SBASAH6A March   2022  – October 2022 ADS117L11

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements (1.65 V ≤ IOVDD ≤ 2 V)
    7. 6.7  Switching Characteristics (1.65 V ≤ IOVDD ≤ 2 V)
    8. 6.8  Timing Requirements (2 V < IOVDD ≤ 5.5 V)
    9. 6.9  Switching Characteristics (2 V < IOVDD ≤ 5.5 V)
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1  Offset Error Measurement
    2. 7.2  Offset Drift Measurement
    3. 7.3  Gain Error Measurement
    4. 7.4  Gain Drift Measurement
    5. 7.5  NMRR Measurement
    6. 7.6  CMRR Measurement
    7. 7.7  PSRR Measurement
    8. 7.8  INL Error Measurement
    9. 7.9  THD Measurement
    10. 7.10 SFDR Measurement
    11. 7.11 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input (AINP, AINN)
        1. 8.3.1.1 Input Range
      2. 8.3.2 Reference Voltage (REFP, REFN)
        1. 8.3.2.1 Reference Voltage Range
      3. 8.3.3 Clock Operation
        1. 8.3.3.1 Internal Oscillator
        2. 8.3.3.2 External Clock
      4. 8.3.4 Modulator
      5. 8.3.5 Digital Filter
        1. 8.3.5.1 Wideband Filter
        2. 8.3.5.2 Low-Latency Filter (Sinc)
          1. 8.3.5.2.1 Sinc4 Filter
          2. 8.3.5.2.2 Sinc4 + Sinc1 Filter
          3. 8.3.5.2.3 Sinc3 Filter
          4. 8.3.5.2.4 Sinc3 + Sinc1 Filter
      6. 8.3.6 Power Supplies
        1. 8.3.6.1 AVDD1 and AVSS
        2. 8.3.6.2 AVDD2
        3. 8.3.6.3 IOVDD
        4. 8.3.6.4 Power-On Reset (POR)
        5. 8.3.6.5 CAPA and CAPD
      7. 8.3.7 VCM Output Voltage
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Scalable Speed Modes
      2. 8.4.2 Idle Mode
      3. 8.4.3 Standby Mode
      4. 8.4.4 Power-Down Mode
      5. 8.4.5 Reset
        1. 8.4.5.1 RESET Pin
        2. 8.4.5.2 Reset by SPI Register Write
        3. 8.4.5.3 Reset by SPI Input Pattern
      6. 8.4.6 Synchronization
        1. 8.4.6.1 Synchronized Control Mode
        2. 8.4.6.2 Start/Stop Control Mode
        3. 8.4.6.3 One-Shot Control Mode
      7. 8.4.7 Conversion-Start Delay Time
      8. 8.4.8 Calibration
        1. 8.4.8.1 OFFSET2, OFFSET1, OFFSET0 Calibration Registers (Addresses 9h, Ah, Bh)
        2. 8.4.8.2 GAIN2, GAIN1, GAIN0 Calibration Registers (Addresses 0Ch, 0Dh, 0Eh)
        3. 8.4.8.3 Calibration Procedure
    5. 8.5 Programming
      1. 8.5.1 Serial Interface (SPI)
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Serial Data Input (SDI)
        4. 8.5.1.4 Serial Data Output/Data Ready (SDO/DRDY)
      2. 8.5.2 SPI Frame
      3. 8.5.3 SPI CRC
      4. 8.5.4 Register Map CRC
      5. 8.5.5 Full-Duplex Operation
      6. 8.5.6 Device Commands
        1. 8.5.6.1 No-Operation
        2. 8.5.6.2 Read Register Command
        3. 8.5.6.3 Write Register Command
      7. 8.5.7 Read Conversion Data
        1. 8.5.7.1 Conversion Data
        2. 8.5.7.2 Data Ready
          1. 8.5.7.2.1 DRDY
          2. 8.5.7.2.2 SDO/DRDY
          3. 8.5.7.2.3 DRDY Bit
          4. 8.5.7.2.4 Clock Counting
        3. 8.5.7.3 STATUS Header
      8. 8.5.8 Daisy-Chain Operation
      9. 8.5.9 3-Wire SPI Mode
        1. 8.5.9.1 3-Wire SPI Mode Frame Reset
    6. 8.6 Registers
      1. 8.6.1  DEV_ID Register (Address = 0h) [reset = 01h]
      2. 8.6.2  REV_ID Register (Address = 1h) [reset = xxh]
      3. 8.6.3  STATUS Register (Address = 2h) [reset = x1100xxxb]
      4. 8.6.4  CONTROL Register (Address = 3h) [reset = 00h]
      5. 8.6.5  MUX Register (Address = 4h) [reset = 00h]
      6. 8.6.6  CONFIG1 Register (Address = 5h) [reset = 00h]
      7. 8.6.7  CONFIG2 Register (Address = 6h) [reset = 00h]
      8. 8.6.8  CONFIG3 Register (Address = 7h) [reset = 00h]
      9. 8.6.9  CONFIG4 Register (Address = 8h) [reset = 08h]
      10. 8.6.10 OFFSET2, OFFSET1, OFFSET0 Registers (Addresses = 9h, Ah, Bh) [reset = 00h, 00h, 00h]
      11. 8.6.11 GAIN2, GAIN1, GAIN0 Registers (Addresses = Ch, Dh, Eh) [reset = 40h, 00h, 00h]
      12. 8.6.12 CRC Register (Address = Fh) [reset = 00h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Driver
      2. 9.1.2 Antialias Filter
      3. 9.1.3 Reference Voltage
      4. 9.1.4 Simultaneous-Sampling Systems
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.3.1 Internal Oscillator

At power-up and after reset, the ADC defaults to internal oscillator mode (CLK_SEL bit = 0b). The frequency of the internal oscillator automatically scales to high-speed or low-speed operation. Because of the clock jitter associated with the internal oscillator, only use the internal oscillator for dc signal measurements. Do not perform ac signal measurements when using the internal oscillator.

When changing the clock mode from an external clock to the internal oscillator, maintain the external clock for at least four cycles after completing the SPI register write command used to change the clock mode. After the clock mode changes, the ADC ignores control inputs (the START and RESET pins) for a period of 150 μs to allow time for the internal oscillator to stabilize.