SBAS988 November   2023 ADC34RF55

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics - Power Consumption
    6. 5.6  Electrical Characteristics - DC Specifications
    7. 5.7  Electrical Characteristics - AC Specifications (Dither DISABLED)
    8. 5.8  Electrical Characteristics - AC Specifications (Dither ENABLED)
    9. 5.9  Timing Requirements
    10. 5.10 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog Inputs
        1. 6.3.1.1 Input Bandwidth and Full-Scale
        2. 6.3.1.2 Input Imbalance
        3. 6.3.1.3 Over Range Indication
        4. 6.3.1.4 Analog out-of-band dither
      2. 6.3.2 Sampling Clock Input
      3. 6.3.3 ADC Foreground Calibration
        1. 6.3.3.1 Calibration Control
        2. 6.3.3.2 ADC Switch
        3. 6.3.3.3 Calibration Configuration
      4. 6.3.4 SYSREF
        1. 6.3.4.1 SYSREF Capture Detection
      5. 6.3.5 Decimation Filter
        1. 6.3.5.1 Decimation Filter Response
        2. 6.3.5.2 Decimation Filter Configuration
        3. 6.3.5.3 20-bit Output Mode
        4. 6.3.5.4 Numerically Controlled Oscillator (NCO)
        5. 6.3.5.5 NCO Frequency Programming Using the SPI Interface
        6. 6.3.5.6 Fast Frequency Hopping
          1. 6.3.5.6.1 Fast frequency hopping using the GPIO1/2 pins
          2. 6.3.5.6.2 Fast frequency hopping using GPIO1/2, SEN and SDATA pins
          3. 6.3.5.6.3 Fast frequency hopping using the fast SPI
      6. 6.3.6 JESD204B Interface
        1. 6.3.6.1 JESD204B Initial Lane Alignment (ILA)
          1. 6.3.6.1.1 SYNC Signal
        2. 6.3.6.2 JESD204B Frame Assembly
          1. 6.3.6.2.1 JESD204B Frame Assembly in Bypass Mode
          2. 6.3.6.2.2 JESD204B Frame Assembly with Real Decimation - Single Band
          3. 6.3.6.2.3 JESD204B Frame Assembly with Complex Decimation - Single Band
          4. 6.3.6.2.4 JESD204B Frame Assembly with Decimation - Dual Band
        3. 6.3.6.3 SERDES Output MUX
      7. 6.3.7 Test Pattern
        1. 6.3.7.1 Transport Layer
        2. 6.3.7.2 Link Layer
        3. 6.3.7.3 Internal Capture Memory Buffer
    4. 6.4 Device Functional Modes
      1. 6.4.1 Bypass Mode
      2. 6.4.2 Digital Averaging
    5. 6.5 Programming
      1. 6.5.1 GPIO Pin Control
      2. 6.5.2 Configuration using the SPI interface
        1. 6.5.2.1 Register Write
        2. 6.5.2.2 Register Read
    6. 6.6 Register Maps
      1. 6.6.1 Detailed Register Description
  8. 7 Application Information Disclaimer
    1. 7.1 Application Information
    2. 7.2 Typical Application
      1. 7.2.1 Wideband RF Sampling Receiver
      2. 7.2.2 Design Requirements
        1. 7.2.2.1 Input Signal Path
        2. 7.2.2.2 Clocking
      3. 7.2.3 Detailed Design Procedure
        1. 7.2.3.1 Sampling Clock
      4. 7.2.4 Application Curves
    3. 7.3 Initialization Set Up
      1. 7.3.1 Initial Device Configuration After Power-Up
        1. 7.3.1.1  STEP 1: RESET
        2. 7.3.1.2  STEP 2: Device Configuration
        3. 7.3.1.3  STEP 3: JESD Interface Configuration (1)
        4. 7.3.1.4  STEP 4: SYSREF Synchronization
        5. 7.3.1.5  STEP 5: JESD Interface Configuration (2)
        6. 7.3.1.6  STEP 6: Analog Trim Settings
        7. 7.3.1.7  STEP 7: Calibration Configuration
        8. 7.3.1.8  STEP 8: SYSREF Synchronization
        9. 7.3.1.9  STEP 9: Run Power up Calibration
        10. 7.3.1.10 Step 10: JESD Interface Synchronization
        11. 7.3.1.11 Step 11: NCO Configuration
    4. 7.4 Power Supply Recommendations
    5. 7.5 Layout
      1. 7.5.1 Layout Guidelines
      2. 7.5.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Third-Party Products Disclaimer
    2. 8.2 Receiving Notification of Documentation Updates
    3. 8.3 Support Resources
    4. 8.4 Trademarks
    5. 8.5 Electrostatic Discharge Caution
    6. 8.6 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5.2 Configuration using the SPI interface

The device has a set of internal registers that can be accessed by the serial interface formed by the SEN (serial interface enable), SCLK (serial interface clock) and SDIO (serial interface data input/output) pins. Serially shifting bits into the device is enabled when SEN is low. Serial data input are latched at every SCLK rising edge when SEN is active (low). The serial data are loaded into the register at every 24th SCLK rising edge when SEN is low. When the word length exceeds a multiple of 24 bits, the excess bits are ignored. Data can be loaded in multiples of 24-bit words within a single active SEN pulse. The interface can function with SCLK frequencies from 20 MHz down to approximately 1 MHz and also with a non-50% SCLK duty cycle.