SBAS760C March   2018  – January 2019 ADS1260 , ADS1261

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Block Diagram
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
    1.     Pin Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Noise Performance
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  Analog Inputs
        1. 9.3.1.1 ESD Diodes
        2. 9.3.1.2 Input Multiplexer
        3. 9.3.1.3 Temperature Sensor
        4. 9.3.1.4 Power-Supply Readback
        5. 9.3.1.5 Inputs Open
        6. 9.3.1.6 Internal VCOM Connection
        7. 9.3.1.7 Alternate Functions
      2. 9.3.2  PGA
        1. 9.3.2.1 PGA Bypass Mode
        2. 9.3.2.2 PGA Voltage Monitor
      3. 9.3.3  Reference Voltage
        1. 9.3.3.1 Internal Reference
        2. 9.3.3.2 External Reference
        3. 9.3.3.3 AVDD - AVSS Reference (Default)
        4. 9.3.3.4 Reference Monitor
      4. 9.3.4  Level-Shift Voltage (VBIAS)
      5. 9.3.5  Burn-Out Current Sources
      6. 9.3.6  Sensor-Excitation Current Sources (IDAC1 and IDAC2)
      7. 9.3.7  General-Purpose Input/Outputs (GPIOs)
      8. 9.3.8  Oversampling
      9. 9.3.9  Modulator
      10. 9.3.10 Digital Filter
        1. 9.3.10.1 Sinc Filter
          1. 9.3.10.1.1 Sinc Filter Frequency Response
        2. 9.3.10.2 FIR Filter
          1. 9.3.10.2.1 FIR Filter Frequency Response
        3. 9.3.10.3 Filter Bandwidth
        4. 9.3.10.4 50-Hz and 60-Hz Normal Mode Rejection
    4. 9.4 Device Functional Modes
      1. 9.4.1 Conversion Control
        1. 9.4.1.1 Continuous-Conversion Mode
        2. 9.4.1.2 Pulse-Conversion Mode
        3. 9.4.1.3 Conversion Latency
        4. 9.4.1.4 Start-Conversion Delay
      2. 9.4.2 Chop Mode
      3. 9.4.3 AC-Excitation Mode
      4. 9.4.4 ADC Clock Mode
      5. 9.4.5 Power-Down Mode
        1. 9.4.5.1 Hardware Power-Down
        2. 9.4.5.2 Software Power-Down
      6. 9.4.6 Reset
        1. 9.4.6.1 Power-on Reset
        2. 9.4.6.2 Reset by Pin
        3. 9.4.6.3 Reset by Command
      7. 9.4.7 Calibration
        1. 9.4.7.1 Offset and Full-Scale Calibration
          1. 9.4.7.1.1 Offset Calibration Registers
          2. 9.4.7.1.2 Full-Scale Calibration Registers
        2. 9.4.7.2 Offset Self-Calibration (SFOCAL)
        3. 9.4.7.3 Offset System-Calibration (SYOCAL)
        4. 9.4.7.4 Full-Scale Calibration (GANCAL)
        5. 9.4.7.5 Calibration Command Procedure
        6. 9.4.7.6 User Calibration Procedure
    5. 9.5 Programming
      1. 9.5.1 Serial Interface
        1. 9.5.1.1 Chip Select (CS)
        2. 9.5.1.2 Serial Clock (SCLK)
        3. 9.5.1.3 Data Input (DIN)
        4. 9.5.1.4 Data Output/Data Ready (DOUT/DRDY)
        5. 9.5.1.5 Serial Interface Auto-Reset
      2. 9.5.2 Data Ready (DRDY)
        1. 9.5.2.1 DRDY in Continuous-Conversion Mode
        2. 9.5.2.2 DRDY in Pulse-Conversion Mode
        3. 9.5.2.3 Data Ready by Software Polling
      3. 9.5.3 Conversion Data
        1. 9.5.3.1 Status byte (STATUS)
        2. 9.5.3.2 Conversion Data Format
      4. 9.5.4 CRC
      5. 9.5.5 Commands
        1. 9.5.5.1  NOP Command
        2. 9.5.5.2  RESET Command
        3. 9.5.5.3  START Command
        4. 9.5.5.4  STOP Command
        5. 9.5.5.5  RDATA Command
        6. 9.5.5.6  SYOCAL Command
        7. 9.5.5.7  GANCAL Command
        8. 9.5.5.8  SFOCAL Command
        9. 9.5.5.9  RREG Command
        10. 9.5.5.10 WREG Command
        11. 9.5.5.11 LOCK Command
        12. 9.5.5.12 UNLOCK Command
    6. 9.6 Register Map
      1. 9.6.1  Device Identification (ID) Register (address = 00h) [reset = xxh]
        1. Table 30. ID Register Field Descriptions
      2. 9.6.2  Device Status (STATUS) Register (address = 01h) [reset = 01h]
        1. Table 31. STATUS Register Field Descriptions
      3. 9.6.3  Mode 0 (MODE0) Register (address = 02h) [reset = 24h]
        1. Table 32. MODE0 Register Field Descriptions
      4. 9.6.4  Mode 1 (MODE1) Register (address = 03h) [reset = 01h]
        1. Table 33. MODE1 Register Field Descriptions
      5. 9.6.5  Mode 2 (MODE2) Register (address = 04h) [reset = 00h]
        1. Table 34. MODE2 Register Field Descriptions
      6. 9.6.6  Mode 3 (MODE3) Register (address = 05h) [reset = 00h]
        1. Table 35. MODE3 Register Field Descriptions
      7. 9.6.7  Reference Configuration (REF) Register (address = 06h) [reset = 05h]
        1. Table 36. REF Register Field Descriptions
      8. 9.6.8  Offset Calibration (OFCALx) Registers (address = 07h, 08h, 09h) [reset = 00h, 00h, 00h]
        1. Table 37. OFCAL0, OFCAL1, OFCAL2 Registers Field Description
      9. 9.6.9  Full-Scale Calibration (FSCALx) Registers (address = 0Ah, 0Bh, 0Ch) [reset = 00h, 00h, 40h]
        1. Table 38. FSCAL0, FSCAL1, FSCAL2 Registers Field Description
      10. 9.6.10 IDAC Multiplexer (IMUX) Register (address = 0Dh) [reset = FFh]
        1. Table 39. IMUX Register Field Descriptions
      11. 9.6.11 IDAC Magnitude (IMAG) Register (address = 0Eh) [reset = 00h]
        1. Table 40. IMAG Register Field Descriptions
      12. 9.6.12 Reserved (RESERVED) Register (address = 0Fh) [reset = 00h]
        1. Table 41. RESERVED Register Field Descriptions
      13. 9.6.13 PGA Configuration (PGA) Register (address = 10h) [reset = 00h]
        1. Table 42. PGA Register Field Descriptions
      14. 9.6.14 Input Multiplexer (INPMUX) Register (address = 11h) [reset = FFh]
        1. Table 43. INPMUX Register Field Descriptions
      15. 9.6.15 Input Bias (INPBIAS) Register (address = 12h) [reset = 00h]
        1. Table 44. INPBIAS Register Field Descriptions
  10. 10Application and Implementation
    1. 10.1 Application Information
      1. 10.1.1 Input Range
      2. 10.1.2 Input Overload
      3. 10.1.3 Burn-out Current Source
      4. 10.1.4 Unused Inputs and Outputs
      5. 10.1.5 AC-Excitation
      6. 10.1.6 Serial Interface and Digital Connections
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curves
    3. 10.3 Initialization Setup
  11. 11Power Supply Recommendations
    1. 11.1 Power-Supply Decoupling
    2. 11.2 Analog Power-Supply Clamp
    3. 11.3 Power-Supply Sequencing
  12. 12Layout
    1. 12.1 Layout Guidelines
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RHB|32
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10.2.1 Design Requirements

