SBASAJ4B June   2022  – October 2024 ADC12QJ1600-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics: DC Specifications
    6. 5.6  Electrical Characteristics: Power Consumption
    7. 5.7  Electrical Characteristics: AC Specifications
    8. 5.8  Switching Characteristics
    9. 5.9  Timing Requirements
    10. 5.10 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Input
        1. 6.3.1.1 Analog Input Protection
        2. 6.3.1.2 Full-Scale Voltage (VFS) Adjustment
        3. 6.3.1.3 Analog Input Offset Adjust
        4. 6.3.1.4 ADC Core
          1. 6.3.1.4.1 ADC Theory of Operation
          2. 6.3.1.4.2 ADC Core Calibration
          3. 6.3.1.4.3 Analog Reference Voltage
          4. 6.3.1.4.4 ADC Over-range Detection
          5. 6.3.1.4.5 Code Error Rate (CER)
      2. 6.3.2 Temperature Monitoring Diode
      3. 6.3.3 Timestamp
      4. 6.3.4 Clocking
        1. 6.3.4.1 Converter PLL (C-PLL) for Sampling Clock Generation
        2. 6.3.4.2 LVDS Clock Outputs (PLLREFO±, TRIGOUT±)
        3. 6.3.4.3 Optional CMOS Clock Outputs (ORC, ORD)
        4. 6.3.4.4 SYSREF for JESD204C Subclass-1 Deterministic Latency
          1. 6.3.4.4.1 SYSREF Capture for Multi-Device Synchronization and Deterministic Latency
          2. 6.3.4.4.2 SYSREF Position Detector and Sampling Position Selection (SYSREF Windowing)
      5. 6.3.5 JESD204C Interface
        1. 6.3.5.1  Transport Layer
        2. 6.3.5.2  Scrambler
        3. 6.3.5.3  Link Layer
        4. 6.3.5.4  8B or 10B Link Layer
          1. 6.3.5.4.1 Data Encoding (8B or 10B)
          2. 6.3.5.4.2 Multiiframes and the Local Multiframe Clock (LMFC)
          3. 6.3.5.4.3 Code Group Synchronization (CGS)
          4. 6.3.5.4.4 Initial Lane Alignment Sequence (ILAS)
          5. 6.3.5.4.5 Frame and Multiframe Monitoring
        5. 6.3.5.5  64B or 66B Link Layer
          1. 6.3.5.5.1 64B or 66B Encoding
          2. 6.3.5.5.2 Multiblocks, Extended Multiblocks and the Local Extended Multiblock Clock (LEMC)
            1. 6.3.5.5.2.1 Block, Multiblock and Extended Multiblock Alignment using Sync Header
              1. 6.3.5.5.2.1.1 Cyclic Redundancy Check (CRC) Mode
              2. 6.3.5.5.2.1.2 Forward Error Correction (FEC) Mode
          3. 6.3.5.5.3 Initial Lane Alignment
          4. 6.3.5.5.4 Block, Multiblock and Extended Multiblock Alignment Monitoring
        6. 6.3.5.6  Physical Layer
          1. 6.3.5.6.1 SerDes Pre-Emphasis
        7. 6.3.5.7  JESD204C Enable
        8. 6.3.5.8  Multi-Device Synchronization and Deterministic Latency
        9. 6.3.5.9  Operation in Subclass 0 Systems
        10. 6.3.5.10 Alarm Monitoring
          1. 6.3.5.10.1 Clock Upset Detection
          2. 6.3.5.10.2 FIFO Upset Detection
    4. 6.4 Device Functional Modes
      1. 6.4.1 Low Power Mode and High Performance Mode
      2. 6.4.2 JESD204C Modes
        1. 6.4.2.1 JESD204C Transport Layer Data Formats
        2. 6.4.2.2 64B or 66B Sync Header Stream Configuration
        3. 6.4.2.3 Redundant Data Mode (Alternate Lanes)
      3. 6.4.3 Power-Down Modes
      4. 6.4.4 Test Modes
        1. 6.4.4.1 Serializer Test-Mode Details
        2. 6.4.4.2 PRBS Test Modes
        3. 6.4.4.3 Clock Pattern Mode
