SBAS473E May   2009  – January 2018 ADS1013 , ADS1014 , ADS1015

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Block Diagrams
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: I2C
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagrams
    3. 8.3 Feature Description
      1. 8.3.1 Multiplexer
      2. 8.3.2 Analog Inputs
      3. 8.3.3 Full-Scale Range (FSR) and LSB Size
      4. 8.3.4 Voltage Reference
      5. 8.3.5 Oscillator
      6. 8.3.6 Output Data Rate and Conversion Time
      7. 8.3.7 Digital Comparator (ADS1014 and ADS1015 Only)
      8. 8.3.8 Conversion Ready Pin (ADS1014 and ADS1015 Only)
      9. 8.3.9 SMbus Alert Response
    4. 8.4 Device Functional Modes
      1. 8.4.1 Reset and Power-Up
      2. 8.4.2 Operating Modes
        1. 8.4.2.1 Single-Shot Mode
        2. 8.4.2.2 Continuous-Conversion Mode
      3. 8.4.3 Duty Cycling For Low Power
    5. 8.5 Programming
      1. 8.5.1 I2C Interface
        1. 8.5.1.1 I2C Address Selection
        2. 8.5.1.2 I2C General Call
        3. 8.5.1.3 I2C Speed Modes
      2. 8.5.2 Slave Mode Operations
        1. 8.5.2.1 Receive Mode
        2. 8.5.2.2 Transmit Mode
      3. 8.5.3 Writing To and Reading From the Registers
      4. 8.5.4 Data Format
    6. 8.6 Register Map
      1. 8.6.1 Address Pointer Register (address = N/A) [reset = N/A]
        1. Table 4. Address Pointer Register Field Descriptions
      2. 8.6.2 Conversion Register (P[1:0] = 0h) [reset = 0000h]
        1. Table 5. Conversion Register Field Descriptions
      3. 8.6.3 Config Register (P[1:0] = 1h) [reset = 8583h]
        1. Table 6. Config Register Field Descriptions
      4. 8.6.4 Lo_thresh (P[1:0] = 2h) [reset = 8000h] and Hi_thresh (P[1:0] = 3h) [reset = 7FFFh] Registers
        1. Table 7. Lo_thresh and Hi_thresh Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Basic Connections
      2. 9.1.2 Single-Ended Inputs
      3. 9.1.3 Input Protection
      4. 9.1.4 Unused Inputs and Outputs
      5. 9.1.5 Analog Input Filtering
      6. 9.1.6 Connecting Multiple Devices
      7. 9.1.7 Quickstart Guide
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Shunt Resistor Considerations
        2. 9.2.2.2 Operational Amplifier Considerations
        3. 9.2.2.3 ADC Input Common-Mode Considerations
        4. 9.2.2.4 Resistor (R1, R2, R3, R4) Considerations
        5. 9.2.2.5 Noise and Input Impedance Considerations
        6. 9.2.2.6 First-order RC Filter Considerations
        7. 9.2.2.7 Circuit Implementation
        8. 9.2.2.8 Results Summary
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Sequencing
    2. 10.2 Power-Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

At VDD = 3.3 V, data rate = 128 SPS, and full-scale input-voltage range (FSR) = ±2.048 V (unless otherwise noted).
Maximum and minimum specifications apply from TA = –40°C to +125°C. Typical specifications are at TA = 25°C.
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ANALOG INPUT
Common-mode input impedance FSR = ±6.144 V(1) 10 MΩ
FSR = ±4.096 V(1), FSR = ±2.048 V 6
FSR = ±1.024 V 3
FSR = ±0.512 V, FSR = ±0.256 V 100
Differential input impedance FSR = ±6.144 V(1) 22 MΩ
FSR = ±4.096 V(1) 15
FSR = ±2.048 V 4.9
FSR = ±1.024 V 2.4
FSR = ±0.512 V, ±0.256 V 710 kΩ
SYSTEM PERFORMANCE
Resolution (no missing codes) 12 Bits
DR Data rate 128, 250, 490, 920, 1600, 2400, 3300 SPS
Data rate variation All data rates –10% 10%
INL Integral nonlinearity DR = 128 SPS, FSR = ±2.048 V(2) 0.5 LSB
Offset error FSR = ±2.048 V, differential inputs -0.5 0 0.5 LSB
FSR = ±2.048 V, single-ended inputs ±0.25
Offset drift over temperature FSR = ±2.048 V 0.005 LSB/°C
Long-term offset drift FSR = ±2.048 V, TA = 125°C, 1000 hrs ±1 LSB
Offset channel match Match between any two inputs 0.25 LSB
Gain error(3) FSR = ±2.048 V, TA = 25°C 0.05% 0.25%
Gain drift over temperature(3) FSR = ±0.256 V 7 ppm/°C
FSR = ±2.048 V 5 40
FSR = ±6.144 V(1) 5
Long-term gain drift FSR = ±2.048 V, TA = 125°C, 1000 hrs ±0.05 %
Gain match(3) Match between any two gains 0.02% 0.1%
Gain channel match Match between any two inputs 0.05% 0.1%
DIGITAL INPUT/OUTPUT
VIH High-level input voltage 0.7 VDD VDD V
VIL Low-level input voltage GND 0.3 VDD V
VOL Low-level output voltage IOL = 3 mA GND 0.15 0.4 V
Input leakage current GND < VDIG < VDD –10 10 µA
POWER-SUPPLY
IVDD Supply current Power-down TA = 25°C 0.5 2 µA
5
Operating TA = 25°C 150 200
300
PD Power dissipation VDD = 5.0 V 0.9 mW
VDD = 3.3 V 0.5
VDD = 2.0 V 0.3
(2) Best-fit INL; covers 99% of full-scale.
(3) Includes all errors from onboard PGA and voltage reference.