SBAS970 October   2019 ADS1235-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
      2.      ADC Conversion Noise
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Inputs
        1. 8.3.1.1 ESD Diodes
        2. 8.3.1.2 Input Multiplexer
        3. 8.3.1.3 Temperature Sensor
        4. 8.3.1.4 Inputs Open
        5. 8.3.1.5 Internal VCOM Connection
        6. 8.3.1.6 Alternate Functions
      2. 8.3.2 PGA
        1. 8.3.2.1 Input Voltage Range
        2. 8.3.2.2 PGA Bypass Mode
      3. 8.3.3 PGA Voltage Monitor
      4. 8.3.4 Reference Voltage
        1. 8.3.4.1 External Reference
        2. 8.3.4.2 AVDD – AVSS Reference (Default)
        3. 8.3.4.3 Reference Monitor
      5. 8.3.5 General-Purpose Input/Outputs (GPIOs)
      6. 8.3.6 Modulator
      7. 8.3.7 Digital Filter
        1. 8.3.7.1 Sinc Filter
          1. 8.3.7.1.1 Sinc Filter Frequency Response
        2. 8.3.7.2 FIR Filter
          1. 8.3.7.2.1 FIR Filter Frequency Response
        3. 8.3.7.3 Filter Bandwidth
        4. 8.3.7.4 50-Hz and 60-Hz Normal Mode Rejection
    4. 8.4 Device Functional Modes
      1. 8.4.1 Conversion Control
        1. 8.4.1.1 Continuous-Conversion Mode
        2. 8.4.1.2 Pulse-Conversion Mode
        3. 8.4.1.3 Conversion Latency
        4. 8.4.1.4 Start-Conversion Delay
      2. 8.4.2 Chop Mode
      3. 8.4.3 AC-Bridge Excitation Mode
      4. 8.4.4 ADC Clock Mode
      5. 8.4.5 Power-Down Mode
        1. 8.4.5.1 Hardware Power-Down
        2. 8.4.5.2 Software Power-Down
      6. 8.4.6 Reset
        1. 8.4.6.1 Power-on Reset
        2. 8.4.6.2 Reset by Pin
        3. 8.4.6.3 Reset by Command
      7. 8.4.7 Calibration
        1. 8.4.7.1 Offset and Full-Scale Calibration
          1. 8.4.7.1.1 Offset Calibration Registers
          2. 8.4.7.1.2 Full-Scale Calibration Registers
        2. 8.4.7.2 Offset Self-Calibration (SFOCAL)
        3. 8.4.7.3 Offset System-Calibration (SYOCAL)
        4. 8.4.7.4 Full-Scale Calibration (GANCAL)
        5. 8.4.7.5 Calibration Command Procedure
        6. 8.4.7.6 User Calibration Procedure
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Data Input (DIN)
        4. 8.5.1.4 Data Output/Data Ready (DOUT/DRDY)
        5. 8.5.1.5 Serial Interface Auto-Reset
      2. 8.5.2 Data Ready (DRDY)
        1. 8.5.2.1 DRDY in Continuous-Conversion Mode
        2. 8.5.2.2 DRDY in Pulse-Conversion Mode
        3. 8.5.2.3 Data Ready by Software Polling
      3. 8.5.3 Conversion Data
        1. 8.5.3.1 Status byte (STATUS)
        2. 8.5.3.2 Conversion Data Format
      4. 8.5.4 CRC
      5. 8.5.5 Commands
        1. 8.5.5.1  NOP Command
        2. 8.5.5.2  RESET Command
        3. 8.5.5.3  START Command
        4. 8.5.5.4  STOP Command
        5. 8.5.5.5  RDATA Command
        6. 8.5.5.6  SYOCAL Command
        7. 8.5.5.7  GANCAL Command
        8. 8.5.5.8  SFOCAL Command
        9. 8.5.5.9  RREG Command
        10. 8.5.5.10 WREG Command
        11. 8.5.5.11 LOCK Command
        12. 8.5.5.12 UNLOCK Command
    6. 8.6 Register Map
