SBAS887 August   2022 ADC3564

PRODUCTION DATA  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics - Power Consumption
    6. 6.6 Electrical Characteristics - DC Specifications
    7. 6.7 Electrical Characteristics - AC Specifications
    8. 6.8 Timing Requirements
    9. 6.9 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
        1. 8.3.1.1 Analog Input Bandwidth
        2. 8.3.1.2 Analog Front End Design
          1. 8.3.1.2.1 Sampling Glitch Filter Design
          2. 8.3.1.2.2 Analog Input Termination and DC Bias
            1. 8.3.1.2.2.1 AC-Coupling
            2. 8.3.1.2.2.2 DC-Coupling
      2. 8.3.2 Clock Input
        1. 8.3.2.1 Single Ended vs Differential Clock Input
      3. 8.3.3 Voltage Reference
        1. 8.3.3.1 Internal voltage reference
        2. 8.3.3.2 External voltage reference (VREF)
        3. 8.3.3.3 External voltage reference with internal buffer (REFBUF)
      4. 8.3.4 Digital Down Converter
        1. 8.3.4.1 DDC MUX for Dual Band Decimation
        2. 8.3.4.2 Digital Filter Operation
        3. 8.3.4.3 FS/4 Mixing with Real Output
        4. 8.3.4.4 Numerically Controlled Oscillator (NCO) and Digital Mixer
        5. 8.3.4.5 Decimation Filter
        6. 8.3.4.6 SYNC
        7. 8.3.4.7 Output Formatting with Decimation
      5. 8.3.5 Digital Interface
        1. 8.3.5.1 Output Formatter
        2. 8.3.5.2 Output Bit Mapper
        3. 8.3.5.3 Output Interface/Mode Configuration
          1. 8.3.5.3.1 Configuration Example
        4. 8.3.5.4 Output Data Format
      6. 8.3.6 Test Pattern
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal operation
      2. 8.4.2 Power Down Options
    5. 8.5 Programming
      1. 8.5.1 Configuration using PINs only
      2. 8.5.2 Configuration using the SPI interface
        1. 8.5.2.1 Register Write
        2. 8.5.2.2 Register Read
    6. 8.6 Register Maps
      1. 8.6.1 Detailed Register Description
  9. Application Information Disclaimer
    1. 9.1 Typical Application
      1. 9.1.1 Design Requirements
      2. 9.1.2 Detailed Design Procedure
        1. 9.1.2.1 Input Signal Path
        2. 9.1.2.2 Sampling Clock
        3. 9.1.2.3 Voltage Reference
      3. 9.1.3 Application Curves
    2. 9.2 Initialization Set Up
      1. 9.2.1 Register Initialization During Operation
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Device Support
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Electrical Characteristics - DC Specifications

Typical values are over the operating free-air temperature range, at TA = 25°C, full temperature range is TMIN = –40°C to TMAX = 105°C, ADC sampling rate = 125 MSPS, 50% clock duty cycle, AVDD = IOVDD = 1.8 V, 1.6 V external reference, and –1-dBFS differential input, unless otherwise noted
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DC ACCURACY
No missing codes 14 bits
PSRR FIN = 1 MHz 35 dB
DNL Differential nonlinearity FIN = 5 MHz -0.97 ± 0.9 0.97 LSB
INL Integral nonlinearity FIN = 5 MHz -7.5 ± 2.6 7.5 LSB
VOS_ERR Offset error -55 ± 30 55 LSB
VOS_DRIFT Offset drift over temperature ± 0.06 LSB/ºC
GAINERR Gain error External 1.6V Reference ± 2 %FSR
GAINDRIFT Gain drift over temperature External 1.6V Reference ± 57 ppm/ºC
GAINERR Gain error Internal Reference ± 3 %FSR
GAINDRIFT Gain drift over temperature Internal Reference 106 ppm/ºC
Transition Noise 0.7 LSB
ADC ANALOG INPUT (AINP/M)
FS Input full scale Differential 3.2 Vpp
VCM Input common model voltage 0.9 0.95 1.0 V
RIN Input resistance Differential at DC 8
CIN Input Capacitance Differential at DC 5.4 pF
VOCM Output common mode voltage 0.95 V
BW Analog Input Bandwidth (-3dB) 1.4 GHz
Internal Voltage Reference
VREF Internal reference voltage 1.6 V
VREF Output Impedance 8 Ω
Reference Input Buffer (REFBUF)
External reference voltage 1.2 V
External voltage reference (VREF)
VREF External voltage reference 1.6 V
Input Current 1 mA
Input impedance 5.3
Clock Input (CLKP/M)
Input clock frequency External reference 10 125 MHz
Internal reference 100 125 MHz
VID Differential input voltage 1 3.6 Vpp
VCM Input common mode voltage 0.9 V
RIN Single ended input resistance to common mode 5
CIN Single ended input capacitance 1.5 pF
Clock duty cycle 45 50 60 %
Digital Inputs (RESET, PDN, SCLK, SEN, SDIO)
VIH High level input voltage 1.4 V
VIL Low level input voltage 0.4
IIH High level input current 90 150 uA
IIL Low level input current -150 -90 uA
CI Input capacitance 1.5 pF
Digital Output (SDOUT)
VOH High level output voltage ILOAD = -400 uA IOVDD – 0.1 IOVDD V
VOL Low level output voltage ILOAD = 400 uA 0.1
SLVDS Interface
VID Differential input voltage DCLKIN 200 350 650 mVpp
VCM Input common mode voltage 1 1.2 1.3 V
Output data rate per differential SLVDS output 1 Gbps
VOD Differential output voltage 500 700 850 mVpp
VCM Output common mode voltage 1.0 V