SBAS660C August   2016  – June 2017 ADS124S06 , ADS124S08

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Family Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Characteristics
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Multiplexer
      2. 9.3.2  Low-Noise Programmable Gain Amplifier
        1. 9.3.2.1 PGA Input-Voltage Requirements
        2. 9.3.2.2 PGA Rail Flags
        3. 9.3.2.3 Bypassing the PGA
      3. 9.3.3  Voltage Reference
        1. 9.3.3.1 Internal Reference
        2. 9.3.3.2 External Reference
        3. 9.3.3.3 Reference Buffers
      4. 9.3.4  Clock Source
      5. 9.3.5  Delta-Sigma Modulator
      6. 9.3.6  Digital Filter
        1. 9.3.6.1 Low-Latency Filter
          1. 9.3.6.1.1 Low-Latency Filter Frequency Response
          2. 9.3.6.1.2 Data Conversion Time for the Low-Latency Filter
        2. 9.3.6.2 Sinc3 Filter
          1. 9.3.6.2.1 Sinc3 Filter Frequency Response
          2. 9.3.6.2.2 Data Conversion Time for the Sinc3 Filter
        3. 9.3.6.3 Note on Conversion Time
        4. 9.3.6.4 50-Hz and 60-Hz Line Cycle Rejection
        5. 9.3.6.5 Global Chop Mode
      7. 9.3.7  Excitation Current Sources (IDACs)
      8. 9.3.8  Bias Voltage Generation
      9. 9.3.9  System Monitor
        1. 9.3.9.1 Internal Temperature Sensor
        2. 9.3.9.2 Power Supply Monitors
        3. 9.3.9.3 Burn-Out Current Sources
      10. 9.3.10 Status Register
        1. 9.3.10.1 POR Flag
        2. 9.3.10.2 RDY Flag
        3. 9.3.10.3 PGA Output Voltage Rail Monitors
        4. 9.3.10.4 Reference Monitor
      11. 9.3.11 General-Purpose Inputs and Outputs (GPIOs)
      12. 9.3.12 Low-Side Power Switch
      13. 9.3.13 Cyclic Redundancy Check (CRC)
      14. 9.3.14 Calibration
        1. 9.3.14.1 Offset Calibration
        2. 9.3.14.2 Gain Calibration
    4. 9.4 Device Functional Modes
      1. 9.4.1 Reset
        1. 9.4.1.1 Power-On Reset
        2. 9.4.1.2 RESET Pin
        3. 9.4.1.3 Reset by Command
      2. 9.4.2 Power-Down Mode
      3. 9.4.3 Standby Mode
      4. 9.4.4 Conversion Modes
        1. 9.4.4.1 Continuous Conversion Mode
        2. 9.4.4.2 Single-Shot Conversion Mode
        3. 9.4.4.3 Programmable Conversion Delay
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Chip Select (CS)
        2. 9.5.1.2 Serial Clock (SCLK)
        3. 9.5.1.3 Serial Data Input (DIN)
        4. 9.5.1.4 Serial Data Output and Data Ready (DOUT/DRDY)
        5. 9.5.1.5 Data Ready (DRDY)
        6. 9.5.1.6 Timeout
      2. 9.5.2 Data Format
      3. 9.5.3 Commands
        1. 9.5.3.1  NOP
        2. 9.5.3.2  WAKEUP
        3. 9.5.3.3  POWERDOWN
        4. 9.5.3.4  RESET
        5. 9.5.3.5  START
        6. 9.5.3.6  STOP
        7. 9.5.3.7  SYOCAL
        8. 9.5.3.8  SYGCAL
        9. 9.5.3.9  SFOCAL
        10. 9.5.3.10 RDATA
        11. 9.5.3.11 RREG
        12. 9.5.3.12 WREG
      4. 9.5.4 Reading Data
        1. 9.5.4.1 Read Data Direct
        2. 9.5.4.2 Read Data by RDATA Command
        3. 9.5.4.3 Sending Commands When Reading Data
      5. 9.5.5 Interfacing with Multiple Devices
    6. 9.6 Register Map
      1. 9.6.1 Configuration Registers
        1. 9.6.1.1  Device ID Register (address = 00h) [reset = xxh]
          1. Table 26. Device ID (ID) Register Field Descriptions
        2. 9.6.1.2  Device Status Register (address = 01h) [reset = 80h]
          1. Table 27. Device Status (STATUS) Register Field Descriptions
        3. 9.6.1.3  Input Multiplexer Register (address = 02h) [reset = 01h]
          1. Table 28. Input Multiplexer (INPMUX) Register Field Descriptions
        4. 9.6.1.4  Gain Setting Register (address = 03h) [reset = 00h]
          1. Table 29. Gain Setting (PGA) Register Field Descriptions
        5. 9.6.1.5  Data Rate Register (address = 04h) [reset = 14h]
          1. Table 30. Data Rate (DATARATE) Register Field Descriptions
        6. 9.6.1.6  Reference Control Register (address = 05h) [reset = 10h]
          1. Table 31. Reference Control (REF) Register Field Descriptions
        7. 9.6.1.7  Excitation Current Register 1 (address = 06h) [reset = 00h]
          1. Table 32. Excitation Current Register 1 (IDACMAG) Register Field Descriptions
        8. 9.6.1.8  Excitation Current Register 2 (address = 07h) [reset = FFh]
          1. Table 33. Excitation Current Register 2 (IDACMUX) Register Field Descriptions
        9. 9.6.1.9  Sensor Biasing Register (address = 08h) [reset = 00h]
          1. Table 34. Sensor Biasing (VBIAS) Register Field Descriptions
        10. 9.6.1.10 System Control Register (address = 09h) [reset = 10h]
          1. Table 35. System Control (SYS) Register Field Descriptions
        11. 9.6.1.11 Offset Calibration Register 1 (address = 0Ah) [reset = 00h]
          1. Table 36. Offset Calibration Register 1 (OFCAL0) Register Field Descriptions
        12. 9.6.1.12 Offset Calibration Register 2 (address = 0Bh) [reset = 00h]
          1. Table 37. Offset Calibration Register 2 (OFCAL1) Register Field Descriptions
        13. 9.6.1.13 Offset Calibration Register 3 (address = 0Ch) [reset = 00h]
          1. Table 38. Offset Calibration Register 3 (OFCAL2) Register Field Descriptions
        14. 9.6.1.14 Gain Calibration Register 1 (address = 0Dh) [reset = 00h]
          1. Table 39. Gain Calibration Register 1 (FSCAL0) Register Field Descriptions
        15. 9.6.1.15 Gain Calibration Register 2 (address = 0Eh) [reset = 00h]
          1. Table 40. Gain Calibration Register 2 (FSCAL1) Field Descriptions
        16. 9.6.1.16 Gain Calibration Register 3 (address = 0Fh) [reset = 40h]
          1. Table 41. Gain Calibration Register 3 (FSCAL2) Field Descriptions
        17. 9.6.1.17 GPIO Data Register (address = 10h) [reset = 00h]
          1. Table 42. GPIO Data (GPIODAT) Register Field Descriptions
        18. 9.6.1.18 GPIO Configuration Register (address = 11h) [reset = 00h]
          1. Table 43. GPIO Configuration (GPIOCON) Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Serial Interface Connections
      2. 10.1.2 Analog Input Filtering
      3. 10.1.3 External Reference and Ratiometric Measurements
      4. 10.1.4 Establishing a Proper Input Voltage
      5. 10.1.5 Unused Inputs and Outputs
      6. 10.1.6 Pseudo Code Example
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
        1. 10.2.2.1 Register Settings
      3. 10.2.3 Application Curves
    3. 10.3 Do's and Don'ts
  11. 11Power Supply Recommendations
    1. 11.1 Power Supplies
    2. 11.2 Power-Supply Sequencing
    3. 11.3 Power-On Reset
    4. 11.4 Power-Supply Decoupling
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Related Links
    4. 13.4 Receiving Notification of Documentation Updates
    5. 13.5 Community Resources
    6. 13.6 Trademarks
    7. 13.7 Electrostatic Discharge Caution
    8. 13.8 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
  • PBS|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2.3 Application Curves