      1. 8.6.1  Device Identification (ID) Register (address = 00h) [reset = Cxh]
        1. Table 28. ID Register Field Descriptions
      2. 8.6.2  Device Status (STATUS) Register (address = 01h) [reset = 01h]
        1. Table 29. STATUS Register Field Descriptions
      3. 8.6.3  Mode 0 (MODE0) Register (address = 02h) [reset = 24h]
        1. Table 30. MODE0 Register Field Descriptions
      4. 8.6.4  Mode 1 (MODE1) Register (address = 03h) [reset = 01h]
        1. Table 31. MODE1 Register Field Descriptions
      5. 8.6.5  Mode 2 (MODE2) Register (address = 04h) [reset = 00h]
        1. Table 32. MODE2 Register Field Descriptions
      6. 8.6.6  Mode 3 (MODE3) Register (address = 05h) [reset = 00h]
        1. Table 33. MODE3 Register Field Descriptions
      7. 8.6.7  Reference Configuration (REF) Register (address = 06h) [reset = 05h]
        1. Table 34. REF Register Field Descriptions
      8. 8.6.8  Offset Calibration (OFCALx) Registers (address = 07h, 08h, 09h) [reset = 00h, 00h, 00h]
        1. Table 35. OFCAL0, OFCAL1, OFCAL2 Registers Field Description
      9. 8.6.9  Full-Scale Calibration (FSCALx) Registers (address = 0Ah, 0Bh, 0Ch) [reset = 00h, 00h, 40h]
        1. Table 36. FSCAL0, FSCAL1, FSCAL2 Registers Field Description
      10. 8.6.10 Reserved (RESERVED) Register (address = 0Dh) [reset = FFh]
        1. Table 37. RESERVED Register Field Descriptions
      11. 8.6.11 Reserved (RESERVED) Register (address = 0Eh) [reset = 00h]
        1. Table 38. RESERVED Register Field Descriptions
      12. 8.6.12 Reserved (RESERVED) Register (address = 0Fh) [reset = 00h]
        1. Table 39. RESERVED Register Field Descriptions
      13. 8.6.13 PGA Configuration (PGA) Register (address = 10h) [reset = 00h]
        1. Table 40. PGA Register Field Descriptions
      14. 8.6.14 Input Multiplexer (INPMUX) Register (address = 11h) [reset = FFh]
        1. Table 41. INPMUX Register Field Descriptions
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Input Range
      2. 9.1.2 Input Overload
      3. 9.1.3 Unused Inputs and Outputs
      4. 9.1.4 Multiplexed 2-Bridge Input Example
      5. 9.1.5 AC-Bridge Excitation Example
      6. 9.1.6 Serial Interface and Digital Connections
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Initialization Setup
  10. 10Power Supply Recommendations
    1. 10.1 Power-Supply Decoupling
    2. 10.2 Analog Power-Supply Clamp
    3. 10.3 Power-Supply Sequencing
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Receiving Notification of Documentation Updates
    3. 12.3 Community Resources
    4. 12.4 Trademarks
    5. 12.5 Electrostatic Discharge Caution
    6. 12.6 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.5 Electrical Characteristics

minimum and maximum specifications apply from TA = –40°C to +125°C; typical specifications are at TA = 25°C; all specifications at AVDD = 5 V, AVSS = 0 V, DVDD = 3.3 V, VREF = 5 V, fCLK = 7.3728 MHz, PGA mode, gain = 1, and data rate = 20 SPS (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ANALOG INPUTS
