SBAS480C september   2009  – june 2023 ADS1000-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog-to-Digital Converter
      2. 7.3.2 Clock Generator
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operating Modes
      2. 7.4.2 Reset and Power Up
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
      2. 7.5.2 ADS1000-Q1 I2C Addresses
      3. 7.5.3 I2C General Call
      4. 7.5.4 I2C Data Rates
      5. 7.5.5 Output Code Calculation
    6. 7.6 Register Maps
      1. 7.6.1 Output Register
      2. 7.6.2 Configuration Register
      3. 7.6.3 Reading From the ADS1000-Q1
      4. 7.6.4 Writing to the ADS1000-Q1
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
        1. 8.1.1.1 Connecting Multiple Devices
        2. 8.1.1.2 Using GPIO Ports For I2C
        3. 8.1.1.3 Single-Ended Inputs
    2. 8.2 Typical Applications
      1. 8.2.1 ADS1000-Q1 With Current-Shunt Monitor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Part Selection
            1. 8.2.1.2.1.1 Gain Settings
            2. 8.2.1.2.1.2 Circuit Implementation
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Low-Side Current Measurement
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Receiving Notification of Documentation Updates
    2. 9.2 Support Resources
    3. 9.3 Trademarks
    4. 9.4 Electrostatic Discharge Caution
    5. 9.5 Glossary
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from Revision B (April 2015) to Revision C (June 2023)

  • Changed document titleGo
  • Changed all instances of legacy terminology to controller and target where I2C is mentioned. Go
  • Added first column to Absolute Maximum Ratings table, changed Analog input voltage parameter minimum and maximum specifications and Digital input voltage parameter minimum specificationsGo
  • Added ESD classification levels to ESD Ratings tableGo
  • Deleted Power-supply voltage parameter from Electrical Characteristics tableGo
  • Changed SCLK to SCL in Timing Requirements tableGo
  • Changed bit setting notation from hexadecimal to binary where beneficial for clarity throughout Register Map sectionGo
  • Added RW type to bits 4, 1, and 0 and clarified bit 4 description in Configuration Register Field Descriptions tableGo
  • Deleted PGA Bits table, added description to PGA[1:0] bit field in Configuration Register Field Descriptions tableGo
  • Changed and moved Timing Diagram for Reading from the ADS1000-Q1 figure to the Reading From the ADS1000-Q1 sectionGo
  • Changed Timing Diagram for Writing to the ADS1000-Q1 figureGo
  • Changed Connecting Multiple ADS1000-Q1 Devices figure.Go
  • Changed Using GPIO With a Single ADS1000-Q1 figureGo
  • Deleted level-shifting discussion from Single-Ended Inputs sectionGo
  • Changed first paragraph in Single-Ended Inputs sectionGo
  • Changed Current Shunt Monitor Application figureGo
  • Changed Vsupply to VDD in Equation 9 Go

Changes from Revision A (August 2010) to Revision B (April 2015)

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo