SBAS500B june   2022  – august 2023 ADC32RF54 , ADC32RF55

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Power Consumption
    6. 6.6  Electrical Characteristics - DC Specifications
    7. 6.7  Electrical Characteristics - ADC32RF54 AC Specifications (Dither DISABLED)
    8. 6.8  Electrical Characteristics - ADC32RF54 AC Specifications (Dither ENABLED)
    9. 6.9  Electrical Characteristics - ADC32RF55 AC Specifications (Dither DISABLED)
    10. 6.10 Electrical Characteristics - ADC32RF55 AC Specifications (Dither ENABLED)
    11. 6.11 Timing Requirements
    12. 6.12 Typical Characteristics - ADC32RF54
    13. 6.13 Typical Characteristics - ADC32RF55
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Inputs
        1. 7.3.1.1 Input Bandwidth and Full-Scale
        2. 7.3.1.2 Input Imbalance
        3. 7.3.1.3 Overrange Indication
        4. 7.3.1.4 Analog out-of-band dither
      2. 7.3.2 Sampling Clock Input
      3. 7.3.3 SYSREF
        1. 7.3.3.1 SYSREF Capture Detection
      4. 7.3.4 ADC Foreground Calibration
        1. 7.3.4.1 Calibration Control
        2. 7.3.4.2 ADC Switch
        3. 7.3.4.3 Calibration Configuration
      5. 7.3.5 Decimation Filter
        1. 7.3.5.1 Decimation Filter Response
        2. 7.3.5.2 Decimation Filter Configuration
        3. 7.3.5.3 20-bit Output Mode
        4. 7.3.5.4 Dynamic Switching
          1. 7.3.5.4.1 2 Lane Mode
          2. 7.3.5.4.2 1 Lane Mode
        5. 7.3.5.5 Numerically Controlled Oscillator (NCO)
        6. 7.3.5.6 NCO Frequency Programming
        7. 7.3.5.7 Fast Frequency Hopping
          1. 7.3.5.7.1 Fast frequency hopping Using the GPIO1/2 pins
          2. 7.3.5.7.2 Fast frequency hopping using GPIO1/2, SEN and SDIO pins
          3. 7.3.5.7.3 Fast Frequency Hopping Using the Fast SPI
      6. 7.3.6 JESD204B Interface
        1. 7.3.6.1 JESD204B Initial Lane Alignment (ILA)
          1. 7.3.6.1.1 SYNC Signal
        2. 7.3.6.2 JESD204B Frame Assembly
        3. 7.3.6.3 JESD204B Frame Assembly in Bypass Mode
        4. 7.3.6.4 JESD204B Frame Assembly with Complex Decimation - Single Band
        5. 7.3.6.5 JESD204B Frame Assembly with Real Decimation - Single Band
        6. 7.3.6.6 JESD204B Frame Assembly with Complex Decimation - Dual Band
        7. 7.3.6.7 JESD204B Frame Assembly with Complex Decimation - Quad Band
      7. 7.3.7 SERDES Output MUX
      8. 7.3.8 Test Pattern
        1. 7.3.8.1 Transport Layer
        2. 7.3.8.2 Link Layer
        3. 7.3.8.3 Internal Capture Memory Buffer
    4. 7.4 Device Functional Modes
      1. 7.4.1 Digital Averaging
    5. 7.5 Programming
      1. 7.5.1 GPIO Pin Control
      2. 7.5.2 Configuration Using the SPI Interface
        1. 7.5.2.1 Register Write
        2. 7.5.2.2 Register Read
    6. 7.6 Register Maps
      1. 7.6.1 Detailed Register Description
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Wideband RF Sampling Receiver
        1. 8.2.1.1 Design Requirements
          1. 8.2.1.1.1 Input Signal Path
          2. 8.2.1.1.2 Clocking
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Sampling Clock
        3. 8.2.1.3 Application Curves
    3. 8.3 Initialization Set Up
      1. 8.3.1 Initial Device Configuration After Power-Up
