SBAS946C April   2021  – September 2022 ADS127L11

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Timing Requirements (1.65 V ≤ IOVDD ≤ 2 V)
    7. 6.7  Switching Characteristics (1.65 V ≤ IOVDD ≤ 2 V)
    8. 6.8  Timing Requirements (2 V < IOVDD ≤ 5.5 V)
    9. 6.9  Switching Characteristics (2 V < IOVDD ≤ 5.5 V)
    10. 6.10 Timing Diagrams
    11. 6.11 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1  Offset Error Measurement
    2. 7.2  Offset Drift Measurement
    3. 7.3  Gain Error Measurement
    4. 7.4  Gain Drift Measurement
    5. 7.5  NMRR Measurement
    6. 7.6  CMRR Measurement
    7. 7.7  PSRR Measurement
    8. 7.8  SNR Measurement
    9. 7.9  INL Error Measurement
    10. 7.10 THD Measurement
    11. 7.11 SFDR Measurement
    12. 7.12 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input (AINP, AINN)
        1. 8.3.1.1 Input Range
      2. 8.3.2 Reference Voltage (REFP, REFN)
        1. 8.3.2.1 Reference Voltage Range
      3. 8.3.3 Clock Operation
        1. 8.3.3.1 Internal Oscillator
        2. 8.3.3.2 External Clock
      4. 8.3.4 Modulator
      5. 8.3.5 Digital Filter
        1. 8.3.5.1 Wideband Filter
        2. 8.3.5.2 Low-Latency Filter (Sinc)
          1. 8.3.5.2.1 Sinc4 Filter
          2. 8.3.5.2.2 Sinc4 + Sinc1 Filter
          3. 8.3.5.2.3 Sinc3 Filter
          4. 8.3.5.2.4 Sinc3 + Sinc1 Filter
      6. 8.3.6 Power Supplies
        1. 8.3.6.1 AVDD1 and AVSS
        2. 8.3.6.2 AVDD2
        3. 8.3.6.3 IOVDD
        4. 8.3.6.4 Power-On Reset (POR)
        5. 8.3.6.5 CAPA and CAPD
      7. 8.3.7 VCM Output Voltage
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Scalable Speed Modes
      2. 8.4.2 Idle Mode
      3. 8.4.3 Standby Mode
      4. 8.4.4 Power-Down Mode
      5. 8.4.5 Reset
        1. 8.4.5.1 RESET Pin
        2. 8.4.5.2 Reset by SPI Register Write
        3. 8.4.5.3 Reset by SPI Input Pattern
      6. 8.4.6 Synchronization
        1. 8.4.6.1 Synchronized Control Mode
        2. 8.4.6.2 Start/Stop Control Mode
        3. 8.4.6.3 One-Shot Control Mode
      7. 8.4.7 Conversion-Start Delay Time
      8. 8.4.8 Calibration
        1. 8.4.8.1 OFFSET2, OFFSET1, OFFSET0 Calibration Registers (Addresses 9h, Ah, Bh)
        2. 8.4.8.2 GAIN2, GAIN1, GAIN0 Calibration Registers (Addresses 0Ch, 0Dh, 0Eh)
        3. 8.4.8.3 Calibration Procedure
    5. 8.5 Programming
      1. 8.5.1 Serial Interface (SPI)
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Serial Data Input (SDI)
        4. 8.5.1.4 Serial Data Output/Data Ready (SDO/DRDY)
      2. 8.5.2 SPI Frame
      3. 8.5.3 SPI CRC
      4. 8.5.4 Register Map CRC
      5. 8.5.5 Full-Duplex Operation
      6. 8.5.6 Device Commands
        1. 8.5.6.1 No-Operation
        2. 8.5.6.2 Read Register Command
        3. 8.5.6.3 Write Register Command
      7. 8.5.7 Read Conversion Data
        1. 8.5.7.1 Conversion Data
        2. 8.5.7.2 Data Ready
          1. 8.5.7.2.1 DRDY
          2. 8.5.7.2.2 SDO/DRDY
          3. 8.5.7.2.3 DRDY Bit
          4. 8.5.7.2.4 Clock Counting
        3. 8.5.7.3 STATUS Header
      8. 8.5.8 Daisy-Chain Operation
      9. 8.5.9 3-Wire SPI Mode
        1. 8.5.9.1 3-Wire SPI Mode Frame Reset
    6. 8.6 Registers
      1. 8.6.1  DEV_ID Register (Address = 0h) [reset = 00h]
      2. 8.6.2  REV_ID Register (Address = 1h) [reset = xxh]
      3. 8.6.3  STATUS Register (Address = 2h) [reset = x1100xxxb]
      4. 8.6.4  CONTROL Register (Address = 3h) [reset = 00h]
      5. 8.6.5  MUX Register (Address = 4h) [reset = 00h]
      6. 8.6.6  CONFIG1 Register (Address = 5h) [reset = 00h]
      7. 8.6.7  CONFIG2 Register (Address = 6h) [reset = 00h]
      8. 8.6.8  CONFIG3 Register (Address = 7h) [reset = 00h]
      9. 8.6.9  CONFIG4 Register (Address = 8h) [reset = 00h]
      10. 8.6.10 OFFSET2, OFFSET1, OFFSET0 Registers (Addresses = 9h, Ah, Bh) [reset = 00h, 00h, 00h]
      11. 8.6.11 GAIN2, GAIN1, GAIN0 Registers (Addresses = Ch, Dh, Eh) [reset = 40h, 00h, 00h]
      12. 8.6.12 CRC Register (Address = Fh) [reset = 00h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 SPI Operation
      2. 9.1.2 Input Driver
      3. 9.1.3 Antialias Filter
      4. 9.1.4 Reference Voltage
      5. 9.1.5 Simultaneous-Sampling Systems
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Power supply voltage AVDD1 to AVSS –0.3 6.5 V
AVDD2 to AVSS –0.3 6.5
AVSS to DGND –3 0.3
IOVDD to DGND –0.3 6.5
IOVDD to AVSS 8.5
Analog input voltage AINP, AINN, REFP, REFN AVSS – 0.3 AVDD1 + 0.3 V
Analog output voltage CAPA AVSS 1.65 V
CAPD DGND 1.65
VCM AVSS AVDD1
Digital input/output voltage SDO/DRDY, DRDY, START DGND – 0.3 IOVDD + 0.3 V
CS, SCLK, SDI, RESET, CLK DGND – 0.3 6.5
Input current Continuous, any pin except power-supply pins(2) –10 10 mA
Temperature Junction, TJ 150 °C
Storage, Tstg –65 150
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If briefly operating outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not sustain damage, but it may not be fully functional – this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) Analog input pins AINP, AINN, REFP, and REFN are diode-clamped to AVDD1 and AVSS. Limit the input current to 10 mA in the event the analog input voltage exceeds AVDD1 + 0.3 V or AVSS – 0.3 V. Digital input pin START and digital output pins SDO/DRDY and DRDY are diode-clamped to IOVDD and DGND. Digital input pins CS, SCLK, SDI, RESET and CLK are diode-clamped to DGND. Limit the input current to 10 mA in the event the digital input voltage exceeds IOVDD + 0.3 V (for effected pins) or exceeds DGND – 0.3 V.