To test the accuracy of the acquisition circuit, a series of calibrated high-precision discrete resistors are used as an input to the system. Measurements are taken at TA = 25°C. Figure 114 displays the resistance measurement over an input span from 20 Ω to 400 Ω. Any offset error is generally attributed to the offset of the ADC, and the gain error can be attributed to the accuracy of the RREF resistor and the ADC. The RREF value is also calibrated to reduce the gain error contribution.

Precision temperature measurement applications are typically calibrated to remove the effects of gain and offset errors that generally dominate the total system error. The simplest calibration method is a linear, or two-point calibration that applies an equal and opposite gain and offset term to cancel the measured system gain and offset error. In this particular tested application, the gain and offset error was very small, and did not require additional calibration other than the self offset and gain calibration provided by the device. The resulting measured resistance error is shown in Figure 115.

The results in Figure 115 are converted to temperature accuracy by dividing the results by the RTD sensitivity (α) at the measured resistance. Over the full resistance input range, the maximum total measured error is ±0.00929 Ω. Equation 27 uses the measured resistance error and the RTD sensitivity at 0°C to calculate the measured temperature accuracy.

Equation 27. Error (°C) = Error (Ω) / α@0°C = ±0.00929 Ω / 0.39083 Ω / °C = ±0.024°C

Figure 116 displays the calculated temperature accuracy of the circuit assuming a linear RTD resistance to temperature response. This figure does not include any linearity compensation of the RTD.

ADS124S06 ADS124S08 ai_app_rtd_meas_curve1_sbas660.gif
Figure 114. ADC Output Code vs Equivalent RTD Resistance
ADS124S06 ADS124S08 ai_app_rtd_meas_curve3_sbas660.gif
Figure 116. Equivalent Temperature Error vs Equivalent RTD Resistance
ADS124S06 ADS124S08 ai_app_rtd_meas_curve2_sbas660.gif
Figure 115. Measured Resistance Error vs Equivalent RTD Resistance