SBASAD3 November   2021 ADS130B02-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  7. 7 Parameter Measurement Information
    1. 7.1 Noise Measurements
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Input ESD Protection Circuitry
      2. 8.3.2 Input Multiplexer
      3. 8.3.3 Programmable Gain Amplifier (PGA)
      4. 8.3.4 Voltage Reference
      5. 8.3.5 Internal Test Signals
      6. 8.3.6 Clocking
        1. 8.3.6.1 External Clock Using CLKIN Pin
        2. 8.3.6.2 Internal Oscillator
      7. 8.3.7 ΔΣ Modulator
      8. 8.3.8 Digital Filter
        1. 8.3.8.1 Digital Filter Implementation
          1. 8.3.8.1.1 Fast-Settling Filter
          2. 8.3.8.1.2 SINC3 and SINC3 + SINC1 Filter
        2. 8.3.8.2 Digital Filter Characteristic
      9. 8.3.9 Register Map CRC
    4. 8.4 Device Functional Modes
      1. 8.4.1 Power-Up and Reset
        1. 8.4.1.1 Power-On Reset
        2. 8.4.1.2 SYNC/RESET Pin
        3. 8.4.1.3 RESET Command
      2. 8.4.2 Fast Start-Up Behavior
      3. 8.4.3 Conversion Modes
        1. 8.4.3.1 Continuous-Conversion Mode
        2. 8.4.3.2 Global-Chop Mode
      4. 8.4.4 Power Modes
      5. 8.4.5 Standby Mode
      6. 8.4.6 Synchronization
    5. 8.5 Programming
      1. 8.5.1 Serial Interface
        1. 8.5.1.1  Chip Select (CS)
        2. 8.5.1.2  Serial Data Clock (SCLK)
        3. 8.5.1.3  Serial Data Input (DIN)
        4. 8.5.1.4  Serial Data Output (DOUT)
        5. 8.5.1.5  Data Ready (DRDY)
        6. 8.5.1.6  SPI Communication Frames
        7. 8.5.1.7  SPI Communication Words
        8. 8.5.1.8  Short SPI Frames
        9. 8.5.1.9  Communication Cyclic Redundancy Check (CRC)
        10. 8.5.1.10 SPI Timeout
      2. 8.5.2 ADC Conversion Data Format
      3. 8.5.3 Commands
        1. 8.5.3.1 NULL (0000 0000 0000 0000)
        2. 8.5.3.2 RESET (0000 0000 0001 0001)
        3. 8.5.3.3 STANDBY (0000 0000 0010 0010)
        4. 8.5.3.4 WAKEUP (0000 0000 0011 0011)
        5. 8.5.3.5 LOCK (0000 0101 0101 0101)
        6. 8.5.3.6 UNLOCK (0000 0110 0110 0110)
        7. 8.5.3.7 RREG (101a aaaa annn nnnn)
          1. 8.5.3.7.1 Reading a Single Register
          2. 8.5.3.7.2 Reading Multiple Registers
        8. 8.5.3.8 WREG (011a aaaa annn nnnn)
      4. 8.5.4 Collecting Data for the First Time or After a Pause in Data Collection
    6. 8.6 Register Map
  9. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Troubleshooting
      2. 9.1.2 Unused Inputs and Outputs
      3. 9.1.3 Antialias Filter
      4. 9.1.4 Minimum Interface Connections
      5. 9.1.5 Multiple Device Configuration
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Current Shunt Measurement
        2. 9.2.2.2 Battery Pack Voltage Measurement
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 CAP Pin Capacitor Requirement
    2. 10.2 Power-Supply Sequencing
    3. 10.3 Power-Supply Decoupling
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.6 Timing Requirements

over operating ambient temperature range, and DOUT load = 20 pF || 100 kΩ (unless otherwise noted)
MIN MAX UNIT
2.7 V ≤ DVDD ≤ 3.6 V
tw(CLL) Pulse duration, CLKIN low 49 ns
tw(CLH) Pulse duration, CLKIN high 49 ns
tc(SC) SCLK period 40 ns
tw(SCL) Pulse duration, SCLK low 20 ns
tw(SCH) Pulse duration, SCLK high 20 ns
tw(CSH) Pulse duration, CS high 15 ns
td(CSSC) Delay time, first SCLK rising edge after CS falling edge 16 ns
td(SCCS) Delay time, CS rising edge after final SCLK falling edge 10 ns
tsu(DI) Setup time, DIN valid before SCLK falling edge 5 ns
th(DI) Hold time, DIN valid after SCLK falling edge 8 ns
tsu(SY) Setup time, SYNC/RESET valid before CLKIN rising edge 10 ns
tw(SYL) Pulse duration, SYNC/RESET low for synchronization 1 2047 tMCLK
tw(RSL) Pulse duration, SYNC/RESET low to generate device reset 2048 tMCLK