SBAS790C October   2018  – June 2019 ADS125H02

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Functional Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Input Range
      2. 9.3.2 Analog Inputs
        1. 9.3.2.1 ESD Diodes
        2. 9.3.2.2 Input Multiplexer
          1. 9.3.2.2.1 Analog Inputs (AIN0, AIN1, AINCOM)
          2. 9.3.2.2.2 High-Voltage Power Supply Readback
          3. 9.3.2.2.3 Internal VCOM Connection (Default)
          4. 9.3.2.2.4 Temperature Sensor
      3. 9.3.3 Programmable Gain Amplifier (PGA)
        1. 9.3.3.1 PGA Operating Range
        2. 9.3.3.2 PGA Monitor
      4. 9.3.4 Reference Voltage
        1. 9.3.4.1 Internal Reference
        2. 9.3.4.2 External Reference
        3. 9.3.4.3 AVDD Power-Supply Reference
        4. 9.3.4.4 Reference Monitor
      5. 9.3.5 Current Sources (IDAC1 and IDAC2)
      6. 9.3.6 General-Purpose Inputs and Outputs (GPIOs)
      7. 9.3.7 ADC Modulator
      8. 9.3.8 Digital Filter
        1. 9.3.8.1 Sinc Filter Mode
          1. 9.3.8.1.1 Sinc Filter Frequency Response
        2. 9.3.8.2 FIR Filter
        3. 9.3.8.3 50-Hz and 60-Hz Normal Mode Rejection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Conversion Control
        1. 9.4.1.1 Continuous-Conversion Mode
        2. 9.4.1.2 Pulse-Conversion Mode
        3. 9.4.1.3 Conversion Latency
        4. 9.4.1.4 Start-Conversion Delay
      2. 9.4.2 Auto-Zero Mode
      3. 9.4.3 Clock Mode
      4. 9.4.4 Reset
        1. 9.4.4.1 Power-On Reset
        2. 9.4.4.2 Reset by Pin
        3. 9.4.4.3 Reset by Command
      5. 9.4.5 Calibration
        1. 9.4.5.1 Offset and Full-Scale Calibration
          1. 9.4.5.1.1 Offset Calibration Registers
          2. 9.4.5.1.2 Full-Scale Calibration Registers
        2. 9.4.5.2 Offset Calibration (OFSCAL)
        3. 9.4.5.3 Full-Scale Calibration (GANCAL)
        4. 9.4.5.4 Calibration Command Procedure
        5. 9.4.5.5 User Calibration Procedure
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Chip-Select Pins (CS1 and CS2)
        2. 9.5.1.2 Serial Clock (SCLK)
        3. 9.5.1.3 Data Input (DIN)
        4. 9.5.1.4 Data Output/Data Ready (DOUT/DRDY)
      2. 9.5.2 Data Ready (DRDY)
        1. 9.5.2.1 DRDY in Continuous-Conversion Mode
        2. 9.5.2.2 DRDY in Pulse-Conversion Mode
        3. 9.5.2.3 Data Ready by Software Polling
      3. 9.5.3 Conversion Data
        1. 9.5.3.1 Status Byte (STATUS0)
        2. 9.5.3.2 Conversion Data Format
      4. 9.5.4 Cyclic Redundancy Check (CRC)
      5. 9.5.5 Commands
        1. 9.5.5.1  General Command Format
        2. 9.5.5.2  NOP Command
        3. 9.5.5.3  RESET Command
        4. 9.5.5.4  START Command
        5. 9.5.5.5  STOP Command
        6. 9.5.5.6  RDATA Command
        7. 9.5.5.7  OFSCAL Command
        8. 9.5.5.8  GANCAL Command
        9. 9.5.5.9  RREG Command
        10. 9.5.5.10 WREG Command
        11. 9.5.5.11 LOCK Command
        12. 9.5.5.12 UNLOCK Command
    6. 9.6 Register Map
      1. 9.6.1  Device Identification (ID) Register (address = 00h) [reset = 6xh]
        1. Table 30. ID Register Field Descriptions
      2. 9.6.2  Main Status (STATUS0) Register (address = 01h) [reset = 01h]
        1. Table 31. STATUS0 Register Field Descriptions
      3. 9.6.3  Mode 0 (MODE0) Register (address = 02h) [reset = 24h]
        1. Table 32. MODE0 Register Field Descriptions
