SBASAW0 February   2024 ADS1288

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements: 1.65V ≤ IOVDD ≤ 1.95V and 2.7V ≤ IOVDD ≤ 3.6V
    7. 5.7 Switching Characteristics: 1.65V ≤ IOVDD ≤ 1.95V and 2.7V ≤ IOVDD ≤ 3.6V
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. Parameter Measurement Information
    1. 6.1 Noise Performance
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Input
      2. 7.3.2 PGA and Buffer
        1. 7.3.2.1 Programmable Gain Amplifier (PGA)
        2. 7.3.2.2 Buffer Operation (PGA Bypass)
      3. 7.3.3 Voltage Reference Input
      4. 7.3.4 IOVDD Power Supply
      5. 7.3.5 Modulator
        1. 7.3.5.1 Modulator Overdrive
      6. 7.3.6 Digital Filter
        1. 7.3.6.1 Sinc Filter Section
        2. 7.3.6.2 FIR Filter Section
        3. 7.3.6.3 Group Delay and Step Response
          1. 7.3.6.3.1 Linear Phase Response
          2. 7.3.6.3.2 Minimum Phase Response
        4. 7.3.6.4 HPF Stage
      7. 7.3.7 Clock Input
      8. 7.3.8 GPIO
    4. 7.4 Device Functional Modes
      1. 7.4.1 Power-Down Mode
      2. 7.4.2 Reset
      3. 7.4.3 Synchronization
        1. 7.4.3.1 Pulse-Sync Mode
        2. 7.4.3.2 Continuous-Sync Mode
      4. 7.4.4 Sample Rate Converter
      5. 7.4.5 Offset and Gain Calibration
        1. 7.4.5.1 OFFSET Register
        2. 7.4.5.2 GAIN Register
        3. 7.4.5.3 Calibration Procedure
    5. 7.5 Programming
      1. 7.5.1 Serial Interface
        1. 7.5.1.1 Chip Select (CS)
        2. 7.5.1.2 Serial Clock (SCLK)
        3. 7.5.1.3 Data Input (DIN)
        4. 7.5.1.4 Data Output (DOUT)
        5. 7.5.1.5 Data Ready (DRDY)
      2. 7.5.2 Conversion Data Format
      3. 7.5.3 Commands
        1. 7.5.3.1  Single Byte Command
        2. 7.5.3.2  WAKEUP: Wake Command
        3. 7.5.3.3  STANDBY: Software Power-Down Command
        4. 7.5.3.4  SYNC: Synchronize Command
        5. 7.5.3.5  RESET: Reset Command
        6. 7.5.3.6  Read Data Direct
        7. 7.5.3.7  RDATA: Read Conversion Data Command
        8. 7.5.3.8  RREG: Read Register Command
        9. 7.5.3.9  WREG: Write Register Command
        10. 7.5.3.10 OFSCAL: Offset Calibration Command
        11. 7.5.3.11 GANCAL: Gain Calibration Command
  9. Register Map
    1. 8.1 Register Descriptions
      1. 8.1.1 ID/SYNC: Device ID, SYNC Register (Address = 00h) [Reset = xxxx0010b]
      2. 8.1.2 CONFIG0: Configuration Register 0 (Address = 01h) [Reset = 92h]
      3. 8.1.3 CONFIG1: Configuration Register 1 (Address = 02h) [Reset = 10h]
      4. 8.1.4 HPF0, HPF1: High-Pass Filter Registers (Address = 03h, 04h) [Reset = 32h, 03h]
      5. 8.1.5 OFFSET0, OFFSET1, OFFSET2: Offset Calibration Registers (Address = 05h, 06h, 07h) [Reset = 00h, 00h, 00h]
      6. 8.1.6 GAIN0, GAIN1, GAIN2: Gain Calibration Registers (Address = 08h, 09h, 0Ah) [Reset = 00h, 00h, 40h]
      7. 8.1.7 GPIO: Digital Input/Output Register (Address = 0Bh) [Reset = 000xx000b]
      8. 8.1.8 SRC0, SRC1: Sample Rate Converter Registers (Address = 0Ch, 0Dh) [Reset = 00h, 80h]
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
      1. 9.3.1 Analog Power Supplies
      2. 9.3.2 Digital Power Supply
      3. 9.3.3 Grounds
      4. 9.3.4 Thermal Pad
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Voltage Reference Input

The ADC requires a reference voltage for operation. The reference voltage input is differential, defined as the voltage between the REFP and REFN pins: VREF = VREFP – VREFN. Because of the differential input, route the VREFN trace to the voltage reference ground terminal to avoid ground noise pickup. Use a precision 2.5V voltage reference with low noise, optimally less than 2μVRMS over the measurement bandwidth.

Figure 7-8 shows the simplified reference input circuit. Similar to the analog inputs, the reference inputs are protected by ESD diodes. If the reference inputs are driven below AVSS – 0.3V or above AVDD1 + 0.3V, the protection diodes can conduct. If these conditions are possible, use external clamp diodes, series resistors, or both to limit the reference input current to the specified value.

GUID-20200825-CA0I-ZSDJ-MQGB-T6K6HNHGLXC9-low.gifFigure 7-8 Simplified Voltage Reference Input Circuit

The ADC samples the reference voltage by an internal capacitor (CREF) and then discharges the capacitor at the modulator sampling frequency (fMOD). The sampling operation results in transient current flow into the reference inputs. The transient current is filtered by a 0.1µF ceramic capacitor placed directly at the reference pins with a larger 10μF to 47μF capacitor at the voltage reference output. In applications where the voltage reference drives multiple ADCs, use 0.1µF capacitors at each ADC.

The external capacitors filter the current transients, resulting in 80μA/V average reference current. With VREF = 2.5V, the reference input current is 80μA / V × 2.5V = 200μA.