SBAS301D October   2003  – February 2020 ADS1204

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Functional Block Diagram
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: 5.0 V
    7. 6.7 Timing Requirements: 3.0 V
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input Stage
        1. 7.3.1.1 Analog Input
        2. 7.3.1.2 Modulator
      2. 7.3.2 Digital Output
      3. 7.3.3 Equivalent Input Circuits
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Filter Usage
  9. 9 Power Supply Recommendations
    1. 9.1 Power-Supply Sequencing
    2. 9.2 Power-Supply Decoupling
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Support Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) ADS1204 UNIT
RHB (VQFN)
32 PINS
RθJA Junction-to-ambient thermal resistance 28.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 17.0 °C/W
RθJB Junction-to-board thermal resistance 9.7 °C/W
ψJT Junction-to-top characterization parameter 0.2 °C/W
ψJB Junction-to-board characterization parameter 9.7 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.7 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application report.