SBAS511E july   2010  – july 2023 ADS1013-Q1 , ADS1014-Q1 , ADS1015-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Revision History
  6.   Device Comparison Table
  7. 5 Pin Configuration and Functions
  8. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: I2C
    7. 6.7 Timing Diagram
    8. 6.8 Typical Characteristics
  9. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagrams
    3. 7.3 Feature Description
      1. 7.3.1 Multiplexer
      2. 7.3.2 Analog Inputs
      3. 7.3.3 Full-Scale Range (FSR) and LSB Size
      4. 7.3.4 Voltage Reference
      5. 7.3.5 Oscillator
      6. 7.3.6 Output Data Rate and Conversion Time
      7. 7.3.7 Digital Comparator (ADS1014-Q1 and ADS1015-Q1 Only)
      8. 7.3.8 Conversion Ready Pin (ADS1014-Q1 and ADS1015-Q1 Only)
      9. 7.3.9 SMbus Alert Response
    4. 7.4 Device Functional Modes
      1. 7.4.1 Reset and Power-Up
      2. 7.4.2 Operating Modes
        1. 7.4.2.1 Single-Shot Mode
        2. 7.4.2.2 Continuous-Conversion Mode
      3. 7.4.3 Duty Cycling For Low Power
    5. 7.5 Programming
      1. 7.5.1 I2C Interface
        1. 7.5.1.1 I2C Address Selection
        2. 7.5.1.2 I2C General Call
        3. 7.5.1.3 I2C Speed Modes
      2. 7.5.2 Target Mode Operations
        1. 7.5.2.1 Receive Mode
        2. 7.5.2.2 Transmit Mode
      3. 7.5.3 Writing To and Reading From the Registers
      4. 7.5.4 Data Format
    6. 7.6 Register Map
      1. 7.6.1 Address Pointer Register (address = N/A) [reset = N/A]
      2. 7.6.2 Conversion Register (P[1:0] = 00b) [reset = 0000h]
      3. 7.6.3 Config Register (P[1:0] = 01b) [reset = 8583h]
      4. 7.6.4 Lo_thresh (P[1:0] = 10b) [reset = 8000h] and Hi_thresh (P[1:0] = 11b) [reset = 7FFFh] Registers
  10. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Basic Connections
      2. 8.1.2 Single-Ended Inputs
      3. 8.1.3 Input Protection
      4. 8.1.4 Unused Inputs and Outputs
      5. 8.1.5 Analog Input Filtering
      6. 8.1.6 Connecting Multiple Devices
      7. 8.1.7 Quick-Start Guide
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Shunt Resistor Considerations
        2. 8.2.2.2 Operational Amplifier Considerations
        3. 8.2.2.3 ADC Input Common-Mode Considerations
        4. 8.2.2.4 Resistor (R1, R2, R3, R4) Considerations
        5. 8.2.2.5 Noise and Input Impedance Considerations
        6. 8.2.2.6 First-Order RC Filter Considerations
        7. 8.2.2.7 Circuit Implementation
        8. 8.2.2.8 Results Summary
      3. 8.2.3 Application Curves
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Power-Supply Sequencing
      2. 8.3.2 Power-Supply Decoupling
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  11. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  12. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from June 13, 2023 to July 31, 2023 (from Revision D (March 2023) to Revision E (July 2023))

  • Changed output code information in Data Format section for clarityGo
  • Changed data rate settings of DR[2:0] bit field in Config Register Field Descriptions table in Config Register sectionGo

Changes from Revision C (January 2018) to Revision D (March 2023)

  • Changed all instances of legacy terminology to controller and target where I2C is mentionedGo
  • Added Functional Safety-Capable bullets and device family information to Features section, moved ESD classification information from Features section to ESD Ratings tableGo
  • Changed applications in Application sectionGo
  • Added NKS package and Device Information table and deleted last paragraph from Description sectionGo
  • Added NKS package to Pin Configuration and Functions section and changed Pin Functions tableGo
  • Added ESD classification levels and NKS package to ESD Ratings table.Go
  • Added NKS package to Thermal Information table.Go
  • Changed VIH maximum value to 5.5 V in Electrical Characteristics tableGo
  • Added additional information to last paragraph in Multiplexer sectionGo
  • Added additional information to Voltage Reference sectionGo
  • Moved Figure 7-7 from Conversion Ready Pin section to Digital Comparator section.Go
  • Corrected cross reference to Timing Diagram for Reading From the ADS101x-Q1 figure in Writing to and Reading From the Registers sectionGo
  • Changed bit setting notation from hexadecimal to binary where beneficial for clarity throughout Register Map sectionGo
  • Added dedicated Config Register tables for ADS1013-Q1, ADS1014-Q1, and ADS1015-Q1 and changed bit descriptions in Config Register Field Descriptions table in Config Register sectionGo
  • Changed first paragraph in Lo_threh and Hi_thresh Registers sectionGo
  • Changed Unused Inputs and Outputs sectionGo
  • Changed statement above Equation 3 in Detailed Design Procedure section.Go