        1. 8.3.1.1  STEP 1: RESET
        2. 8.3.1.2  STEP 2: Device Configuration
        3. 8.3.1.3  STEP 3: JESD Interface Configuration (1)
        4. 8.3.1.4  STEP 4: SYSREF Synchronization
        5. 8.3.1.5  STEP 5: JESD Interface Configuration (2)
        6. 8.3.1.6  STEP 6: Analog Trim Settings
        7. 8.3.1.7  STEP 7: Calibration Configuration
        8. 8.3.1.8  STEP 8: SYSREF Synchronization
        9. 8.3.1.9  STEP 9: Run Power up Calibration
        10. 8.3.1.10 STEP 10: JESD Interface Synchronization
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.11 Timing Requirements

Maximum and minimum values are specified over the operating free-air temperature range and nominal supply voltages. Typical values are specified at TA = 25°C, ADC sampling rate = 3.0 GSPS, Bypass mode, 50% clock duty cycle, AVDD18 = 1.8V, AVDD12, AVDDCLK, DVDD = 1.2V and –1-dBFS differential input, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ADC TIMING SPECIFICATIONS
TAD Aperture Delay 0.17 ns
Aperure Delay variation 0.07 ns
TA Aperture Jitter 50 fs
Overload recovery time 3-dB overload condition 10 clock cycles
6-dB overload condition 50
tADC ADC latency from sampling instant to internal hand-off to digital 68 clock cycles
Internal propagation delay 5 ns
Latency adder for 2x or 4x averaging 4 clock cycles
Deterministic delay from digital block (DDC (if used) and JESD interface) LMFS = 8-2-8-20 260 clock cycles
LMFS = 8-2-2-4 280
4x complex decimation, LMFS = 8-4-2-2 456
4x real decimation, LMFS = 4-2-2-2 456
4x decimation, F (number of octets) = 2 394
4x decimation, F = 4 374
4x decimation, F = 8 367
8x decimation, F = 2 560
8x decimation, F = 4 520
8x decimation, F = 8 506
8x decimation, F = 16 491
16x decimation, F = 2 900
16x decimation, F = 4 820
16x decimation, F = 8 792
16x decimation, F = 16 762
16x decimation, F = 32 748
32x decimation, F = 2 1596
32x decimation, F = 4 1436
32x decimation, F = 8 1380
32x decimation, F = 16 1320
32x decimation, F = 32 1292
64x decimation, F = 2 2940
64x decimation, F = 4 2620
64x decimation, F = 8 2508
64x decimation, F = 16 2388
64x decimation, F = 32 2332
128x decimation, F = 2 5668
128x decimation, F = 4 5028
128x decimation, F = 8 4804
128x decimation, F = 16 4564
128x decimation, F = 32 4452
SERIAL PROGRAMMING INTERFACE (SCLK, SEN, SDIO) - Input
fCLK(SCLK) Serial clock frequency 1 20 MHz
tSU(SEN) SEN to rising edge of SCLK 10 ns
tH(SEN) SEN from rising edge of SCLK 10 ns
tSU(SDIO) SDIO to rising edge of SCLK 10 ns
tH(SDIO) SDIO from rising edge of SCLK 10 ns
SERIAL PROGRAMMING INTERFACE (SDIO) - Output
t(OZD) SDIO tri-state to driven 10 ns
t(ODZ) SDIO data to tri-state 14 ns
t(OD) SDIO valid from falling edge of SCLK 10 ns
TIMING: SYSREFP/M
ts(SYSREF) Setup time, SYSREFP/M valid to rising edge of CLKP/M 50 ps
th(SYSREF) Hold time, SYSREFP/M valid to rising edge of CLKP/M 50 ps
CML SERDES OUTPUTS: DA[0:3]P/M, DB[0:3]P/M
fSerdes Serdes bit rate 0.5 12.8 13.0 Gbps
RJ Random jitter, RMS RPAT, 6.4 Gbps 0.7 ps
RPAT, 12.8 Gbps 0.6
DJ Deterministic jitter, peak to peak RPAT, 6.4 Gbps 8.9 ps
RPAT, 12.8 Gbps 14.7
TJ Total jitter, peak to peak RPAT, 6.4 Gbps 19.5 ps
RPAT, 12.8 Gbps 24