SBASAU9 October   2024 ADC3908D025 , ADC3908D065 , ADC3908D125 , ADC3908S025 , ADC3908S065 , ADC3908S125

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - Power Consumption
    6. 6.6  Electrical Characteristics - DC Specifications
    7. 6.7  Electrical Characteristics - AC Specifications (25 MSPS)
    8. 6.8  Electrical Characteristics - AC Specifications (65 MSPS)
    9. 6.9  Electrical Characteristics - AC Specifications (125 MSPS)
    10. 6.10 Timing Requirements
    11. 6.11 Output Interface Timing Diagram
    12. 6.12 Typical Characteristics: 25MSPS
    13. 6.13 Typical Characteristics - 65MSPS
    14. 6.14 Typical Characteristics - 125MSPS
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
        1. 7.3.1.1 Single Ended Input
        2. 7.3.1.2 Differential Input
        3. 7.3.1.3 Analog Input Bandwidth
      2. 7.3.2 Sampling Clock Input
      3. 7.3.3 Digital Interface
        1. 7.3.3.1 Test Pattern
        2. 7.3.3.2 Interface Configuration using Pin Control
    4. 7.4 Device Functional Modes
      1. 7.4.1 Normal Operation
      2. 7.4.2 Power Down
  9. Application Information Disclaimer
    1. 8.1 Typical Application
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
        1. 8.1.2.1 Input Signal Path
        2. 8.1.2.2 Sampling Clock
      3. 8.1.3 Application Curves
    2. 8.2 Initialization Set Up
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Layout Guidelines

There are several critical signals which require specific care during board design:

  1. Analog input and clock signals
    • Traces should be as short as possible and vias should be avoided where possible to minimize impedance discontinuities.
  2. Digital output interface
    • Traces should be as short as possible to reduce capacitive load seen by the CMOS outputs.

    • Series resistance should be used to reduce instantaneous current demand and improve signal integrity.
  3. Power and ground connections
    • Provide low resistance connection paths to all power and ground pins.
    • Use power and ground planes instead of traces.
    • Avoid narrow, isolated paths which increase the connection resistance.
    • Use a signal/ground/power circuit board stackup to maximize coupling between the ground and power plane.