      4. 9.6.4  Mode 1 (MODE1) Register (address = 03h) [reset = 01h]
        1. Table 33. MODE1 Register Field Descriptions
      5. 9.6.5  Mode 2 (MODE2) Register (address = 04h) [reset = 00h]
        1. Table 34. MODE2 Register Field Descriptions
      6. 9.6.6  Mode 3 (MODE3) Register (address = 05h) [reset = 00h]
        1. Table 35. MODE3 Register Field Descriptions
      7. 9.6.7  Reference Configuration (REF) Register (address = 06h) [reset = 05h]
        1. Table 36. REF Register Field Descriptions
      8. 9.6.8  Offset Calibration (OFCALx) Registers (address = 07h, 08h, 09h) [reset = 00h, 00h, 00h]
        1. Table 37. OFCAL0, OFCAL1, OFCAL2 Registers Field Description
      9. 9.6.9  Full-Scale Calibration (FSCALx) Registers (address = 0Ah, 0Bh, 0Ch) [reset = 00h, 00h, 40h]
        1. Table 38. FSCAL0, FSCAL1, FSCAL2 Registers Field Description
      10. 9.6.10 Current Source Multiplexer (I_MUX) Register (address = 0Dh) [reset = FFh]
        1. Table 39. I_MUX Register Field Descriptions
      11. 9.6.11 Current Source Magnitude (I_MAG) Register (address = 0Eh) [reset = 00h]
        1. Table 40. I_MAG Register Field Descriptions
      12. 9.6.12 Reserved (RESERVED) Register (address = 0Fh) [reset = 00h]
        1. Table 41. RESERVED Register Field Descriptions
      13. 9.6.13 MODE4 (MODE4) Register (address = 10h) [reset = 50h]
        1. Table 42. MODE4 Register Field Descriptions
      14. 9.6.14 PGA Alarm (STATUS1) Register (address = 11h) [reset = xxh]
        1. Table 43. STATUS1 Register Field Descriptions
      15. 9.6.15 Status 2 (STATUS2) Register (address = 12h) [reset = 0xh]
        1. Table 44. STATUS2 Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input Range
      2. 10.1.2 Input Overload
        1. 10.1.2.1 Input Signal Rate of Change (dV/dt)
      3. 10.1.3 Unused Inputs and Outputs
    2. 10.2 Typical Applications
      1. 10.2.1 ±10-V Analog Input Module
        1. 10.2.1.1 Design Requirements
        2. 10.2.1.2 Detailed Design Procedure
        3. 10.2.1.3 Application Curves
      2. 10.2.2 Thermocouple Input With High Common-Mode Voltage
    3. 10.3 Initialization Setup
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Decoupling
    2. 11.2 Analog Power-Supply Clamp
    3. 11.3 Power-Supply Sequencing
    4. 11.4 5-V to ±15-V DC-DC Converter
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Community Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

minimum and maximum specifications apply from TA = –40°C to +125°C; typical specifications are at TA = 25°C; all specifications are at HV_AVDD = 15 V, HV_AVSS = –15 V, AVDD = 5 V, DVDD = 3.3 V, VREF = 2.5 V, fCLK = 7.3728 MHz, data rate = 20 SPS, and gain = 1 (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ANALOG INPUTS
Absolute input current V(AINx) = 0 V, TA ≤ 105°C –15 ±0.5 15 nA
Absolute input current drift 20 pA/°C
Differential input current VIN = 2.5 V ±0.1 nA
VIN = 2.5 V, auto-zero mode(4) ±2 nA/V
Differential input current drift VIN = 2.5 V 10 pA/°C
Differential input impedance 1 20 GΩ
Crosstalk 0.1 µV/V
PGA
Gain 0.125, 0.1875, 0.25, 0.5, 1, 2, 4, 8, 16, 32, 64,128 V/V
Antialias filter frequency 230 kHz
PERFORMANCE
Resolution No missing codes 24 Bits
Data rate 2.5 40000 SPS
en Noise performance See Table 1 and Table 2
Effective resolution See Figure 52 and Figure 53
