)
|
MIN |
NOM |
MAX |
UNIT |
VDD |
Supply voltage range |
VA19, analog 1.9-V supply(2) |
1.8 |
1.9 |
2.0 |
V |
VA11, analog 1.1-V supply(2) |
1.05 |
1.1 |
1.15 |
VD11, digital 1.1-V supply(3) |
1.05 |
1.1 |
1.15 |
VCMI |
Input common-mode voltage |
INA+, INA–, INB+, INB–(2) |
–50 |
0 |
100 |
mV |
CLK+, CLK–, SYSREF+, SYSREF–(2)(4) |
0 |
0.3 |
0.55 |
V |
TMSTP+, TMSTP–(3)(5) |
0 |
0.3 |
0.55 |
VID |
Input voltage, peak-to-peak differential |
CLK+ to CLK–, SYSREF+ to SYSREF–, TMSTP+ to TMSTP– |
0.4 |
1.0 |
2.0 |
VPP-DIFF |
INA+ to INA–, INB+ to INB– |
|
|
0.8(6) |
IC_TD |
Temperature diode input current |
TDIODE+ to TDIODE– |
|
100 |
|
µA |
CL |
BG maximum load capacitance |
|
|
|
50 |
pF |
IO |
BG maximum output current |
|
|
|
100 |
µA |
DC |
Input clock duty cycle |
|
30 |
50 |
70 |
% |
TA |
Operating free-air temperature |
|
-55 |
|
125 |
°C |
TJ |
Operating junction temperature |
|
|
|
150(1) |
°C |
(1) Die is designed for Tj = 150 °C operation and for device and die metallization degradation up to 150,000 POH continuous operation at Tj = 125 °C. Prolonged use above a junction temperature of Tj =105 °C may, however, increase the package failure-in-time (FIT) rate.
(2) Measured to AGND.
(3) Measured to DGND.
(4) TI strongly recommends that CLK± be AC-coupled with DEVCLK_LVPECL_EN set to 0 to allow CLK± to self-bias to the optimal input common-mode voltage for best performance. TI recommends AC-coupling for SYSREF± unless DC-coupling is required, in which case, the LVPECL input mode must be used (SYSREF_LVPECL_EN = 1).
(5) TMSTP± does not have internal biasing that requires TMSTP± to be biased externally whether AC-coupled with TMSTP_LVPECL_EN = 0 or DC-coupled with TMSTP_LVPECL_EN= 1.
(6) The ADC output code saturates when VID for INA± or INB± exceeds the programmed full-scale voltage(VFS) set by FS_RANGE_A for INA± or FS_RANGE_B for INB±.