SBAS559A May   2022  – December 2022 ADS1285

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements: 1.65 V ≤ IOVDD ≤ 1.95 V and 2.7 V ≤ IOVDD ≤ 3.6 V
    7. 6.7 Switching Characteristics: 1.65V ≤ IOVDD ≤ 1.95V and 2.7 V ≤ IOVDD ≤ 3.6 V
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Performance
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Input
      2. 8.3.2 PGA and Buffer
        1. 8.3.2.1 Programmable Gain Amplifier (PGA)
        2. 8.3.2.2 Buffer Operation (PGA Bypass)
      3. 8.3.3 Voltage Reference Input
      4. 8.3.4 IOVDD Power Supply
      5. 8.3.5 Modulator
        1. 8.3.5.1 Modulator Overdrive
      6. 8.3.6 Digital Filter
        1. 8.3.6.1 Sinc Filter Section
        2. 8.3.6.2 FIR Filter Section
        3. 8.3.6.3 Group Delay and Step Response
          1. 8.3.6.3.1 Linear Phase Response
          2. 8.3.6.3.2 Minimum Phase Response
        4. 8.3.6.4 HPF Stage
      7. 8.3.7 Clock Input
      8. 8.3.8 GPIO
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power Modes
      2. 8.4.2 Power-Down Mode
      3. 8.4.3 Reset
      4. 8.4.4 Synchronization
        1. 8.4.4.1 Pulse-Sync Mode
        2. 8.4.4.2 Continuous-Sync Mode
      5. 8.4.5 Sample Rate Converter
      6. 8.4.6 Offset and Gain Calibration
        1. 8.4.6.1 OFFSET Register
        2. 8.4.6.2 GAIN Register
        3. 8.4.6.3 Calibration Procedure
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1 Chip Select (CS)
        2. 8.5.1.2 Serial Clock (SCLK)
        3. 8.5.1.3 Data Input (DIN)
        4. 8.5.1.4 Data Output (DOUT)
        5. 8.5.1.5 Data Ready (DRDY)
      2. 8.5.2 Conversion Data Format
      3. 8.5.3 Commands
        1. 8.5.3.1  Single Byte Command
        2. 8.5.3.2  WAKEUP: Wake Command
        3. 8.5.3.3  STANDBY: Software Power-Down Command
        4. 8.5.3.4  SYNC: Synchronize Command
        5. 8.5.3.5  RESET: Reset Command
        6. 8.5.3.6  Read Data Direct
        7. 8.5.3.7  RDATA: Read Conversion Data Command
        8. 8.5.3.8  RREG: Read Register Command
        9. 8.5.3.9  WREG: Write Register Command
        10. 8.5.3.10 OFSCAL: Offset Calibration Command
        11. 8.5.3.11 GANCAL: Gain Calibration Command
    6. 8.6 Register Map
      1. 8.6.1 Register Descriptions
        1. 8.6.1.1 ID/SYNC: Device ID, SYNC Register (Address = 00h) [Reset = xxxx0000b]
        2. 8.6.1.2 CONFIG0: Configuration Register 0 (Address = 01h) [Reset = 12h]
        3. 8.6.1.3 CONFIG1: Configuration Register 1 (Address = 02h) [Reset = 00h]
        4. 8.6.1.4 HPF0, HPF1: High-Pass Filter Registers (Address = 03h, 04h) [Reset = 32h, 03h]
        5. 8.6.1.5 OFFSET0, OFFSET1, OFFSET2: Offset Calibration Registers (Address = 05h, 06h, 07h) [Reset = 00h, 00h, 00h]
        6. 8.6.1.6 GAIN0, GAIN1, GAIN2: Gain Calibration Registers (Address = 08h, 09h, 0Ah) [Reset = 00h, 00h, 40h]
        7. 8.6.1.7 GPIO: Digital Input/Output Register (Address = 0Bh) [Reset = 000xx000b]
        8. 8.6.1.8 SRC0, SRC1: Sample Rate Converter Registers (Address = 0Ch, 0Dh) [Reset = 00h, 80h]
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Analog Power Supplies
      2. 9.3.2 Digital Power Supply
      3. 9.3.3 Grounds
      4. 9.3.4 Thermal Pad
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

Figure 5-1 RHB Package,32-Pin, 5-mm × 5-mm VQFN(Top View)
Table 5-1 Pin Functions
PIN FUNCTION DESCRIPTION
NO. NAME
1 AIN1P Analog input Channel 1 positive input
2 AIN1N Analog input Channel 1 negative input
3 AIN2P Analog input Channel 2 positive input
4 AIN2N Analog input Channel 2 negative input
5 CAPP Analog internal PGA positive capacitor. Connect a 10-nF C0G capacitor across CAPP and CAPN.
6 CAPN Analog internal PGA negative capacitor. Connect a 10-nF C0G capacitor across CAPP and CAPN.
7 CAPBP Analog internal Buffer positive capacitor. Connect a 47-nF C0G capacitor to AVSS.
8 CAPBN Analog internal Buffer negative capacitor. Connect a 47-nF C0G capacitor to AVSS.
9 CAPC Analog internal Charge-pump capacitor. Connect a 4.7-nF, minimum 10-V rated capacitor to AGND.
10 AVSS Analog supply PGA negative analog supply. See the Section 9.3.1 section for details.
11 AVDD1 Analog supply PGA positive analog supply. See the Section 9.3.1 section for details.
12 AVDD2 Analog supply Modulator analog supply. See the Section 9.3.1 section for details.
13 AGND Analog ground Analog ground
14 CAPI Analog internal Input bias capacitor. Connect a 100-nF ceramic capacitor to AGND.
15 GPIO0 Digital I/O General-purpose I/O
16 GPIO1 Digital I/O General-purpose I/O
17 CAPD Analog output Digital low-dropout regulator (LDO) output. Connect a 220-nF ceramic capacitor to DGND.
18 DGND Ground Digital ground
19 IOVDD Digital supply Digital I/O power supply. See the Section 8.3.4 section for details.
20 CLK Digital input ADC clock input
21 CS Digital input Serial interface select, active low
22 SCLK Digital input Serial interface clock
23 DIN Digital input Serial interface data in
24 DOUT Digital output Serial interface data out
25 DRDY Digital output Data ready, active low
26 SYNC Digital input ADC synchronization, active high
27 RESET Digital input ADC reset, active low
28 PWDN Digital input ADC power down, active low
29 REFN Analog input Negative reference input. See the Section 8.3.3 section for details.
30 REFP Analog input Positive reference input. See the Section 8.3.3 section for details.
31 CAPR Analog internal Reference bias capacitor. Connect a 100-nF ceramic capacitor to AVSS.
32 AVSS Analog supply PGA negative supply
Thermal pad Connect the thermal pad to AVSS. Thermal vias placed in the printed circuit board (PCB) land are optional for placement of bottom side components.