INL Integral nonlinearity Gain = 0.125 to 32 2 10 ppmFSR
Gain = 64, 128 4 12
VOS Offset voltage(7) TA = 25°C –30 – 300 / Gain ±10 + 100 / Gain 30 + 300 / Gain µV
TA = 25°C, auto-zero mode –0.5 – 0.5 / Gain ±0.5 / Gain 0.5 + 0.5 / Gain
Offset voltage drift Gain = 0.125 to 8 150 / Gain 700 / Gain nV/°C
Gain = 16 to 128 10 50
Auto-zero mode 5 / Gain
GE Gain error(7) TA = 25°C, all gains –0.7% ±0.1% 0.7%
Gain drift All gains 1 4 ppm/°C
NMRR Normal-mode rejection ratio(1) See Table 7
CMRR Common-mode rejection ratio(2) Data rate = 20 SPS 130 dB
Data rate = 400 SPS 90 105
PSRR Power-supply rejection ratio(3) HV_AVDD, HV_AVSS 2 20 µV/V
AVDD 20 60
DVDD 5 30
VOLTAGE REFERENCE INPUTS
Absolute input current ±250 nA
Input current vs reference voltage 15 nA/V
Input current drift 0.2 nA/°C
Input impedance Differential 30 MΩ
INTERNAL VOLTAGE REFERENCE(6)
Voltage 2.5 V
Initial error TA = 25°C –0.2% ±0.1% 0.2%
Temperature drift TA = 0°C to 85°C 3 10 ppm/°C
TA = –40°C to 125°C 7 20
Thermal hysteresis First 0°C to 105°C cycle 70 ppm
Second 0°C to 105°C cycle 25
Output current –10 10 mA
Load regulation 20 µV/mA
Start-up time Settling to ±0.001% final value 100 ms
TEMPERATURE SENSOR
Voltage TA = 25°C 120 mV
Temperature coefficient 390 µV/°C
EXCITATION CURRENT SOURCES (IDACS)
Currents 50, 100, 250, 500, 750, 1000, 1500, 2000, 2500, 3000 µA
Compliance range All currents AGND AVDD – 1.1 V
Absolute error All currents –6% ±0.7% 6%
Relative error Equal values –1.5% ±0.1% 1.5%
Unequal values ±1%
Temperature drift Absolute 100 ppm/°C
Equal values, I ≤ 750 µA 5 25
PGA MONITORS(5)
Input and output low threshold HV_AVSS + 2 V
Input and output high threshold HV_AVDD – 2 V
REFERENCE MONITOR
Low voltage threshold 0.4 0.6 V
INTERNAL OSCILLATOR
Accuracy Data rate < 40000 SPS –2.5% ±0.5% 2.5%
Data rate = 40000 SPS –3.5% ±0.5% 3.5%
GENERAL-PURPOSE INPUTS/OUTPUTS (GPIOs)
VOH High-level output voltage IOH = 1 mA 0.8 × AVDD V
VOL Low-level output voltage IOL = –1 mA 0.2 × AVDD V
VIH High-level input voltage 0.7 × AVDD AVDD V
VIL Low-level input voltage 0.3 × AVDD V
Input hysteresis 0.5 V
DIGITAL INPUTS/OUTPUTS (OTHER THAN GPIOs)
VOH High-level output voltage IOH = 1 mA 0.8 × DVDD V
IOH = 8 mA 0.75 × DVDD
VOL Low-level output voltage IOL = –1 mA 0.2 × DVDD V
IOL = –8 mA 0.2 × DVDD
VIH High-level input voltage 0.7 × DVDD DVDD V
VIL Low-level input voltage 0.3 × DVDD V
Input hysteresis 0.1 V
Input leakage –10 10 µA
POWER SUPPLY
IHV_AVDD
IHV_AVSS 		HV_AVDD, HV_AVSS supply current 1.1 1.8 mA
IAVDD AVDD supply current 2.8 4.6 mA
Additional AVDD supply current Voltage reference enabled 0.2 mA
When data rate = 40000 SPS 0.8
Current sources enabled As programmed µA
IDVDD DVDD supply current Internal oscillator active 0.5 0.7 mA
Data rate = 40000 SPS 0.7 1
PD Power dissipation 49 79 mW
(1) Normal-mode rejection ratio performance is dependent on the digital filter configuration.
(2) Common-mode rejection ratio is specified at 60 Hz.
(3) Power-supply rejection ratio is specified at dc.
(4) Auto-zero mode input current is proportional to the data rate.
(5) See the PGA Monitor section for details.
(6) Voltage reference specifications apply after the device is soldered on the PCB using the recommended PCB layout pattern and using the reflow profile per JEDEC standard J-STD-020D1.
(7) Offset and gain errors are reduced to the level of noise by calibration.