SBAS350G June   2005  – January 2021 ADS1232 , ADS1234

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Analog Inputs (AINPX, AINNX)
      2. 8.3.2  Temperature Sensor (ADS1232 Only)
      3. 8.3.3  Low-Noise PGA
        1. 8.3.3.1 PGA Bypass Capacitor
      4. 8.3.4  Voltage Reference Inputs (REFP, REFN)
      5. 8.3.5  Clock Sources
      6. 8.3.6  Digital Filter Frequency Response
      7. 8.3.7  Settling Time
      8. 8.3.8  Data Rate
      9. 8.3.9  Data Format
      10. 8.3.10 Data Ready and Data Output (DRDY/DOUT)
      11. 8.3.11 Serial Clock Input (SCLK)
      12. 8.3.12 Data Retrieval
    4. 8.4 Device Functional Modes
      1. 8.4.1 Offset Calibration Mode
      2. 8.4.2 Standby Mode
      3. 8.4.3 Standby Mode With Offset-Calibration
      4. 8.4.4 Power-Down Mode
      5. 8.4.5 Power-Up Sequence
      6. 8.4.6 Summary of Serial Interface Waveforms
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1)ADS1232ADS1234UNIT
PW (TSSOP)PW (TSSOP)
24 PINS28 PINS
RθJAJunction-to-ambient thermal resistance82.474.3°C/W
RθJC(top)Junction-to-case (top) thermal resistance25.521.9°C/W
RθJBJunction-to-board thermal resistance38.132.9°C/W
ψJTJunction-to-top characterization parameter1.31.1°C/W
ψJBJunction-to-board characterization parameter37.632.4°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.