SBAS500B june   2022  – august 2023 ADC32RF54 , ADC32RF55

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Power Consumption
    6. 6.6  Electrical Characteristics - DC Specifications
    7. 6.7  Electrical Characteristics - ADC32RF54 AC Specifications (Dither DISABLED)
    8. 6.8  Electrical Characteristics - ADC32RF54 AC Specifications (Dither ENABLED)
    9. 6.9  Electrical Characteristics - ADC32RF55 AC Specifications (Dither DISABLED)
    10. 6.10 Electrical Characteristics - ADC32RF55 AC Specifications (Dither ENABLED)
    11. 6.11 Timing Requirements
    12. 6.12 Typical Characteristics - ADC32RF54
    13. 6.13 Typical Characteristics - ADC32RF55
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
        1. 7.3.1.1 Input Bandwidth and Full-Scale
        2. 7.3.1.2 Input Imbalance
        3. 7.3.1.3 Overrange Indication
        4. 7.3.1.4 Analog out-of-band dither
      2. 7.3.2 Sampling Clock Input
      3. 7.3.3 SYSREF
        1. 7.3.3.1 SYSREF Capture Detection
      4. 7.3.4 ADC Foreground Calibration
        1. 7.3.4.1 Calibration Control
        2. 7.3.4.2 ADC Switch
        3. 7.3.4.3 Calibration Configuration
      5. 7.3.5 Decimation Filter
        1. 7.3.5.1 Decimation Filter Response
        2. 7.3.5.2 Decimation Filter Configuration
        3. 7.3.5.3 20-bit Output Mode
        4. 7.3.5.4 Dynamic Switching
          1. 7.3.5.4.1 2 Lane Mode
          2. 7.3.5.4.2 1 Lane Mode
        5. 7.3.5.5 Numerically Controlled Oscillator (NCO)
        6. 7.3.5.6 NCO Frequency Programming
        7. 7.3.5.7 Fast Frequency Hopping
          1. 7.3.5.7.1 Fast frequency hopping Using the GPIO1/2 pins
          2. 7.3.5.7.2 Fast frequency hopping using GPIO1/2, SEN and SDIO pins
          3. 7.3.5.7.3 Fast Frequency Hopping Using the Fast SPI
      6. 7.3.6 JESD204B Interface
        1. 7.3.6.1 JESD204B Initial Lane Alignment (ILA)
          1. 7.3.6.1.1 SYNC Signal
        2. 7.3.6.2 JESD204B Frame Assembly
        3. 7.3.6.3 JESD204B Frame Assembly in Bypass Mode
        4. 7.3.6.4 JESD204B Frame Assembly with Complex Decimation - Single Band
        5. 7.3.6.5 JESD204B Frame Assembly with Real Decimation - Single Band
        6. 7.3.6.6 JESD204B Frame Assembly with Complex Decimation - Dual Band
        7. 7.3.6.7 JESD204B Frame Assembly with Complex Decimation - Quad Band
      7. 7.3.7 SERDES Output MUX
      8. 7.3.8 Test Pattern
        1. 7.3.8.1 Transport Layer
        2. 7.3.8.2 Link Layer
        3. 7.3.8.3 Internal Capture Memory Buffer
    4. 7.4 Device Functional Modes
      1. 7.4.1 Digital Averaging
    5. 7.5 Programming
      1. 7.5.1 GPIO Pin Control
      2. 7.5.2 Configuration Using the SPI Interface
        1. 7.5.2.1 Register Write
        2. 7.5.2.2 Register Read
    6. 7.6 Register Maps
      1. 7.6.1 Detailed Register Description
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Wideband RF Sampling Receiver
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input Signal Path
          2. 8.2.1.1.2 Clocking
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Sampling Clock
        3. 8.2.1.3 Application Curves
    3. 8.3 Initialization Set Up
      1. 8.3.1 Initial Device Configuration After Power-Up
        1. 8.3.1.1  STEP 1: RESET
        2. 8.3.1.2  STEP 2: Device Configuration
        3. 8.3.1.3  STEP 3: JESD Interface Configuration (1)
        4. 8.3.1.4  STEP 4: SYSREF Synchronization
        5. 8.3.1.5  STEP 5: JESD Interface Configuration (2)
        6. 8.3.1.6  STEP 6: Analog Trim Settings
        7. 8.3.1.7  STEP 7: Calibration Configuration
        8. 8.3.1.8  STEP 8: SYSREF Synchronization
        9. 8.3.1.9  STEP 9: Run Power up Calibration
        10. 8.3.1.10 STEP 10: JESD Interface Synchronization
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Electrical Characteristics - DC Specifications

Maximum and minimum values are specified over the operating free-air temperature range and nominal supply voltages. Typical values are specified at TA = 25°C, ADC sampling rate = 3.0 GSPS, Bypass mode, 50% clock duty cycle, AVDD18 = 1.8 V, AVDD12, AVDDCLK, DVDD = 1.2 V and –1-dBFS differential input, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC ACCURACY
DNL Differential nonlinearity FIN = 10 MHz ±0.85 LSB
INL Integral nonlinearity FIN = 10 MHz ±3.5 LSB
VOS_ERR Offset error ±2 %FSR
GAINERR Gain error ±3 %FSR
GAINMatch Gain matching across channels ±0.2 dB
ADC ANALOG INPUTS (INA1P/M, INB1P/M, INA2P/M, INB2P/M)
FS Input full scale Differential, non-average mode 1.1 Vpp
Input full scale Differential, 2x or 4x average mode 1.35
VICM Input common model voltage 250 350 450 mV
ZIN Differential input impedance Differential at 100 MHz 100 Ω
VOCM Output common mode voltage 350 mV
BW Analog Input Bandwidth (-3 dB) 1x, 2x AVG, RSW=1 2.75 GHz
4x AVG, RSW=1 2.1
Phase imbalance, analog input ±2 deg
Amplitude imablance, analog input ±0.5 dB
CMRR Common mode rejection ratio FIN = 100 MHz 25 dB
CLOCK INPUT (CLKP/M)
Input clock frequency ADC32RF54 500 2600 MHz
ADC32RF55 500 3000 MHz
VID Differential input voltage 1 2.4 Vpp
VICM Input common mode voltage 0.65 0.75 0.85 V
ZIN Differential input impedance Differential at 2.6 GHz 100 Ω
Clock duty cycle 45 50 55 %
SYSREF INPUT (SYSREFP/M)
VID Differential input voltage 600 800 1000 mVpp
VICM Input common mode voltage Input common mode voltage 1.05 1.2 1.4 V
ZIN Differential input impedance 100 Ω
DIGITAL INPUTS (RESET, PDN, SCLK, SEN, SDIO, GPIO1/2, SPISEL)
VIH High-level input voltage 0.8 V
VIL Low-level input voltage 0.4 V
CI Input capacitance 0.6 pF
DIGITAL OUTPUT (SDIO)
VOH High-level output voltage ILOAD = -400 uA AVDD18 – 0.1 AVDD18 V
VOL Low-level output voltage ILOAD = 400 uA 0.1 V
CML SERDES OUTPUTS: DOUT[0:7]P/M
VOD Serdes transmitter output amplitude differential peak-peak 700 mVpp
VOCM Serdes transmitter output common mode 425 mV
ZTX Serdes transmitter single ended termination impedance 50 Ω
Transmitter short-circuit current Transmitter pins shorted to any voltage between –0.25 V and 1.45 V –100 100 mA