Absolute input current PGA mode, V(AINx) = 2.5 V 4 12 nA
PGA bypass 200
Absolute input current drift 0.01 nA/°C
Differential input current PGA mode, VIN = 39 mV ±0.1 nA
PGA mode, VIN = 2.5 V –8 ±1 8
PGA and chop modes, VIN = 2.5 V(5) ±5
PGA bypass, VIN = 2.5 V ±40
Differential input current drift 0.05 nA/°C
Differential input impedance PGA mode 1 GΩ
PGA bypass 50 MΩ
Crosstalk 0.1 µV/V
PGA
Gain settings 1, 64, 128 V/V
Antialias filter frequency CCAPP, CAPN = 4.7 nF 60 kHz
Output voltage monitor Low threshold AVSS + 0.2 V
High threshold AVDD – 0.2
PERFORMANCE
Resolution No missing codes 24 Bits
Equivalent input noise density Gain = 64 and 128 8 nV/√Hz
DR Data rate 2.5 7200 SPS
Noise performance See Table 1
INL Integral non-linearity Gain = 1, 64 and 128 –10 ±2 10 ppmFSR
VOS Offset voltage TA = 25°C, gain = 1 –355 ±50 355 µV
TA = 25°C, gain = 64 and 128 –10 ±1.5 10
TA = 25°C, gain = 1, chop mode –0.6 ±0.2 0.6
TA = 25°C, gain = 64 and 128, chop mode –0.06 ±0.005 0.06
After calibration On the level of noise
Offset voltage drift Gain = 1 150 350 nV/°C
Gain = 64 and 128 15 75
Gain = 1, 64, and 128, chop mode 1 5
GE Gain error TA = 25°C –0.6% ±0.05% 0.6%
After calibration on the level of noise
Gain drift 0.5 4 ppm/°C
NMRR Normal-mode rejection ratio(1) See Table 5
CMRR Common-mode rejection ratio(2) Data rate = 20 SPS 130 dB
Data rate = 400 SPS 105 115
PSRR Power-supply rejection ratio(3) AVDD and AVSS 85 100 dB
DVDD 95 120
INTERNAL OSCILLATOR
fCLK Frequency 7.3728 MHz
Accuracy –2% ±0.5% 2%
VOLTAGE REFERENCE INPUTS
Reference input current 500 nA
Input current vs voltage 100 nA/V
Input current drift 0.1 nA//V/°C
Input impedance Differential 5 MΩ
Low voltage monitor Threshold low 0.4 0.6 V
TEMPERATURE SENSOR
Sensor voltage TA = 25°C 122.4 mV
Temperature coefficient 420 µV/°C
GENERAL-PURPOSE INPUTS/OUTPUTS (GPIOs)(6)
VOL Low-level output voltage IOL = –1 mA 0.2 · AVDD V
VOH High-level output voltage IOH = 1 mA 0.8 · AVDD V
VIL Low-level input voltage 0.3 · AVDD V
VIH High-level input voltage 0.7 · AVDD V
Input hysteresis 0.5 V
DIGITAL INPUTS/OUTPUTS (Other Than GPIOs)
VOL Low-level output voltage IOL = –1 mA 0.2 · DVDD V
IOL = –8 mA 0.2 · DVDD
VOH High-level output voltage IOH = 1 mA 0.8 · DVDD V
IOH = 8 mA 0.75 · DVDD
VIL Low-level input voltage 0.3 · DVDD V
VIH High-level input voltage 0.7 · DVDD V
Input hysteresis 0.1 V
Input leakage VIH or VIL –10 10 µA
POWER SUPPLY
IAVDD
IAVSS 		Analog supply current PGA bypass 2.7 4.5 mA
PGA mode, gain = 64 and 128 4.3 6.5
Power-down mode 2 8 µA
IDVDD Digital supply current 0.4 0.7 mA
Power-down mode(4) 30 75 µA
PD Power dissipation PGA mode, gain = 64 and 128 23 35 mW
Power-down mode 0.1 0.3
(1) Normal-mode rejection ratio performance depends on the digital filter configuration.
(2) Common-mode rejection ratio is specified at fIN = 60 Hz.
(3) Power-supply rejection ratio specified at dc.
(4) CLKIN input stopped.
(5) Chop-mode input current scales with data rate. See Figure 27 for chop mode input current at 20 SPS and 1200 SPS.
(6) GPIO voltage with respect to AVSS.