        4. 6.4.4.4 Ramp Test Mode
        5. 6.4.4.5 Short and Long Transport Test Mode
          1. 6.4.4.5.1 Short Transport Test Pattern
        6. 6.4.4.6 D21.5 Test Mode
        7. 6.4.4.7 K28.5 Test Mode
        8. 6.4.4.8 Repeated ILA Test Mode
        9. 6.4.4.9 Modified RPAT Test Mode
      5. 6.4.5 Calibration Modes and Trimming
        1. 6.4.5.1 Foreground Calibration Mode
        2. 6.4.5.2 Background Calibration Mode
        3. 6.4.5.3 Low-Power Background Calibration (LPBG) Mode
      6. 6.4.6 Offset Calibration
      7. 6.4.7 Trimming
    5. 6.5 Programming
      1. 6.5.1 Using the Serial Interface
      2. 6.5.2 SCS
      3. 6.5.3 SCLK
      4. 6.5.4 SDI
      5. 6.5.5 SDO
      6. 6.5.6 Streaming Mode
      7. 6.5.7 SPI_Register_Map Registers
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Light Detection and Ranging (LiDAR) Digitizer
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Analog Front-End Requirements
          2. 7.2.1.2.2 Calculating Clock and SerDes Frequencies
        3. 7.2.1.3 Application Curves
    3. 7.3 Initialization Set Up
    4. 7.4 Power Supply Recommendations
      1. 7.4.1 Power Sequencing
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Supply voltage range VA19, analog 1.9-V supply(2) 1.8 1.9 2.0 V
VPLL19, PLL supply(3) 1.8 1.9 2.0
VREFO, PLLREFO± and PLL charge pump supply(2) 1.8 1.9 2.0
VTRIG, TRIGOUT± supply(4) 1.05 1.1 or 1.9 2.0
VA11, analog 1.1-V supply(2) 1.05 1.1 1.15
VD11, digital 1.1-V supply(4) 1.05 1.1 1.15
VCMI Input common-mode voltage INA+, INA–, INB+, INB–, INC+, INC–, IND+, IND–(2) 1.05 1.1 1.15 V
CLK+, CLK–, SYSREF+, SYSREF–(2)(5) 0 0.3 0.55
TMSTP+, TMSTP–(4)(6) 0 0.3 0.55
VID(DIFF) Input voltage, peak-to-peak differential CLK+ to CLK–, SYSREF+ to SYSREF–, TMSTP+ to TMSTP– 0.4 1.0 2.0 VPP-DIFF
INA+, INA–, INB+, INB–, INC+, INC–, IND+, IND– 1.0(7)
VIH High-level input voltage SE_CLK 0.9 1.8 V
VIL Low-level input voltage SE_CLK 0 0.3 V
IC_TD Temperature diode input current TDIODE+ to TDIODE– 100 µA
CL BG maximum load capacitance 50 pF
IO BG maximum output current Current at -2% drop from nominal voltage 140 µA
TA Operating free-air temperature –55 125(1) °C
Tj Operating junction temperature 150(1) °C
(1) Die is designed for Tj = 150 °C operation and for device and  die metallization degradation up to 150,000 POH continuous operation at Tj = 125 °C. Prolonged use above a junction temperature of Tj =105 °C may, however, increase the package failure-in-time (FIT) rate.
(2) Measured to AGND.
(3) Measured to PGND.
(4) Measured to DGND.
(5) TI strongly recommends that CLK± be AC-coupled with DEVCLK_LVPECL_EN set to 0 to allow CLK± to self-bias to the optimal input common-mode voltage for best performance. TI recommends AC-coupling for SYSREF± unless DC-coupling is required, in which case, the LVPECL input mode must be used (SYSREF_LVPECL_EN = 1).
(6) TMSTP± does not have internal biasing that requires TMSTP± to be biased externally whether AC-coupled with TMSTP_LVPECL_EN = 0 or DC-coupled with TMSTP_LVPECL_EN= 1.
(7) The ADC output code saturates when VID for INA± or INB± exceeds the programmed full-scale voltage(VFS) set by FS_RANGE_A for INA± or FS_RANGE_B for INB±.