SBAS741B
October 2015 – April 2020
ADS1018-Q1
PRODUCTION DATA.
1
Features
2
Applications
3
Description
Device Images
K-Type Thermocouple Measurement Using Integrated Temperature Sensor for Cold-Junction Compensation
4
Revision History
5
Device Comparison Table
6
Pin Configuration and Functions
Pin Functions
7
Specifications
7.1
Absolute Maximum Ratings
7.2
ESD Ratings
7.3
Recommended Operating Conditions
7.4
Thermal Information
7.5
Electrical Characteristics
7.6
Timing Requirements: Serial Interface
7.7
Switching Characteristics: Serial Interface
7.8
Typical Characteristics
8
Detailed Description
8.1
Overview
8.2
Functional Block Diagram
8.3
Feature Description
8.3.1
Multiplexer
8.3.2
Analog Inputs
8.3.3
Full-Scale Range (FSR) and LSB Size
8.3.4
Voltage Reference
8.3.5
Oscillator
8.3.6
Temperature Sensor
8.3.6.1
Converting from Temperature to Digital Codes
8.3.6.2
Converting from Digital Codes to Temperature
8.4
Device Functional Modes
8.4.1
Reset and Power-Up
8.4.2
Operating Modes
8.4.2.1
Single-Shot Mode and Power-Down
8.4.2.2
Continuous-Conversion Mode
8.4.3
Duty Cycling for Low Power
8.5
Programming
8.5.1
Serial Interface
8.5.2
Chip Select (CS)
8.5.3
Serial Clock (SCLK)
8.5.4
Data Input (DIN)
8.5.5
Data Output and Data Ready (DOUT/DRDY)
8.5.6
Data Format
8.5.7
Data Retrieval
8.5.7.1
32-Bit Data Transmission Cycle
8.5.7.2
16-Bit Data Transmission Cycle
8.6
Register Maps
8.6.1
Conversion Register [reset = 0000h]
Table 4.
Conversion Register Field Descriptions
8.6.2
Config Register [reset = 058Bh]
Table 5.
Config Register Field Descriptions
9
Application and Implementation
9.1
Application Information
9.1.1
Serial Interface Connections
9.1.2
GPIO Ports for Communication
9.1.3
Analog Input Filtering
9.1.4
Single-Ended Inputs
9.1.5
Connecting Multiple Devices
9.1.6
Pseudo Code Example
9.2
Typical Application
9.2.1
Design Requirements
9.2.2
Detailed Design Procedure
9.2.3
Application Curves
10
Power Supply Recommendations
10.1
Power-Supply Sequencing
10.2
Power-Supply Decoupling
11
Layout
11.1
Layout Guidelines
11.2
Layout Example
12
Device and Documentation Support
12.1
Documentation Support
12.1.1
Related Documentation
12.2
Receiving Notification of Documentation Updates
12.3
Community Resources
12.4
Trademarks
12.5
Electrostatic Discharge Caution
12.6
Glossary
13
Mechanical, Packaging, and Orderable Information
Package Options
Mechanical Data (Package|Pins)
DGS|10
MPDS035C
Thermal pad, mechanical data (Package|Pins)
Orderable Information
sbas741b_oa
sbas741b_pm
8.2
Functional Block Diagram