SNAS378L November   2008  – February 2019 ADC14155QML-SP

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Block Diagram
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions and Equivalent Circuits
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  ADC14155 Converter Electrical Characteristics DC Parameters
    6. 6.6  ADC14155 Converter Electrical Characteristics (Continued) DYNAMIC Parameters
    7. 6.7  ADC14155 Converter Electrical Characteristics (Continued) Logic and Power Supply Electrical Characteristics
    8. 6.8  ADC14155 Converter Electrical Characteristics (Continued) Timing and AC Characteristics
    9. 6.9  Timing Diagram
    10. 6.10 Transfer Characteristic
    11. 6.11 Typical Performance Characteristics, DNL, INL
    12. 6.12 Typical Performance Characteristics, Dynamic Performance
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
        1. 7.3.1.1 Differential Analog Input Pins
        2. 7.3.1.2 Driving The Analog Inputs
        3. 7.3.1.3 Input Common Mode Voltage
      2. 7.3.2 Reference Pins
      3. 7.3.3 Digital Inputs
        1. 7.3.3.1 Clock Inputs
        2. 7.3.3.2 Power-Down (PD)
        3. 7.3.3.3 Clock Mode Select/Data Format (CLK_SEL/DF)
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Radiation Environments
      1. 8.3.1 Total Ionizing Dose (TID)
      2. 8.3.2 Single Event Effects
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Device Nomenclature
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • NBA|48
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC ADC14155QML UNIT
NBA (CFP)
48 PINS
RθJA Junction-to-ambient thermal resistance 27.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 11.7 °C/W
RθJB Junction-to-board thermal resistance 11.4 °C/W
ψJT Junction-to-top characterization parameter 4.6 °C/W
ψJB Junction-to-board characterization parameter 11.1 °C/W
RθJC(bottom)(1) Junction-to-case (bottom) thermal resistance 3.0 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.