SBAS741B October   2015  – April 2020 ADS1018-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      K-Type Thermocouple Measurement Using Integrated Temperature Sensor for Cold-Junction Compensation
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements: Serial Interface
    7. 7.7 Switching Characteristics: Serial Interface
    8. 7.8 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Multiplexer
      2. 8.3.2 Analog Inputs
      3. 8.3.3 Full-Scale Range (FSR) and LSB Size
      4. 8.3.4 Voltage Reference
      5. 8.3.5 Oscillator
      6. 8.3.6 Temperature Sensor
        1. 8.3.6.1 Converting from Temperature to Digital Codes
        2. 8.3.6.2 Converting from Digital Codes to Temperature
    4. 8.4 Device Functional Modes
      1. 8.4.1 Reset and Power-Up
      2. 8.4.2 Operating Modes
        1. 8.4.2.1 Single-Shot Mode and Power-Down
        2. 8.4.2.2 Continuous-Conversion Mode
      3. 8.4.3 Duty Cycling for Low Power
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
      2. 8.5.2 Chip Select (CS)
      3. 8.5.3 Serial Clock (SCLK)
      4. 8.5.4 Data Input (DIN)
      5. 8.5.5 Data Output and Data Ready (DOUT/DRDY)
      6. 8.5.6 Data Format
      7. 8.5.7 Data Retrieval
        1. 8.5.7.1 32-Bit Data Transmission Cycle
        2. 8.5.7.2 16-Bit Data Transmission Cycle
    6. 8.6 Register Maps
      1. 8.6.1 Conversion Register [reset = 0000h]
        1. Table 4. Conversion Register Field Descriptions
      2. 8.6.2 Config Register [reset = 058Bh]
        1. Table 5. Config Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Serial Interface Connections
      2. 9.1.2 GPIO Ports for Communication
      3. 9.1.3 Analog Input Filtering
      4. 9.1.4 Single-Ended Inputs
      5. 9.1.5 Connecting Multiple Devices
      6. 9.1.6 Pseudo Code Example
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Sequencing
    2. 10.2 Power-Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.3 Recommended Operating Conditions

over operating ambient temperature range (unless otherwise noted)
MIN NOM MAX UNIT
POWER SUPPLY
VDD Power supply VDD to GND 2 5.5 V
ANALOG INPUTS(2)
FSR Full-scale input voltage(1) VIN = V(AINP) - V(AINN) See Table 1
V(AINx) Absolute input voltage GND VDD V
DIGITAL INPUTS
Input voltage GND VDD V
TEMPERATURE
TA Operating ambient temperature –40 125 °C
(1) This parameter expresses the full-scale range of the ADC scaling. No more than VDD + 0.3 V or 5.5 V (whichever is smaller) must be applied to this device.
(2) AINP and AINN denote the selected positive and negative inputs. AINx denotes one of the four available analog inputs.