The key considerations in the design of a 3-wire RTD circuit are the accuracy, stability and noise of the measurement, accuracy of the lead-wire compensation and self-heating of the sensor. Stability of the measurement is determined by the offset and gain drift of the ADC and by the drift of the external reference resistor. Measurement noise is determined by the ADC sample rate and by the digital filter settings. These parameters are not summarized here. Table 45 summarizes the basic design goals for a 3-wire Pt100 RTD.

Table 45. Design Goals

DESIGN PARAMETER VALUE
RTD sensor type 3-wire Pt100
RTD resistance range 20 Ω to 400 Ω
RTD lead resistance range 0 Ω to 10 Ω
RTD self heating < 1 mW

Table 46 summarize the parameters of the detailed design procedure that follows.

Table 46. Design Parameters

DESIGN PARAMETER DESIGN VALUE
IIDAC IDAC current 500 µA
PRTD RTD power dissipation 0.1 mW
VRTD RTD input voltage 0.20 V
Gain ADC gain 8
VREF Reference voltage (design target allows for 10% overrange) 1.76 V
RREF Reference resistor (senses the IDAC current to generate VREF) 3.52 kΩ
RBIAS Bias resistor (provides the RTD level-shift voltage) 1.10 kΩ
VRTDN RTD negative input voltage 1.1 V
VRTDP RTD positive input voltage 1.31 V
VIDAC1 IDAC1 loop voltage 3.37 V