SBAS873A February   2021  – October 2022 ADC3581 , ADC3582 , ADC3583

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Power Consumption
    6. 6.6  Electrical Characteristics - DC Specifications
    7. 6.7  Electrical Characteristics - AC Specifications
    8. 6.8  Timing Requirements
    9. 6.9  Typical Characteristics - ADC3581
    10. 6.10 Typical Characteristics - ADC3582
    11. 6.11 Typical Characteristics - ADC3583
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
        1. 8.3.1.1 Analog Input Bandwidth
        2. 8.3.1.2 Analog Front End Design
          1. 8.3.1.2.1 Sampling Glitch Filter Design
          2. 8.3.1.2.2 Analog Input Termination and DC Bias
            1. 8.3.1.2.2.1 AC-Coupling
            2. 8.3.1.2.2.2 DC-Coupling
        3. 8.3.1.3 Auto-Zero Feature
      2. 8.3.2 Clock Input
        1. 8.3.2.1 Single Ended vs Differential Clock Input
        2. 8.3.2.2 Signal Acquisition Time Adjust
      3. 8.3.3 Voltage Reference
        1. 8.3.3.1 Internal voltage reference
        2. 8.3.3.2 External voltage reference (VREF)
        3. 8.3.3.3 External voltage reference with internal buffer (REFBUF)
      4. 8.3.4 Digital Down Converter
        1. 8.3.4.1 DDC MUX for Dual Band Decimation
        2. 8.3.4.2 Digital Filter Operation
        3. 8.3.4.3 FS/4 Mixing with Real Output
        4. 8.3.4.4 Numerically Controlled Oscillator (NCO) and Digital Mixer
        5. 8.3.4.5 Decimation Filter
        6. 8.3.4.6 SYNC
        7. 8.3.4.7 Output Formatting with Decimation
      5. 8.3.5 Digital Interface
        1. 8.3.5.1 Output Formatter
        2. 8.3.5.2 Output Scrambler
        3. 8.3.5.3 Output Bit Mapper
        4. 8.3.5.4 Output Interface/Mode Configuration
          1. 8.3.5.4.1 Configuration Example
        5. 8.3.5.5 Output Data Format
      6. 8.3.6 Test Pattern
    4. 8.4 Device Functional Modes
      1. 8.4.1 Normal Operation
      2. 8.4.2 Power Down Options
    5. 8.5 Programming
      1. 8.5.1 Configuration using PINs only
      2. 8.5.2 Configuration using the SPI interface
        1. 8.5.2.1 Register Write
        2. 8.5.2.2 Register Read
    6. 8.6 Register Map
      1. 8.6.1 Detailed Register Description
  9. 9 Application Information Disclaimer
    1. 9.1 Typical Application
      1. 9.1.1 Design Requirements
      2. 9.1.2 Detailed Design Procedure
        1. 9.1.2.1 Input Signal Path
        2. 9.1.2.2 Sampling Clock
        3. 9.1.2.3 Voltage Reference
      3. 9.1.3 Application Curves
    2. 9.2 Initialization Set Up
      1. 9.2.1 Register Initialization During Operation
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.4 Electrostatic Discharge Caution

GUID-D6F43A01-4379-4BA1-8019-E75693455CED-low.gif This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.